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    MULTILAYER WIRING SUBSTRATE
    12.
    发明申请
    MULTILAYER WIRING SUBSTRATE 有权
    多层布线基板

    公开(公告)号：US20160066417A1

    公开(公告)日：2016-03-03

    申请号：US14841278

    申请日：2015-08-31

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18

    CPC classification number: H05K3/4641 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/10674 ,  H05K2203/061

    Abstract: In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer.

    Abstract translation: 在本发明的一个实施例中，多层布线基板包括：第一布线基板，其具有由其中具有空腔的金属制成的第一芯体; 第二布线基板，具有由金属制成的第二芯部件; 以及在所述第一布线基板和所述第二布线基板之间的接合层，以将所述第一布线基板的顶表面接合到所述第二布线基板的底表面，所述接合层具有图案化的导电层。

    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
    13.
    发明申请
    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT 有权
    带有内置电子元件的基板

    公开(公告)号：US20140307402A1

    公开(公告)日：2014-10-16

    申请号：US14133372

    申请日：2013-12-18

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Yusuke INOUE ,  Masashi MIYAZAKI

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.

    Abstract translation: 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。

    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
    14.
    发明申请
    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT 有权
    带有内置电子元件的基板

    公开(公告)号：US20140285988A1

    公开(公告)日：2014-09-25

    申请号：US14101054

    申请日：2013-12-09

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Tatsuro SAWATARI ,  Yuichi SUGIYAMA

    IPC: H05K1/18

    CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10522

    Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

    Abstract translation: 具有内置电子部件的基板包括：芯层，其包括芯材料和形成在芯材中并且包含绝缘材料的空腔; 绝缘层，其包括接地布线和信号布线，并且形成在所述芯层上; 以及多个电子部件，其各自包括第一端子和第二端子，并且存储在所述空腔中，所述多个电子部件各自具有一个端部和另一个端部，所述第一端子形成在所述一个端部处， 连接到接地布线，第二端子形成在另一端部并连接到信号布线，多个电子部件具有第一端子彼此面对并且第二端子面对的布置中的至少一种 其他。

    ELECTRONIC CIRCUIT MODULE
    15.
    发明申请
    ELECTRONIC CIRCUIT MODULE 有权
    电子电路模块

    公开(公告)号：US20140126160A1

    公开(公告)日：2014-05-08

    申请号：US14073019

    申请日：2013-11-06

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Masashi MIYAZAKI

    IPC: H05K9/00

    CPC classification number: H05K9/00 ,  H01L21/561 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/19105 ,  Y10T29/49146 ,  H01L2224/81

    Abstract: There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield.

    Abstract translation: 提供了一种电子电路模块，其防止接地布线和屏蔽层之间的结合力降低并且成功地保持期望的屏蔽效果。 电子电路模块还包括也用作接地布线的芯层，芯层的面向屏蔽端面的每个第一突起的每个面OS与面向绝缘合成树脂的外盖的面相邻 到屏蔽的端面，并且屏蔽的端面被接合到面向屏蔽端面的每个第一突起的每个面OS的两个面上，并且外盖的面向OS的端面 护盾。

    ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME
    16.
    发明申请
    ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME 有权
    电子电路模块及其制造方法

    公开(公告)号：US20140126157A1

    公开(公告)日：2014-05-08

    申请号：US14073287

    申请日：2013-11-06

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tatsuro SAWATARI ,  Masashi MIYAZAKI ,  Yoshiki HAMADA ,  Yuichi SUGIYAMA ,  Kazuaki IDA

    IPC: H05K7/06 ,  H05K13/00

    CPC classification number: H05K9/00 ,  H01L21/561 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/19105 ,  Y10T29/49146 ,  H01L2224/81

    Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

    Abstract translation: 电子电路模块包括具有内置部件的基板，安装在具有内置部件的基板上的安装部件，覆盖安装部件的密封部分和覆盖密封部分的导电合成树脂制成的屏蔽。 具有内置部件的基板具有由金属制成的芯层，由绝缘合成树脂制成的外盖和第一突起。 芯层有拐角和侧面。 外盖覆盖角部和侧面，并且具有第一表面。 第一突起具有在外盖处露出的第一端面和与第一表面相邻的第二表面，并且远离侧面的角部形成以向外突出。 密封部分覆盖安装部件。 护罩覆盖密封部分，并且具有结合到第一表面和第二表面的第三表面。

    MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME
    17.
    发明申请
    MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME 审中-公开

    公开(公告)号：US20200315032A1

    公开(公告)日：2020-10-01

    申请号：US16809122

    申请日：2020-03-04

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA ,  Hiroyuki KOBAYASHI

    IPC: H05K3/46 ,  H05K3/44

    Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

    CIRCUIT BOARD AND CIRCUIT MODULE
    18.
    发明申请
    CIRCUIT BOARD AND CIRCUIT MODULE 审中-公开

    公开(公告)号：US20200013690A1

    公开(公告)日：2020-01-09

    申请号：US16502866

    申请日：2019-07-03

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Yutaka HATA ,  Masashi MIYAZAKI ,  Yuichi SUGIYAMA

    IPC: H01L23/31 ,  H05K3/46 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

    Abstract: Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.

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