公开(公告)号：US10916526B2

公开(公告)日：2021-02-09

申请号：US16837470

申请日：2020-04-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00 ,  H01L25/10 ,  H01L25/16

Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20200227390A1

公开(公告)日：2020-07-16

申请号：US16837470

申请日：2020-04-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00 ,  H01L25/10 ,  H01L25/16

Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20190279937A1

公开(公告)日：2019-09-12

申请号：US15993108

申请日：2018-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.

公开(公告)号：US20150333017A1

公开(公告)日：2015-11-19

申请号：US14459678

申请日：2014-08-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cho-Hsin Chang ,  Tsung-Hsien Hsu ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.

Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。

公开(公告)号：US20150243574A1

公开(公告)日：2015-08-27

申请号：US14256496

申请日：2014-04-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Liang Shih ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Sheng-Ming Yang ,  Hung-Cheng Chen ,  Chia-Yang Chen

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32268 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Abstract translation: 提供了一种制造半导体封装的方法，其包括以下步骤：提供具有多个焊盘和相对的第二表面的具有第一表面的封装基板; 在所述包装基板的第一表面上设置多个无源元件; 通过粘合膜将半导体芯片设置在无源元件上; 通过多个接合线电连接半导体芯片和接合焊盘; 以及在所述封装衬底的所述第一表面上形成密封剂以封装所述半导体芯片，所述无源元件和所述接合线。 通过在封装基板和半导体芯片之间配置无源元件，本发明节约了封装基板上的空间，增加了布线灵活性。 此外，由于接合线不容易与无源元件接触，所以本发明防止发生短路。

公开(公告)号：US20250125237A1

公开(公告)日：2025-04-17

申请号：US18990236

申请日：2024-12-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20200251395A1

公开(公告)日：2020-08-06

申请号：US16460766

申请日：2019-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/498

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.

公开(公告)号：US20190214352A1

公开(公告)日：2019-07-11

申请号：US16028798

申请日：2018-07-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Fan Tsai ,  Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

公开(公告)号：US09999132B2

公开(公告)日：2018-06-12

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18 ,  G06K19/077 ,  H01L25/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20170201023A1

公开(公告)日：2017-07-13

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01Q9/04 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/48

CPC classification number: H01L23/49838 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01Q1/243 ,  H01Q9/065 ,  H01Q19/104 ,  H01Q23/00

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.