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公开(公告)号：US20230343560A1
公开(公告)日：2023-10-26
申请号：US18217043
申请日：2023-06-30
发明人： Junyoung Oh , Jaeho Kwak , Boeun Jang , Seokyeon Hwang , Yongseok Seo , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee , Jongho Lee , Daewook Kim , Wonpil Lee , Changkyu Choi
IPC分类号： H01J37/32 , C23C16/455
CPC分类号： H01J37/32449 , C23C16/45504 , C23C16/45589 , H01J37/32633 , H01J37/32357 , C23C16/45591 , C23C16/45502 , C23C16/4583
摘要： A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.
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公开(公告)号：US11658394B2
公开(公告)日：2023-05-23
申请号：US17113577
申请日：2020-12-07
发明人： Jae-Ho Lim , Kyung-Jong Lee , Hosaeng Kim , Seunghwan Kim
CPC分类号： H01Q1/243 , H01Q5/335 , H01Q5/342 , H04M1/0216 , H01Q5/385 , H04M1/0268
摘要： Provided is an electronic device that includes first and second housings, a display, a connecting member connecting the first and second housings, first and second conductive members, and a wireless communication circuit. The first housing includes a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a first lateral side surrounding at least part of a space between the first side and the second side. The second housing includes a third side facing a third direction, a fourth side facing a fourth direction opposite to the third direction, and a second lateral side surrounding at least part of a space between the third side and the fourth side. The connecting member connects the first and second housings such that folding of the first and second housings results in the first and second lateral sides abutting against each other.
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公开(公告)号：US20210242190A1
公开(公告)日：2021-08-05
申请号：US17168706
申请日：2021-02-05
发明人： Junyoung Oh , Kyonghwan Koh , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee
IPC分类号： H01L25/00 , H01L25/065 , H01L25/10 , H01L23/00 , H01L23/31 , H01L23/538 , H01L21/48 , H01L21/56 , H01L21/78
摘要： A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.
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公开(公告)号：US09549103B2
公开(公告)日：2017-01-17
申请号：US14192270
申请日：2014-02-27
发明人： Sangbong Sung , Seunghwan Kim , Joonho Byun , Jaebong Chun
CPC分类号： H04N5/2251 , G03B2217/002 , H01Q1/242 , H01Q5/378 , H01Q5/40 , H01Q9/145 , H01Q9/42 , H01Q13/10 , H01Q21/28
摘要： An antenna for a camera, comprising a camera having a communication module provided therein, a first radiator provided in a predetermined position of a lens barrel of the camera and having a length and a width for receiving a signal from a first wireless communication system, a power feeding line configured to feed a power from the communication module of the camera to the first radiator, and a ground line configured to ground the first radiator.
摘要翻译： 一种用于相机的天线，包括设置在其中的具有通信模块的相机，设置在相机的镜筒的预定位置的第一散热器，并且具有用于接收来自第一无线通信系统的信号的长度和宽度， 馈电线，被配置为将来自所述摄像机的通信模块的电力馈送到所述第一散热器;以及接地线，其被配置为将所述第一辐射体接地。
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公开(公告)号：US20140240581A1
公开(公告)日：2014-08-28
申请号：US14192270
申请日：2014-02-27
发明人： Sangbong SUNG , Seunghwan Kim , Joonho Byun , Jaebong Chun
IPC分类号： H04N5/225
CPC分类号： H04N5/2251 , G03B2217/002 , H01Q1/242 , H01Q5/378 , H01Q5/40 , H01Q9/145 , H01Q9/42 , H01Q13/10 , H01Q21/28
摘要： An antenna for a camera, comprising a camera having a communication module provided therein, a first radiator provided in a predetermined position of a lens barrel of the camera and having a length and a width for receiving a signal from a first wireless communication system, a power feeding line configured to feed a power from the communication module of the camera to the first radiator, and a ground line configured to ground the first radiator.
摘要翻译： 一种用于相机的天线，包括设置在其中的具有通信模块的相机，设置在相机的镜筒的预定位置的第一散热器，并且具有用于接收来自第一无线通信系统的信号的长度和宽度， 馈电线，被配置为将来自所述摄像机的通信模块的电力馈送到所述第一散热器;以及接地线，其被配置为将所述第一辐射体接地。
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公开(公告)号：US20230378094A1
公开(公告)日：2023-11-23
申请号：US18104650
申请日：2023-02-01
发明人： Junwoo Park , Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Taejun Jeon , Junhyeung Jo
IPC分类号： H01L23/00 , H01L23/538 , H01L23/498 , H01L23/31 , H10B80/00
CPC分类号： H01L23/562 , H01L23/5383 , H01L23/5386 , H01L23/5385 , H01L23/49811 , H01L23/3128 , H10B80/00 , H01L2224/16227 , H01L24/16 , H01L2224/32225 , H01L24/32 , H01L2224/73204 , H01L24/73
摘要： A semiconductor package includes a support wiring structure, a semiconductor chip on the support wiring structure, a connection structure on the support wiring structure and spaced apart from the semiconductor chip in a horizontal direction, an interposer including a central portion and an outer portion and having a recess portion provided on a lower surface of the central portion facing the semiconductor chip, wherein the central portion is on the semiconductor chip and the connection structure is connected to the outer portion, and a metal plate disposed along a portion of a surface of the recess portion inside the interposer, wherein the metal plate extends along a side surface of the outer portion of the interposer and the lower surface of the central portion of the interposer, and the metal plate has a cavity passing through a vicinity of a center of the metal plate planarly.
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公开(公告)号：US20230260926A1
公开(公告)日：2023-08-17
申请号：US18107143
申请日：2023-02-08
发明人： Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Junwoo Park , Hyunggil Baek , Junga Lee
IPC分类号： H01L23/544 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/10 , H01L23/538 , H01L21/48 , H01L21/56
CPC分类号： H01L23/544 , H01L23/3128 , H01L23/49811 , H01L23/562 , H01L25/105 , H01L23/5383 , H01L23/5385 , H01L21/4846 , H01L21/563 , H01L2224/16227 , H01L24/16 , H01L2224/32225 , H01L24/32 , H01L2224/73204 , H01L24/73 , H01L2223/54426 , H01L2224/92125 , H01L24/92
摘要： A semiconductor package includes an interposer including an upper pad and an upper passivation layer partially covering the upper pad, a semiconductor chip disposed on the interposer, a conductor pattern disposed on the interposer, a guide pattern disposed on the interposer while including a main opening and at least one sub-opening connected to the main opening, a support disposed on the interposer while including a core portion and a peripheral portion surrounding the core portion, a lower surface of the support being disposed in the main opening of the guide pattern, an upper redistribution structure disposed on the semiconductor chip and connected to the conductor pattern and the guide pattern, and an encapsulant between the interposer and the upper redistribution structure. The encapsulant contacts an inner wall of the main opening, an inner wall of the at least one sub-opening and a side surface of the support.
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18.发明授权公开(公告)号：US11728142B2
公开(公告)日：2023-08-15
申请号：US16883392
申请日：2020-05-26
发明人： Junyoung Oh , Jaeho Kwak , Boeun Jang , Seokyeon Hwang , Yongseok Seo , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee , Jongho Lee , Daewook Kim , Wonpil Lee , Changkyu Choi
IPC分类号： H01J37/32 , C23C16/455 , C23C16/458 , H01L21/673
CPC分类号： H01J37/32449 , C23C16/45504 , C23C16/45589 , H01J37/32633 , C23C16/4583 , C23C16/45502 , C23C16/45591 , H01J37/32357 , H01L21/67326
摘要： A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.
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公开(公告)号：US20210091456A1
公开(公告)日：2021-03-25
申请号：US17113577
申请日：2020-12-07
发明人： Jae-Ho Lim , Kyung-Jong Lee , Hosaeng Kim , Seunghwan Kim
摘要： Provided is an electronic device that includes first and second housings, a display, a connecting member connecting the first and second housings, first and second conductive members, and a wireless communication circuit. The first housing includes a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a first lateral side surrounding at least part of a space between the first side and the second side. The second housing includes a third side facing a third direction, a fourth side facing a fourth direction opposite to the third direction, and a second lateral side surrounding at least part of a space between the third side and the fourth side. The connecting member connects the first and second housings such that folding of the first and second housings results in the first and second lateral sides abutting against each other.
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公开(公告)号：US12072498B2
公开(公告)日：2024-08-27
申请号：US18114405
申请日：2023-02-27
发明人： Jaewon Choe , Seunghwan Kim , Jaehoon Jo , Nakchung Choi
CPC分类号： G02B27/0172 , G06T19/006
摘要： Augmented reality (AR) glasses may include a main housing configured to accommodate lenses of the AR glasses, with at least a portion of the main housing formed of a conductive member A sub-housing forms a leg of the AR glasses. A PCB is disposed in the sub-housing. A conductive hinge structure is configured to interconnect the main housing and the sub-housing such that the sub-housing is foldable with respect to the main housing. The conductive hinge structure is electrically connected to the PCB and the conductive member. A wireless communication circuit is disposed in the sub-housing and is configured to transmit and/or receive a signal of a predetermined frequency band based on an electrical path including the conductive hinge structure and the conductive member by directly feeding power to the conductive hinge structure. Various other embodiments identified through the specification are possible.
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