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公开(公告)号：US20150075749A1
公开(公告)日：2015-03-19
申请号：US14487758
申请日：2014-09-16
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA , Commissariat A L'Energie Atomique et aux Energies Alternatives
Inventor： Stephane Monfray , Sandrine Lhostis , Christophe Maitre , Olga Kokshagina , Philippe Coronel
CPC classification number: H05K1/0203 , F28D9/0062 , F28F27/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.
Abstract translation: 集成电路芯片冷却装置包括微孔网络。 网络的第一管部分和第二管部分通过至少一个阀连接。 阀由双层条形成。 响应于温度的变化，双层带的形状改变以将阀从基本上关闭的位置移动到打开位置。 在一个配置中，更改是不可逆转的。 在另一种配置中，响应于相反的温度变化，该变化是可逆的。
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公开(公告)号：US09018614B2
公开(公告)日：2015-04-28
申请号：US14018223
申请日：2013-09-04
Applicant: STMicroelectronics (Crolles 2) SAS , Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Inventor： Jean-Francois Nodin , Veronique Sousa , Sandrine Lhostis
CPC classification number: H01L45/1246 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/165 , H01L45/1683
Abstract: A memory cell including a via made of a phase-change material arranged between a lower electrode and an upper electrode, wherein the via includes a central region laterally surrounded with a peripheral region, the crystallization and melting temperatures of the central region being respectively lower than those of the peripheral region.
Abstract translation: 一种存储单元，包括由布置在下电极和上电极之间的相变材料制成的通孔，其中所述通孔包括横向围绕周边区域的中心区域，所述中心区域的结晶和熔融温度分别低于 那些周边地区。
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公开(公告)号：US20140070158A1
公开(公告)日：2014-03-13
申请号：US14018223
申请日：2013-09-04
Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives , STMicroelectronics (Crolles 2) SAS
Inventor： Jean-Francois Nodin , Veronique Sousa , Sandrine Lhostis
IPC: H01L45/00
CPC classification number: H01L45/1246 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/165 , H01L45/1683
Abstract: A memory cell including a via made of a phase-change material arranged between a lower electrode and an upper electrode, wherein the via includes a central region laterally surrounded with a peripheral region, the crystallization and melting temperatures of the central region being respectively lower than those of the peripheral region.
Abstract translation: 一种存储单元，包括由布置在下电极和上电极之间的相变材料制成的通孔，其中所述通孔包括横向围绕周边区域的中心区域，所述中心区域的结晶和熔融温度分别低于 那些周边地区。
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公开(公告)号：US20170133297A1
公开(公告)日：2017-05-11
申请号：US15414061
申请日：2017-01-24
Inventor： Louis-Michel Collin , Luc Guy Frechette , Sandrine Lhostis
IPC: H01L23/42 , H01L21/56 , H01L21/48 , H01L23/00 , H01L23/498 , H01L23/367
CPC classification number: H01L23/42 , H01L21/31116 , H01L21/481 , H01L21/4825 , H01L21/4853 , H01L21/4875 , H01L21/4878 , H01L21/52 , H01L21/54 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L23/315 , H01L23/3157 , H01L23/3672 , H01L23/473 , H01L23/492 , H01L23/4952 , H01L23/49568 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05647 , H01L2224/11462 , H01L2224/13012 , H01L2224/13013 , H01L2224/13015 , H01L2224/13024 , H01L2224/13078 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14051 , H01L2224/14151 , H01L2224/14152 , H01L2224/14154 , H01L2224/14177 , H01L2224/14517 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17051 , H01L2224/17181 , H01L2224/27462 , H01L2224/29012 , H01L2224/29013 , H01L2224/29015 , H01L2224/29078 , H01L2224/29147 , H01L2224/30151 , H01L2224/30152 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73103 , H01L2224/73203 , H01L2224/73253 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/81801 , H01L2224/83193 , H01L2224/83203 , H01L2224/83447 , H01L2224/83801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06586 , H01L2225/06589 , H01L2924/1815 , H01L2924/351 , H01L2924/37002 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/1415
Abstract: An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
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公开(公告)号：US09638844B2
公开(公告)日：2017-05-02
申请号：US14305378
申请日：2014-06-16
Applicant: STMicroelectronics (Crolles 2) SAS , Commissariat a L'Energie Atomique et aux Energies Alternatives
Inventor： Romain Girard Desprolet , Sandrine Lhostis , Salim Boutami
IPC: G02B5/20 , H01L27/146 , G02B5/00 , B82Y20/00 , G02F1/1335
CPC classification number: G02B5/201 , B82Y20/00 , G02B5/008 , G02B5/204 , G02B2207/101 , G02F1/133509 , G02F1/133514 , H01L27/14621 , H01L27/14625 , H01L27/14627
Abstract: A spectral filter includes an assembly of filtering cells. Each cell has a same nanostructured pattern and a preferential direction of the pattern. This preferential direction is, for each cell, oriented approximately radially with respect to a single point of the spectral filter. Alternatively, this preferential direction is, for each cell, oriented approximately ortho-radially with respect to the single point of the spectral filter. The single point may be a center point. Alternatively, the single point may correspond to an optical axis of a lens element associated with the spectral filter.
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Patent Agency Ranking
公开(公告)号：US20160172278A1
公开(公告)日：2016-06-16
申请号：US14857041
申请日：2015-09-17
Inventor： Louis-Michel Collin , Luc Guy Frechette , Sandrine Lhostis
IPC: H01L23/495 , H01L23/492 , H01L23/31 , H01L21/52 , H01L23/00 , H01L21/54 , H01L21/48 , H01L21/311 , H01L25/00 , H01L25/065 , H01L23/42 , H01L21/56
CPC classification number: H01L23/42 , H01L21/31116 , H01L21/481 , H01L21/4825 , H01L21/4853 , H01L21/4875 , H01L21/4878 , H01L21/52 , H01L21/54 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L23/315 , H01L23/3157 , H01L23/3672 , H01L23/473 , H01L23/492 , H01L23/4952 , H01L23/49568 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05647 , H01L2224/11462 , H01L2224/13012 , H01L2224/13013 , H01L2224/13015 , H01L2224/13024 , H01L2224/13078 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14051 , H01L2224/14151 , H01L2224/14152 , H01L2224/14154 , H01L2224/14177 , H01L2224/14517 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17051 , H01L2224/17181 , H01L2224/27462 , H01L2224/29012 , H01L2224/29013 , H01L2224/29015 , H01L2224/29078 , H01L2224/29147 , H01L2224/30151 , H01L2224/30152 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73103 , H01L2224/73203 , H01L2224/73253 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/81801 , H01L2224/83193 , H01L2224/83203 , H01L2224/83447 , H01L2224/83801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06586 , H01L2225/06589 , H01L2924/1815 , H01L2924/351 , H01L2924/37002 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/1415
Abstract: An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
Abstract translation: 组件由集成电路芯片和板制成。 在芯片和板之间布置至少一个通道。 通道由金属侧壁限定，金属侧壁至少部分地从芯片的一个表面延伸到板的相对表面。 组件被封装在包括延伸到达通道的开口的主体中。 该板可以是插入件，集成电路芯片，表面安装型支架或金属板之一。
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17.发明申请公开(公告)号：US20150083900A1
公开(公告)日：2015-03-26
申请号：US14493553
申请日：2014-09-23
Applicant: STMicroelectronics (Research & Development) Limited , STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Crolles 2) SAS
Inventor： Adam Caley , Pierre-Jean Parodi-Keravec , Olivier Le Briz , Sandrine Lhostis
CPC classification number: G01S7/4811 , G01S7/497 , G01S17/026 , G01S17/36
Abstract: A proximity sensor includes a radiation source configured to emit a primary radiation beam and a primary detector configured to pick up a reflected primary radiation beam. The radiation source is further configured to emit stray radiation. The sensor further includes a reference detector arranged to receive the stray radiation. The stray radiation may, for example, be emitted from either a side of the radiation source or a bottom of the radiation source.
Abstract translation: 接近传感器包括被配置为发射主辐射束的辐射源和被配置为拾取反射的一次辐射束的主检测器。 辐射源还被配置成发射杂散辐射。 传感器还包括布置成接收杂散辐射的参考检测器。 杂散辐射可以例如从辐射源的一侧或辐射源的底部发射。
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公开(公告)号：US09941188B2
公开(公告)日：2018-04-10
申请号：US15414061
申请日：2017-01-24
Inventor： Louis-Michel Collin , Luc Guy Frechette , Sandrine Lhostis
IPC: H01L21/44 , H01L23/42 , H01L23/498 , H01L23/367 , H01L21/48 , H01L23/00 , H01L21/56
CPC classification number: H01L23/42 , H01L21/31116 , H01L21/481 , H01L21/4825 , H01L21/4853 , H01L21/4875 , H01L21/4878 , H01L21/52 , H01L21/54 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L23/315 , H01L23/3157 , H01L23/3672 , H01L23/473 , H01L23/492 , H01L23/4952 , H01L23/49568 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05647 , H01L2224/11462 , H01L2224/13012 , H01L2224/13013 , H01L2224/13015 , H01L2224/13024 , H01L2224/13078 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14051 , H01L2224/14151 , H01L2224/14152 , H01L2224/14154 , H01L2224/14177 , H01L2224/14517 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17051 , H01L2224/17181 , H01L2224/27462 , H01L2224/29012 , H01L2224/29013 , H01L2224/29015 , H01L2224/29078 , H01L2224/29147 , H01L2224/30151 , H01L2224/30152 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73103 , H01L2224/73203 , H01L2224/73253 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/81801 , H01L2224/83193 , H01L2224/83203 , H01L2224/83447 , H01L2224/83801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06586 , H01L2225/06589 , H01L2924/1815 , H01L2924/351 , H01L2924/37002 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/1415
Abstract: An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
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19.发明授权Proximity sensor including reference detector for stray radiation detection 有权接近传感器，包括用于杂散辐射检测的参考检测器公开(公告)号：US09535157B2
公开(公告)日：2017-01-03
申请号：US14493553
申请日：2014-09-23
Applicant: STMicroelectronics (Research & Development) Limited , STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Crolles 2) SAS
Inventor： Adam Caley , Pierre-Jean Parodi-Keravec , Olivier Le Briz , Sandrine Lhostis
CPC classification number: G01S7/4811 , G01S7/497 , G01S17/026 , G01S17/36
Abstract: A proximity sensor includes a radiation source configured to emit a primary radiation beam and a primary detector configured to pick up a reflected primary radiation beam. The radiation source is further configured to emit stray radiation. The sensor further includes a reference detector arranged to receive the stray radiation. The stray radiation may, for example, be emitted from either a side of the radiation source or a bottom of the radiation source.
Abstract translation: 接近传感器包括被配置为发射主辐射束的辐射源和被配置为拾取反射的一次辐射束的主检测器。 辐射源还被配置成发射杂散辐射。 传感器还包括布置成接收杂散辐射的参考检测器。 杂散辐射可以例如从辐射源的一侧或辐射源的底部发射。
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公开(公告)号：US09589874B2
公开(公告)日：2017-03-07
申请号：US14857041
申请日：2015-09-17
Inventor： Louis-Michel Collin , Luc Guy Frechette , Sandrine Lhostis
IPC: H01L23/48 , H01L23/495 , H01L21/311 , H01L21/48 , H01L21/52 , H01L21/54 , H01L21/56 , H01L23/31 , H01L23/42 , H01L23/492 , H01L23/00 , H01L25/065 , H01L25/00 , H01L23/473
CPC classification number: H01L23/42 , H01L21/31116 , H01L21/481 , H01L21/4825 , H01L21/4853 , H01L21/4875 , H01L21/4878 , H01L21/52 , H01L21/54 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L23/315 , H01L23/3157 , H01L23/3672 , H01L23/473 , H01L23/492 , H01L23/4952 , H01L23/49568 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05647 , H01L2224/11462 , H01L2224/13012 , H01L2224/13013 , H01L2224/13015 , H01L2224/13024 , H01L2224/13078 , H01L2224/131 , H01L2224/13147 , H01L2224/136 , H01L2224/14051 , H01L2224/14151 , H01L2224/14152 , H01L2224/14154 , H01L2224/14177 , H01L2224/14517 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17051 , H01L2224/17181 , H01L2224/27462 , H01L2224/29012 , H01L2224/29013 , H01L2224/29015 , H01L2224/29078 , H01L2224/29147 , H01L2224/30151 , H01L2224/30152 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73103 , H01L2224/73203 , H01L2224/73253 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/81801 , H01L2224/83193 , H01L2224/83203 , H01L2224/83447 , H01L2224/83801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06586 , H01L2225/06589 , H01L2924/1815 , H01L2924/351 , H01L2924/37002 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/1415
Abstract: An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
Abstract translation: 组件由集成电路芯片和板制成。 在芯片和板之间布置至少一个通道。 通道由金属侧壁限定，金属侧壁至少部分地从芯片的一个表面延伸到板的相对表面。 组件被封装在包括延伸到达通道的开口的主体中。 该板可以是插入件，集成电路芯片，表面安装型支架或金属板之一。
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