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公开(公告)号：US20180026421A1
公开(公告)日：2018-01-25
申请号：US15654136
申请日：2017-07-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jan Seidenfaden , Jan Marfeld , Hubert Schmid , Soenke Tautz , Roland Enzmann
Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.
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公开(公告)号：US09773776B2
公开(公告)日：2017-09-26
申请号：US15157853
申请日：2016-05-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Gärtner , Ales Markytan , Jan Marfeld
IPC: H01L27/02 , H05B33/08 , H01L27/15 , F21K9/60 , H01L25/16 , H01L33/30 , H01L33/32 , H01L33/50 , H01L33/56 , F21Y115/10
CPC classification number: H01L27/0248 , F21K9/60 , F21Y2115/10 , H01L25/167 , H01L27/156 , H01L33/30 , H01L33/32 , H01L33/502 , H01L33/56 , H05B33/0845 , H05B33/0857 , H05B33/089
Abstract: A lighting module for emitting mixed light comprises at least one first semiconductor element which emits unconverted red light, at least one second semiconductor element which emits converted greenish white light having a first conversion percentage, at least one third semiconductor element which emits greenish white light having a second conversion percentage that is smaller than the first conversion percentage, and at least one resistor element having a temperature-dependent electric resistance, the second semiconductor element being connected in parallel to the third semiconductor element.
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公开(公告)号：US09664342B2
公开(公告)日：2017-05-30
申请号：US14432007
申请日：2013-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Kaiser , Tony Albrecht , Michael Bestele , Jan Marfeld , Albert Schneider , Markus Kirsch
IPC: H01L31/0232 , F21K99/00 , G01J1/04 , G01J1/42 , H01L25/13 , H01L25/10 , F21V7/00 , F21V14/04 , F21Y105/00
CPC classification number: F21V14/04 , F21V7/0066 , G01J1/0414 , G01J1/42 , G01J1/4228 , H01L25/10 , H01L25/13 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.
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公开(公告)号：US10665747B2
公开(公告)日：2020-05-26
申请号：US15963408
申请日：2018-04-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L33/50 , H01L31/18 , H01L33/54 , H01L31/02
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
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公开(公告)号：US20180248074A1
公开(公告)日：2018-08-30
申请号：US15963408
申请日：2018-04-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
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Patent Agency Ranking
公开(公告)号：US09985171B2
公开(公告)日：2018-05-29
申请号：US15632544
申请日：2017-06-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/00 , H01L31/02 , H01L31/0232 , H01L31/18 , H01L33/62 , H01L33/60 , H01L33/50
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.
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公开(公告)号：US20160329316A1
公开(公告)日：2016-11-10
申请号：US15157853
申请日：2016-05-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Gartner , Ales Markytan , Jan Marfeld
CPC classification number: H01L27/0248 , F21K9/60 , F21Y2115/10 , H01L25/167 , H01L27/156 , H01L33/30 , H01L33/32 , H01L33/502 , H01L33/56 , H05B33/0845 , H05B33/0857 , H05B33/089
Abstract: A lighting module for emitting mixed light comprises at least one first semiconductor element which emits unconverted red light, at least one second semiconductor element which emits converted greenish white light having a first conversion percentage, at least one third semiconductor element which emits greenish white light having a second conversion percentage that is smaller than the first conversion percentage, and at least one resistor element having a temperature-dependent electric resistance, the second semiconductor element being connected in parallel to the third semiconductor element.
Abstract translation: 用于发射混合光的照明模块包括发射未转换的红光的至少一个第一半导体元件，发射具有第一转换百分比的转换的绿色白光的至少一个第二半导体元件，发射绿色白光的至少一个第三半导体元件， 第二转换百分比小于第一转换百分比，以及至少一个具有温度依赖性电阻的电阻元件，第二半导体元件与第三半导体元件并联连接。
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公开(公告)号：US09490396B2
公开(公告)日：2016-11-08
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/48 , H01L33/62 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L23/31 , H01L33/54
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括：具有侧面区域的光电子半导体芯片，半导体芯片顶面的表面以及半导体芯片底面的表面; 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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公开(公告)号：US20160056343A1
公开(公告)日：2016-02-25
申请号：US14931246
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/48 , H01L31/0232 , H01L33/56 , H01L31/0203 , H01L33/62 , H01L33/60
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.
Abstract translation: 光电子半导体部件包括具有侧面区域的半导体芯片，半导体芯片顶面的表面和半导体芯片底面的表面， 成形体，其具有在成形体的顶侧的表面和成形体的下侧的表面; 至少一个包括导电材料的电镀通孔; 以及与半导体芯片和镀通孔导电连接的导电连接，其中光电子半导体芯片的侧面被成形体覆盖，并且在顶部和/或底部的表面处的表面 光电半导体芯片的一侧完全没有成形体。
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20.发明申请公开(公告)号：US20150233534A1
公开(公告)日：2015-08-20
申请号：US14432007
申请日：2013-09-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Stephan Kaiser , Tony Albrecht , Michael Bestele , Jan Marfeld , Albert Schneider , Markus Kirsch
CPC classification number: F21V14/04 , F21V7/0066 , G01J1/0414 , G01J1/42 , G01J1/4228 , H01L25/10 , H01L25/13 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.
Abstract translation: 光电子部件装置包括提供和/或吸收电磁辐射的多个光电子部件; 布置在所述多个光电子部件的电磁辐射的光束路径中并且具有相对于所提供的电磁辐射至少部分反射的表面的反射器; 其中所述多个光电子部件至少部分地围绕所述反射器或至少部分地被所述反射器包围; 并且反射器反射所提供的电磁辐射，使得反射的电磁辐射的预定场分布形成在光电子部件装置的图像平面中。
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