Abstract:
A light scanning probe includes: a probe main body; a light scanner that includes a scanner module that is driven to rotate and a beam reflector that includes a plurality of reflection surfaces which alter a path of light being scanned by the scanner module, wherein the light scanner is disposed within the probe main body; and an optical fiber that guides light which is received from a light input unit toward the scanner module. A medical imaging apparatus includes the light scanning probe that irradiates light toward an object; a receiver that receives a signal which is generated in the object; and a signal processor that processes the signal received by the receiver.
Abstract:
A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
Abstract:
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.
Abstract:
A varifocal-type optical scanning probe including an optical fiber scanner and a varifocal lens is provided. The varifocal lens includes: a first membrane lens comprising a first lens surface with a variable curvature and a first pressure surface configured to induce a curvature variation of the first lens surface; a second membrane lens including a second lens surface with a variable curvature and a second pressure surface configured to induce a curvature variation of the second lens surface; a first pressure member disposed to apply a pressure to the first pressure surface; a second pressure member disposed to apply a pressure to the second pressure surface; and a motor configured to transmit a driving force to at least one of the first pressure member and the second pressure member.
Abstract:
An ultrasonic transducer, and an ultrasonic wave generating apparatus and an ultrasonic system including the same. The ultrasonic transducer includes a light-absorbing layer configured to absorb light incident on the light-absorbing layer and to generate heat based on the absorbed light; and a thermoelastic layer which is disposed on the light-absorbing layer and which is configured to thermally expand based on the heat to generate ultrasonic waves.
Abstract:
An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.
Abstract:
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.
Abstract:
The probe includes a probe body that includes an internal empty space and is configured to be inserted into a coelom; an energy source module that is disposed in the probe body, and configured to emit an energy beam; first and second view windows that are provided at an end portion of the probe body, have different fields of view, and are configured to transmit the emitted energy beam; and a path changing unit that is disposed in the probe body, and configured to change a traveling path of the emitted energy beam to travel to one of the first view window and the second view window.
Abstract:
Disclosed are an optical probe and a medical imaging apparatus which includes the optical probe. The optical probe includes an optical scanner, which includes first and second fluids which have different refractive indexes and are not mixed with each other, and a probe body that is insertable into a coelom, and in which the optical scanner is provided in the probe body. Light which is emitted from the optical scanner is irradiated onto an object via a light output device. An output angle of the light emitted from the optical scanner varies based on a corresponding change in an interface between the first and second fluids.
Abstract:
A driving device of a display apparatus, and a method of manufacturing the driving device. The driving device may have a specific structure, and be manufactured in such a manner, because a first electrode of a micro optical switch device may be formed simultaneously with the formation of at least a source region and a drain region, or a gate electrode of an active device and a capacitor electrode.