摘要:
A circuit module, in particular a tire sensor module, which at least includes: a substrate, on or in which at least one component is mounted, a piezoelement, which has at least one clamping region and at least one oscillatory region, the piezoelement being clamped in its clamping region on the substrate or on an arrangement secured to the substrate, and its oscillatory region being accommodated in a manner that permits oscillation, contacts provided on the piezoelement for tapping off a piezoelectric voltage, and a current-supply circuit, which receives the piezoelectric voltage generated by the piezoelement, being used as a voltage source for supplying power to the circuit module. The piezoelement is preferably clamped between at least two substrate elements, at least one cavity being formed within which the at least one oscillatory region of the piezoelement is accommodated in a manner that permits deflection, and is limited in its oscillation displacement.
摘要:
A circuit module, in particular a tire sensor module, which at least includes: a substrate, on or in which at least one component is mounted, a piezoelement, which has at least one clamping region and at least one oscillatory region, the piezoelement being clamped in its clamping region on the substrate or on an arrangement secured to the substrate, and its oscillatory region being accommodated in a manner that permits oscillation, contacts provided on the piezoelement for tapping off a piezoelectric voltage, and a current-supply circuit, which receives the piezoelectric voltage generated by the piezoelement, being used as a voltage source for supplying power to the circuit module. The piezoelement is preferably clamped between at least two substrate elements, at least one cavity being formed within which the at least one oscillatory region of the piezoelement is accommodated in a manner that permits deflection, and is limited in its oscillation displacement.
摘要:
A method for producing a component with at least one micro-structured or nano-structured element includes applying at least one micro-structured or nano-structured element to a carrier. The element has at least one area configure to make contact and the element is applied to the carrier such that the at least one area adjoins the carrier. The element is enveloped in an enveloping compound and the element-enveloping compound composite is detached from the carrier. A first layer comprising electrically conductive areas is applied to the side of the element-enveloping compound composite that previously adjoined the carrier. At least one passage is introduced into the enveloping compound. A conductor layer is applied to the surface of the passage and at least to a section of the layer comprising the first electrically conductive areas to generate a through contact, which enables space-saving contacting. A component is formed from the method.
摘要:
A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
摘要:
A piezoelectric generator includes a piezoelectric element, a spring element, a mass element, and at least one stop. The piezoelectric element, the spring element, and the mass element form a system which can oscillate. The stop limits the oscillation of the system which can oscillate, at least on one side. The stop is formed from a ductile material or has a coating of a ductile material.
摘要:
A circuit module, in particular for use in a vehicle tire, having at least: a housing (2), a piezoelectric generator (3), which has a mass element (10) that is movable within the housing (2) and a spring device (12, 14), which has at least one piezoelectric element (14), the mass element (10) and the spring device (12, 14) forming an oscillatory system, and the piezoelectric element (14) being elastically deformable in response to the oscillation of the oscillatory system (10, 12, 14); and a current-supply circuit (5) for receiving a piezoelectric voltage output by the piezoelectric element (14) in response to the mechanical deformation thereof and for supplying power to the circuit module (1).
摘要:
A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.
摘要:
A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.
摘要:
A microvalve, in particular for a micropump, is described, which includes a valve member which is adjustable between an open position and a closed position, in contact with a valve seat in its closed position. The valve seat is made of a polymer material. A micropump and a manufacturing method are also described.
摘要:
A bending transducer device for generating electrical energy from deformations, and a circuit module which has such a bending transducer. The bending transducer includes at least one electrically deformable, vibration-capable, electrically conductive support structure, one piezoelectric element and a first contacting element, the conductive support structure having a first restraining area and a second restraining area for restraining the support structure, the piezoelectric element being designed and situated on the support structure in such a way that the piezoelectric element is deformable due to the deformation of the support structure caused by vibrations, and a first electrode for picking up the voltage generated by the deformation of the piezoelectric element is formed and contacted by the support structure, the first contacting element being connected electrically conductively to the support structure outside the first restraining area and the second restraining area.