公开(公告)号：USD479829S1

公开(公告)日：2003-09-23

申请号：US29172258

申请日：2002-12-09

申请人： Roger Dugas

设计人： Roger Dugas

公开(公告)号：US20060278331A1

公开(公告)日：2006-12-14

申请号：US11329539

申请日：2006-01-10

申请人： Roger Dugas ,  John Trezza

发明人： Roger Dugas ,  John Trezza

IPC分类号： B32B37/00 ,  H01L21/00 ,  B44C1/165 ,  B32B38/10

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/427 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2224/45111 ,  H01L2224/75 ,  H01L2224/75305 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2224/81894 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/183 ,  H01S5/18308 ,  H01S2301/176 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

摘要翻译： 一种使用多个芯片的方法，每个芯片分别具有包括电触点的接合表面和与接合表面相对的一侧的表面，包括使位于主体上的可硬化材料与多个芯片接触，硬化可硬化材料，从而 约束多个芯片中的每一个的至少一部分，将多个芯片从第一位置移动到第二位置，向身体施加力，使得硬化的可硬化材料将均匀地传递施加到身体的垂直力， 以在每个单独的芯片的接合表面与第二位置处的单个芯片将被接合的元件的接合表面接触的同时，不会对各个芯片元件造成损害， ，或粘结面。

公开(公告)号：US06857788B1

公开(公告)日：2005-02-22

申请号：US10641195

申请日：2003-08-13

申请人： Roger Dugas

发明人： Roger Dugas

IPC分类号： G02B6/38 ,  G02B6/42

CPC分类号： G02B6/4201 ,  G02B6/3897 ,  G02B6/4261 ,  G02B6/428 ,  G02B6/4284

摘要： A system and method to facilitate receipt of an optoelectronic module in a first direction and make an electrical connection by movement of the module in a second direction different from the first direction.

摘要翻译： 一种便于在第一方向上接收光电子模块的系统和方法，并且通过在与第一方向不同的第二方向上移动模块来进行电连接。

公开(公告)号：USD479828S1

公开(公告)日：2003-09-23

申请号：US29172257

申请日：2002-12-09

申请人： Roger Dugas

设计人： Roger Dugas

公开(公告)号：USD476982S1

公开(公告)日：2003-07-08

申请号：US29161861

申请日：2002-06-04

申请人： Roger Dugas ,  Mark Czoschke ,  John Trezza

设计人： Roger Dugas ,  Mark Czoschke ,  John Trezza

公开(公告)号：US09324629B2

公开(公告)日：2016-04-26

申请号：US11693984

申请日：2007-03-30

申请人： Roger Dugas ,  John Trezza

发明人： Roger Dugas ,  John Trezza

IPC分类号： B44C1/165 ,  B29C65/00 ,  H01L23/427 ,  H01L21/48 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01S5/042 ,  H01L23/488 ,  H01S5/022 ,  H01S5/183

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/427 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2224/45111 ,  H01L2224/75 ,  H01L2224/75305 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2224/81894 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/183 ,  H01S5/18308 ,  H01S2301/176 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

摘要翻译： 一种使用多个芯片的方法，每个芯片分别具有包括电触点的接合表面和与接合表面相对的一侧的表面，包括使位于主体上的可硬化材料与多个芯片接触，硬化可硬化材料，从而 约束多个芯片中的每一个的至少一部分，将多个芯片从第一位置移动到第二位置，向身体施加力，使得硬化的可硬化材料将均匀地传递施加到身体的垂直力， 以在每个单独的芯片的接合表面与第二位置处的单个芯片将被接合的元件的接合表面接触的同时，不会对各个芯片元件造成损害， ，或粘结面。

公开(公告)号：US20070172987A1

公开(公告)日：2007-07-26

申请号：US11693984

申请日：2007-03-30

申请人： Roger Dugas ,  John Trezza

发明人： Roger Dugas ,  John Trezza

IPC分类号： H01L21/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/427 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2224/45111 ,  H01L2224/75 ,  H01L2224/75305 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2224/81894 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/183 ,  H01S5/18308 ,  H01S2301/176 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

摘要翻译： 一种使用多个芯片的方法，每个芯片分别具有包括电触点的接合表面和与接合表面相对的一侧的表面，包括使位于主体上的可硬化材料与多个芯片接触，硬化可硬化材料，从而 约束多个芯片中的每一个的至少一部分，将多个芯片从第一位置移动到第二位置，向身体施加力，使得硬化的可硬化材料将均匀地传递施加到身体的垂直力， 以在每个单独的芯片的接合表面与第二位置处的单个芯片将被接合的元件的接合表面接触的同时，不会对各个芯片元件造成损害， ，或粘结面。

公开(公告)号：US20050036743A1

公开(公告)日：2005-02-17

申请号：US10641195

申请日：2003-08-13

申请人： Roger Dugas

发明人： Roger Dugas

IPC分类号： G02B6/38 ,  G02B6/42

CPC分类号： G02B6/4201 ,  G02B6/3897 ,  G02B6/4261 ,  G02B6/428 ,  G02B6/4284

摘要： A system and method to facilitate receipt of an optoelectronic module in a first direction and make an electrical connection by movement of the module in a second direction different from the first direction.

摘要翻译： 一种便于在第一方向上接收光电子模块的系统和方法，并且通过在与第一方向不同的第二方向上移动模块来进行电连接。

公开(公告)号：US06776758B2

公开(公告)日：2004-08-17

申请号：US10270344

申请日：2002-10-11

申请人： Michael Eugene Peszynski ,  David Chang Garner ,  Timothy J. Savord ,  Roger Dugas ,  Hubert Yeung

发明人： Michael Eugene Peszynski ,  David Chang Garner ,  Timothy J. Savord ,  Roger Dugas ,  Hubert Yeung

IPC分类号： A61B800

CPC分类号： A61B8/445 ,  A61B8/12 ,  A61B8/4405

摘要： An ultrasound imaging system including an electromagnetically protected ultrasound TEE probe, a display for displaying ultrasound images, a housing including a transducer connector including at least one connection and a computer for processing electrical signals representative of received ultrasound echoes. The TEE probe includes a probe housing including an imaging sensor, an outer acoustic lens, a cable interconnect and an internal metal shield which surrounds the sensor and cable interconnect, and a cable including electrical conductors and electromagnetic cable shielding, the electrical conductors electrically connected to the cable interconnect at a first end, and the electrical conductors and the cable shielding are electrically connected to a transducer connector at a second end.

摘要翻译： 一种包括电磁保护的超声TEE探针，用于显示超声波图像的显示器的超声成像系统，包括至少一个连接器的换能器连接器的壳体和用于处理表示所接收的超声回波的电信号的计算机。 TEE探针包括探针壳体，其包括成像传感器，外部声透镜，电缆互连和围绕传感器和电缆互连的内部金属屏蔽，以及包括电导体和电磁线缆屏蔽的电缆，电导体电连接到 在第一端处的电缆互连，并且电导体和电缆屏蔽件在第二端处电连接到换能器连接器。