公开(公告)号：US08987921B2

公开(公告)日：2015-03-24

申请号：US13825436

申请日：2011-07-29

申请人： Ulrike Scholz ,  Ralf Reichenbach

发明人： Ulrike Scholz ,  Ralf Reichenbach

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L23/28 ,  H01L23/522 ,  H01L23/528 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L25/00

CPC分类号： B81B7/0006 ,  B81B7/0074 ,  B81C1/00333 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/04 ,  H01L24/06 ,  H01L24/12 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/83

摘要： A method for producing a component with at least one micro-structured or nano-structured element includes applying at least one micro-structured or nano-structured element to a carrier. The element has at least one area configure to make contact and the element is applied to the carrier such that the at least one area adjoins the carrier. The element is enveloped in an enveloping compound and the element-enveloping compound composite is detached from the carrier. A first layer comprising electrically conductive areas is applied to the side of the element-enveloping compound composite that previously adjoined the carrier. At least one passage is introduced into the enveloping compound. A conductor layer is applied to the surface of the passage and at least to a section of the layer comprising the first electrically conductive areas to generate a through contact, which enables space-saving contacting. A component is formed from the method.

摘要翻译： 用至少一种微结构或纳米结构元素制备组分的方法包括将至少一种微结构或纳米结构的元素施加到载体上。 所述元件具有至少一个区域，其配置为进行接触，并且所述元件被施加到所述载体，使得所述至少一个区域与所述载体邻接。 元件被包封在包封的化合物中，并且元件包封复合复合材料与载体分离。 将包含导电区域的第一层施加到先前与载体邻接的元件包封复合复合材料的侧面。 至少一个通道被引入到包络化合物中。 导体层被施加到通道的表面，并且至少到包括第一导电区域的层的一部分以产生通孔，这使得节省空间的接触。 由该方法形成组件。

公开(公告)号：US20120280409A1

公开(公告)日：2012-11-08

申请号：US13509163

申请日：2010-09-23

申请人： Achim Trautmann ,  Ralf Reichenbach

发明人： Achim Trautmann ,  Ralf Reichenbach

IPC分类号： H01L23/48 ,  H01L21/30

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.

摘要翻译： 用于接合半导体衬底的微机械组件包括具有多个半导体芯片的芯片图案的半导体衬底，每个半导体芯片具有功能区域和围绕功能区域的边缘区域。 存在由边缘区域中的至少两个合金部件制成的接合合金的接合框架，与功能区域间隔开。 在围绕接合框架和功能区域之间的接合框架的边缘区域的部分内，存在至少一个由至少一个合金部件制成的止挡框架，其被构造成使得当接合合金的熔体接触 在接合期间的停止框架，粘结合金固化。

公开(公告)号：US08429971B2

公开(公告)日：2013-04-30

申请号：US12308632

申请日：2007-11-14

申请人： Johannes Classen ,  Axel Franke ,  Dietrich Schubert ,  Kersten Kehr ,  Ralf Reichenbach

发明人： Johannes Classen ,  Axel Franke ,  Dietrich Schubert ,  Kersten Kehr ,  Ralf Reichenbach

IPC分类号： G01P15/125

CPC分类号： G01P15/18 ,  G01P15/125 ,  G01P2015/084

摘要： A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.

摘要翻译： 微机械加速度传感器包括基板，平行于基板平面延伸并且部分地连接到基板的弹性隔膜，并且具有可以垂直于基板平面偏转的表面区域，以及地震块的中心 重力位于弹性隔膜的平面之外。 地震质量在位于弹性膜片的区域之外的衬底区域上延伸一段距离，其包括由多个电极组成的系统，每个电极与地震质量体的相对定位的区域在电路中形成电容器。 在其中心区域，抗震块附着在弹性隔膜的表面区域中的弹性隔膜，弹性隔膜可能垂直于基板平面偏转。

公开(公告)号：US08148234B2

公开(公告)日：2012-04-03

申请号：US12282842

申请日：2007-03-09

申请人： Gerhard Lammel ,  Hubert Benzel ,  Matthias Illing ,  Franz Laermer ,  Silvia Kronmueller ,  Paul Farber ,  Simon Armbruster ,  Ralf Reichenbach ,  Christoph Schelling ,  Ando Feyh

发明人： Gerhard Lammel ,  Hubert Benzel ,  Matthias Illing ,  Franz Laermer ,  Silvia Kronmueller ,  Paul Farber ,  Simon Armbruster ,  Ralf Reichenbach ,  Christoph Schelling ,  Ando Feyh

IPC分类号： H01L21/76

CPC分类号： H01L21/228 ,  H01L21/02378 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02658 ,  H01L21/02667 ,  H01L21/223 ,  H01L21/225 ,  H01L21/324

摘要： A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.

摘要翻译： 提供了一种制造半导体结构的方法，其包括以下操作：提供晶体半导体衬底，提供与半导体衬底的表面相邻的多孔区域，从表面引入掺杂剂到多孔区域中，并将多孔 区域形成半导体衬底的掺杂类型和/或掺杂浓度和/或掺杂分布/不同于半导体衬底或/或掺杂分布的晶体掺杂区域。 同样提供相应的半导体结构。

公开(公告)号：US20110168936A1

公开(公告)日：2011-07-14

申请号：US13062912

申请日：2009-09-07

申请人： Ralf Reichenbach ,  Peter Rothacher

发明人： Ralf Reichenbach ,  Peter Rothacher

IPC分类号： F04B53/10 ,  B29C45/14 ,  B29C35/08

CPC分类号： F16K99/0001 ,  F04B19/006 ,  F04B43/043 ,  F16K99/0009 ,  F16K99/0057 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/7879

摘要： A microvalve, in particular for a micropump, is described, which includes a valve member which is adjustable between an open position and a closed position, in contact with a valve seat in its closed position. The valve seat is made of a polymer material. A micropump and a manufacturing method are also described.

摘要翻译： 描述了一种特别用于微型泵的微型阀，其包括在打开位置和关闭位置之间可调节的阀构件，其在阀座处于其关闭位置时接触。 阀座由聚合物材料制成。 还描述了微型泵和制造方法。

公开(公告)号：US08492850B2

公开(公告)日：2013-07-23

申请号：US12308200

申请日：2007-04-27

申请人： Gerhard Lammel ,  Hubert Benzel ,  Matthias Illing ,  Franz Laermer ,  Silvia Kronmueller ,  Paul Farber ,  Simon Armbruster ,  Ralf Reichenbach ,  Christoph Schelling ,  Ando Feyh

发明人： Gerhard Lammel ,  Hubert Benzel ,  Matthias Illing ,  Franz Laermer ,  Silvia Kronmueller ,  Paul Farber ,  Simon Armbruster ,  Ralf Reichenbach ,  Christoph Schelling ,  Ando Feyh

IPC分类号： H01L27/088

CPC分类号： H01L21/02008 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02573 ,  H01L21/02601 ,  H01L21/02612 ,  H01L21/02656 ,  H01L21/02658 ,  H01L21/02667 ,  H01L33/346

摘要： A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.

摘要翻译： 一种制造硅衬底的方法，包括以下步骤：提供具有基本平坦的硅表面的硅衬底，产生具有多个孔的多孔硅表面，特别是具有大孔和/或介孔和/或纳米孔， 要插入硅的材料，其直径小于孔的直径，如果需要，将填充材料插入孔中并除去多余的填充材料形成硅表面，并回火硅衬底 配备有已经填充到孔中的填充材料，温度约为 1000℃和约 1400℃，以便再次闭合所产生的孔并包围填充材料。

公开(公告)号：US08113059B2

公开(公告)日：2012-02-14

申请号：US12227844

申请日：2007-06-14

申请人： Thomas Buck ,  Ralf Reichenbach

发明人： Thomas Buck ,  Ralf Reichenbach

IPC分类号： B60C23/04

CPC分类号： B60C23/0411 ,  G01L9/0022 ,  H02N2/18

摘要： A circuit module, in particular a tire sensor module, which at least includes: a substrate, on or in which at least one component is mounted, a piezoelement, which has at least one clamping region and at least one oscillatory region, the piezoelement being clamped in its clamping region on the substrate or on an arrangement secured to the substrate, and its oscillatory region being accommodated in a manner that permits oscillation, contacts provided on the piezoelement for tapping off a piezoelectric voltage, and a current-supply circuit, which receives the piezoelectric voltage generated by the piezoelement, being used as a voltage source for supplying power to the circuit module. The piezoelement is preferably clamped between at least two substrate elements, at least one cavity being formed within which the at least one oscillatory region of the piezoelement is accommodated in a manner that permits deflection, and is limited in its oscillation displacement.

摘要翻译： 电路模块，特别是轮胎传感器模块，其至少包括：衬底，其上安装有至少一个部件或其中至少一个部件;压电元件，其具有至少一个夹紧区域和至少一个振荡区域，所述压电元件是 夹持在其基板上的夹持区域或固定到基板上的布置上，并且其振荡区域以允许振动的方式容纳，设置在压电元件上的用于抽出压电电压的触点和电流供应电路，其中 接收由压电元件产生的压电电压，用作向电路模块供电的电压源。 压电元件优选地被夹持在至少两个基板元件之间，形成至少一个空腔，在该空腔内，压电元件的至少一个振荡区域以允许偏转的方式被容纳并且受其振荡位移的限制。

公开(公告)号：US20110174076A1

公开(公告)日：2011-07-21

申请号：US12308632

申请日：2007-11-14

申请人： Johannes Classen ,  Axel Franke ,  Dietrich Schubert ,  Kersten Kehr ,  Ralf Reichenbach

发明人： Johannes Classen ,  Axel Franke ,  Dietrich Schubert ,  Kersten Kehr ,  Ralf Reichenbach

IPC分类号： G01P15/02

CPC分类号： G01P15/18 ,  G01P15/125 ,  G01P2015/084

摘要： A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.

摘要翻译： 微机械加速度传感器包括基板，平行于基板平面延伸并且部分地连接到基板的弹性隔膜，并且具有可以垂直于基板平面偏转的表面区域，以及地震块的中心 重力位于弹性隔膜的平面之外。 地震质量在位于弹性膜片的区域之外的衬底区域上延伸一段距离，其包括由多个电极组成的系统，每个电极与地震质量体的相对定位的区域在电路中形成电容器。 在其中心区域，抗震块附着在弹性隔膜的表面区域中的弹性隔膜，弹性隔膜可能垂直于基板平面偏转。

公开(公告)号：US20110034873A1

公开(公告)日：2011-02-10

申请号：US12811936

申请日：2008-12-17

申请人： Julia Cassemeyer ,  Michael Stumber ,  Franz Laermer ,  Ralf Reichenbach

发明人： Julia Cassemeyer ,  Michael Stumber ,  Franz Laermer ,  Ralf Reichenbach

IPC分类号： A61M5/142 ,  B23P17/00 ,  A61M1/00

CPC分类号： F04B43/043 ,  F04B19/006

摘要： A method for manufacturing a micropump, which may be for the metered delivery of insulin, multiple layers being situated on the front side of a first carrier layer, which has a front side and a rear side, and microfluidic functional elements being formed by structuring at least one of the layers. It is provided that the structuring of the at least one layer for manufacturing all microfluidic functional elements is exclusively performed by front side structuring. Furthermore, a micropump is disclosed.

摘要翻译： 一种制造微型泵的方法，其可用于计量输送胰岛素，多层位于具有前侧和后侧的第一载体层的正面上，微流体功能元件通过在 至少一层。 提供用于制造所有微流控功能元件的至少一层的结构化仅通过前端结构进行。 此外，公开了一种微型泵。

公开(公告)号：US08939165B2

公开(公告)日：2015-01-27

申请号：US13062912

申请日：2009-09-07

申请人： Ralf Reichenbach ,  Peter Rothacher

发明人： Ralf Reichenbach ,  Peter Rothacher

IPC分类号： F16K51/00 ,  F16K99/00 ,  F04B19/00 ,  F04B43/04

CPC分类号： F16K99/0001 ,  F04B19/006 ,  F04B43/043 ,  F16K99/0009 ,  F16K99/0057 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/7879

摘要： A microvalve, in particular for a micropump, is described, which includes a valve member which is adjustable between an open position and a closed position, in contact with a valve seat in its closed position. The valve seat is made of a polymer material. A micropump and a manufacturing method are also described.

摘要翻译： 描述了一种特别用于微型泵的微型阀，其包括在打开位置和关闭位置之间可调节的阀构件，其在阀座处于其关闭位置时接触。 阀座由聚合物材料制成。 还描述了微型泵和制造方法。