公开(公告)号：US3350760A

公开(公告)日：1967-11-07

申请号：US35238964

申请日：1964-03-16

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S

IPC: H01L21/18 ,  H01L23/29 ,  H01L23/522 ,  H01L27/07 ,  H01L27/08 ,  H01L29/92

CPC classification number: H01L27/08 ,  H01L21/18 ,  H01L23/291 ,  H01L23/5227 ,  H01L27/0755 ,  H01L29/92 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48463 ,  H01L2224/4918 ,  H01L2924/30107 ,  Y10T29/435 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：US3211972A

公开(公告)日：1965-10-12

申请号：US37771064

申请日：1964-06-24

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S ,  LATHROP JAY W

IPC: H01L21/82 ,  H01L27/06 ,  H01L27/07 ,  H01L29/00 ,  H03B5/12

CPC classification number: H01L29/00 ,  H01L21/82 ,  H01L27/0658 ,  H01L27/0716 ,  H01L27/0755

公开(公告)号：US3138743A

公开(公告)日：1964-06-23

申请号：US79160259

申请日：1959-02-06

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S

IPC: H01L21/00 ,  H01L21/033 ,  H01L21/18 ,  H01L21/3063 ,  H01L21/316 ,  H01L21/76 ,  H01L21/761 ,  H01L21/82 ,  H01L21/8222 ,  H01L23/29 ,  H01L23/522 ,  H01L27/06 ,  H01L27/07 ,  H01L27/08 ,  H01L29/00 ,  H01L29/8605 ,  H01L29/92 ,  H01L29/93 ,  H01L29/94 ,  H03K3/281 ,  H03K3/286

CPC classification number: H03K3/286 ,  H01L21/00 ,  H01L21/033 ,  H01L21/18 ,  H01L21/3063 ,  H01L21/31662 ,  H01L21/76 ,  H01L21/761 ,  H01L21/82 ,  H01L21/8222 ,  H01L23/291 ,  H01L23/5227 ,  H01L27/0641 ,  H01L27/0652 ,  H01L27/0755 ,  H01L27/0788 ,  H01L27/08 ,  H01L29/00 ,  H01L29/8605 ,  H01L29/92 ,  H01L29/93 ,  H01L29/94 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/4911 ,  H01L2224/4918 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03K3/281 ,  Y10S438/98 ,  H01L2924/00

Abstract: 945,749. Semi-conductor devices. TEXAS INSTRUMENTS Inc. Feb. 2, 1960 [Feb. 6, 1959], No. 32744/63. Divided out of 945,734. Heading H1K. The subject matter of this Specification is included in Specification 945,734 from which the present Specification is divided but the claims relate to a device comprising a semi-conductor body with three superposed regions of alternate conductivity types forming a pair of PN junctions extending to a surface of the body and there defining two enclosed areas one within the other, with an insulating oxide of a semi-conductor covering selected parts of said surface, first and second ohmic contacts secured to said surface on opposite sides of the inner PN junction and a third ohmic contact secured to the third region. Specifications 945,737, 945,738, 945,739, 945,740, 945,741, 945,742, 945,743, 945,744, 945,745, 945,746, 945,747 and 945,748 also are referred to.

公开(公告)号：US3115581A

公开(公告)日：1963-12-24

申请号：US81137159

申请日：1959-05-06

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S

IPC: H01L21/86 ,  H01L21/762 ,  H01L27/07 ,  H03K3/26

CPC classification number: H03K3/26 ,  H01L27/0755

公开(公告)号：US3698082A

公开(公告)日：1972-10-17

申请号：US3698082D

申请日：1971-02-25

Applicant: TEXAS INSTRUMENTS INC

Inventor： HYLTIN TOM M ,  KILBY JACK S ,  LUECKE GERALD ,  TOOMBS HAROLD D

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/66 ,  H05K7/06 ,  H01B13/00 ,  H05K3/28

CPC classification number: H05K7/06 ,  H01L21/486 ,  H01L23/5384 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for fabricating an integrated circuit array supporting substrate having coaxial transmission lines formed about a core means in proper position for electrically connecting integrated circuit chips. After determining the position and function of the integrated chips mounted upon the core means, the substrate is fabricated by properly positioning insulated conductors in a frame designed to retain the conductors in a desired arrangement, folding the frame about the core, plating the insulated conductors, core and frame with metallized layers to form coaxial cables of the insulated conductors, encapsulating the device, and exposing the ends of the coaxial lines.

Abstract translation: 一种用于制造集成电路阵列支撑基板的方法，该集成电路阵列支撑基板具有围绕芯装置形成的同轴传输线，用于电连接集成电路芯片。 在确定安装在芯装置上的集成芯片的位置和功能之后，通过将绝缘导体适当地定位在设计成以期望的布置保持导体的框架中，将框架围绕芯部折叠，电镀绝缘导体， 芯和框架与金属化层形成绝缘导体的同轴电缆，封装该器件，并露出同轴线的端部。

公开(公告)号：US3643232A

公开(公告)日：1972-02-15

申请号：US3643232D

申请日：1967-06-05

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S

IPC: H01L23/522 ,  H01L27/118 ,  G11C11/34

CPC classification number: H01L27/11801 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Large-scale integration of complex electronic circuitry and systems in semiconductor microminiature form comprising functional elements or cells at least partially in one surface of a semiconductor substrate and arranged in rows and columns with spaces between the rows, each cell including a plurality of first conductivity-type semiconductor regions in the substrate of opposite conductivity type in spaced-apart relation to form plural conduction paths and at least one semiconductor region of said first conductivity type extending under one of the spaces and being common to a conduction path in each of a pair of adjacent cells in a column. Also, disclosed is a multilayer connector pattern supported by the substrate and interconnecting the cells into an electronic system wherein the upper connector layer includes a supply line arranged to wind along the spaces in a serpentine fashion.

Abstract translation: 复杂电子电路和系统在半导体微型形式中的大规模集成，包括至少部分地在半导体衬底的一个表面中的功能元件或单元，并且排列成行和列之间的空间，每个单元包括多个第一导电 - 在相反导电类型的基板中以间隔开的关系形成半导体区域，以形成多个导电路径，并且至少一个所述第一导电类型的半导体区域在一个空间之下延伸，并且在一对 列中的相邻单元格。 此外，公开了由衬底支撑并将电池互连到电子系统中的多层连接器图案，其中上连接器层包括以蛇形方式沿着空间卷绕的供应线。

公开(公告)号：US3138721A

公开(公告)日：1964-06-23

申请号：US81137259

申请日：1959-05-06

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S

IPC: H01L27/07

CPC classification number: H01L27/0788 ,  Y10S257/926

公开(公告)号：US3696411A

公开(公告)日：1972-10-03

申请号：US3696411D

申请日：1970-11-12

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S ,  TASSEL JAMES H VAN

IPC: G06F3/02 ,  H01H13/702 ,  H01H13/785

CPC classification number: H01H13/785 ,  G06F3/0202 ,  H01H13/702 ,  H01H2201/026 ,  H01H2205/002 ,  H01H2221/024 ,  H01H2221/062 ,  H01H2231/002 ,  H01H2239/026

Abstract: Disclosed is a keyboard encoder capable of directly encoding decimal input information into electrical binary code. The electrical encoding of the information appears at the output terminals of the encoder when the key representing the information to be encoded is depressed. The depressed key causes the selective shorting together of certain ones of a group of encoding conductors which are connected to the output terminals.

Abstract translation: 公开了一种能够将十进制输入信息直接编码成电二进制代码的键盘编码器。 当代表要编码的信息的键被按下时，信息的电编码出现在编码器的输出端。 按下的键使得连接到输出端的一组编码导体中的某些编码导体的选择性短路。

公开(公告)号：US3496333A

公开(公告)日：1970-02-17

申请号：US3496333D

申请日：1968-09-26

Applicant: TEXAS INSTRUMENTS INC

Inventor： ALEXANDER EARL G ,  EMMONS STEPHEN P ,  KILBY JACK S

IPC: B41J2/34 ,  H01L21/00 ,  H01L23/522 ,  H05B3/00 ,  H05B3/14

CPC classification number: H05B3/148 ,  B41J2/34 ,  H01L21/00 ,  H01L23/522 ,  H01L2224/48091 ,  H05B3/00 ,  H01L2924/00014

公开(公告)号：US3413480A

公开(公告)日：1968-11-26

申请号：US32713663

申请日：1963-11-29

Applicant: TEXAS INSTRUMENTS INC

Inventor： BIARD JAMES R ,  BONIN EDWARD L ,  KILBY JACK S ,  PITTMAN GARY E

IPC: G05F1/575 ,  H01L27/00 ,  H01L31/167 ,  H03F3/08 ,  H03F3/343 ,  H03K17/795 ,  H03K19/14

CPC classification number: H03K19/14 ,  G05F1/575 ,  H01L27/00 ,  H01L31/167 ,  H03F3/085 ,  H03F3/343 ,  H03K17/795 ,  H03K17/7955 ,  Y10S323/902