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21 条记录 (耗时 0.037 秒)

    Electroplating apparatus for tailored uniformity profile
    13.
    发明授权
    Electroplating apparatus for tailored uniformity profile 有权
    用于定制均匀性曲线的电镀设备

    公开(公告)号：US08858774B2

    公开(公告)日：2014-10-14

    申请号：US13438443

    申请日：2012-04-03

    申请人： Steven T. Mayer ,  David W. Porter ,  Bryan L. Buckalew ,  Robert Rash

    发明人： Steven T. Mayer ,  David W. Porter ,  Bryan L. Buckalew ,  Robert Rash

    IPC分类号： C25D17/00 ,  C25D21/12 ,  C25D7/12 ,  C25D5/18 ,  H01L21/288 ,  C25D17/12 ,  C25D21/10 ,  H01L21/768

    CPC分类号： C25D5/00 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/008 ,  C25D17/06 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76873

    摘要： Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

    摘要翻译： 在一方面，在控制方位均匀性的同时，在基板上电镀金属的方法包括在电镀期间为电镀设备提供基板，该电镀设备被配置为在电镀期间旋转基板，以及在将基板相对于屏蔽件旋转的同时使金属电镀， 在选择的方位角位置的衬底的选定部分在屏蔽区域中停留不同于具有相同平均弧长和相同平均径向位置并且位于不同角度（方位角）处的基底的第二部分的时间量， 位置。 例如，当基板的选定部分通过屏蔽区域时，半导体晶片基板可以在电镀期间更快或更快地旋转。

    Electroplating apparatus with vented electrolyte manifold
    15.
    发明授权
    Electroplating apparatus with vented electrolyte manifold 有权
    带排气电解液歧管的电镀设备

    公开(公告)号：US08475637B2

    公开(公告)日：2013-07-02

    申请号：US12337147

    申请日：2008-12-17

    申请人： Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    发明人： Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    IPC分类号： C25D17/00 ,  C25D21/04

    CPC分类号： C25D7/123 ,  C25D17/001 ,  C25D17/002

    摘要： Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber.

    摘要翻译： 公开了与提高电镀膜的均匀性有关的实施例。 例如，一个公开的实施例提供了一种电镀设备，其包括电镀室，工件保持器，构造成电接触工件的阴极接触件和被配置为电接触设置在电镀室中的阳极的阳极接触件。 扩散阻挡层设置在阴极接触件和阳极接触件之间，以提供均匀的电解质流向工件，并且提供电解质输送和返回路径用于将电解质输送到电镀室和远离电镀室。 另外，排气的电解液歧管设置在紧邻镀室的上游的电解质输送路径中，排出的电解质歧管包括一个或多个向电镀室敞开的电解质输送开口，以及一个或多个通向出口 电镀室。

    Convenient Replacement of Anode in Semiconductor Electroplating Apparatus
    16.
    发明申请
    Convenient Replacement of Anode in Semiconductor Electroplating Apparatus 审中-公开
    方便更换半导体电镀设备中的阳极

    公开(公告)号：US20090211900A1

    公开(公告)日：2009-08-27

    申请号：US12036177

    申请日：2008-02-22

    申请人： Robert Rash ,  Frederick Wilmot ,  Mitchell Gee

    发明人： Robert Rash ,  Frederick Wilmot ,  Mitchell Gee

    IPC分类号： C25B9/00

    CPC分类号： C25D17/10 ,  C25D21/12 ,  H01L21/67011

    摘要： The convenient replacement of an anode in a semiconductor electroplating apparatus is disclosed. For example, in one disclosed embodiment, an electroplating system comprises an electroplating cell having an anode chamber, a cathode chamber, a selective transport barrier separating the anode chamber and the cathode chamber, and an anode disposed within the anode chamber. The anode comprises a plurality of pieces of anode material disposed within a removable anode holder.

    摘要翻译： 公开了一种在半导体电镀设备中方便地更换阳极的方法。 例如，在一个公开的实施例中，电镀系统包括具有阳极室，阴极室，分离阳极室和阴极室的选择性传输屏障和设置在阳极室内的阳极的电镀单元。 阳极包括设置在可移除的阳极保持器内的多个阳极材料片。

    METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS
    18.
    发明申请
    METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS 审中-公开
    清洗电镀基板支架的方法和装置

    公开(公告)号：US20130292254A1

    公开(公告)日：2013-11-07

    申请号：US13852767

    申请日：2013-03-28

    申请人： Santosh Kumar ,  Bryan L. Buckalew ,  Steven T. Mayer ,  Thomas Ponnuswamy ,  Chad Michael Hosack ,  Robert Rash ,  Lee Peng Chua ,  David Porter

    发明人： Santosh Kumar ,  Bryan L. Buckalew ,  Steven T. Mayer ,  Thomas Ponnuswamy ,  Chad Michael Hosack ,  Robert Rash ,  Lee Peng Chua ,  David Porter

    IPC分类号： C25D17/00

    CPC分类号： B08B3/022 ,  B08B3/041 ,  C25D7/12 ,  C25D17/00 ,  C25D17/001 ,  C25D21/00 ,  C25D21/12 ,  H01L21/67051

    摘要： Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

    摘要翻译： 本文公开了通过去除在现有电镀操作中积累的金属沉积物来清洁电镀装置的唇密封和/或杯底的方法。 所述方法可以包括使喷嘴定向成使得其基本上指向唇密封件和/或杯底部的内圆形边缘，并且从喷嘴分配清洁溶液流，使得流接触唇塞的内圆形边缘，并且 /或杯底，同时旋转，去除金属沉积物。 在一些实施例中，流具有抵抗唇密封和/或杯底的旋转方向的速度分量。 在一些实施例中，沉积物可以包括锡/银合金。 本文还公开了用于安装在电镀装置中并用于从其密封件和/或杯底部去除电镀金属沉积物的清洁装置。 在一些实施例中，清洁设备可以包括喷嘴。

    Electroplating Apparatus with Vented Electrolyte Manifold
    20.
    发明申请
    Electroplating Apparatus with Vented Electrolyte Manifold 有权
    带通风电解质歧管的电镀设备

    公开(公告)号：US20100147679A1

    公开(公告)日：2010-06-17

    申请号：US12337147

    申请日：2008-12-17

    申请人： Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    发明人： Jingbin Feng ,  Zhian He ,  Robert Rash ,  Steven T. Mayer

    IPC分类号： C25D17/00

    CPC分类号： C25D7/123 ,  C25D17/001 ,  C25D17/002

    摘要： Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber.

    摘要翻译： 公开了与提高电镀膜的均匀性有关的实施例。 例如，一个公开的实施例提供了一种电镀设备，其包括电镀室，工件保持器，构造成电接触工件的阴极接触件和被配置为电接触设置在电镀室中的阳极的阳极接触件。 扩散阻挡层设置在阴极接触件和阳极接触件之间，以提供均匀的电解质流向工件，并且提供电解质输送和返回路径用于将电解质输送到电镀室和远离电镀室。 另外，排气的电解液歧管设置在紧邻镀室的上游的电解质输送路径中，排出的电解质歧管包括一个或多个向电镀室敞开的电解质输送开口，以及一个或多个通向出口 电镀室。