公开(公告)号：US08942004B2

公开(公告)日：2015-01-27

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

发明人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

IPC分类号： H05K1/18 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US20100230146A1

公开(公告)日：2010-09-16

申请号：US12544959

申请日：2009-08-20

申请人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

发明人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

IPC分类号： H05K1/09 ,  C25D5/02

CPC分类号： H05K3/108 ,  B82Y10/00 ,  C23C18/38 ,  C25D5/022 ,  C25D5/10 ,  C25D9/08 ,  H05K3/249 ,  H05K2201/026 ,  H05K2201/0347 ,  H05K2203/135

摘要： Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.

摘要翻译： 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。

公开(公告)号：US20090236131A1

公开(公告)日：2009-09-24

申请号：US12222055

申请日：2008-07-31

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K3/02

CPC分类号： H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

摘要： Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer, including connecting pads, is formed, the pads protruding over the via holes; a build-up layer formed on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and a solder resist layer formed on an outermost layer of the build-up layer.

摘要翻译： 本文公开了一种多层电路板，包括：使用该方法制造的多层印刷电路板，包括具有通孔的绝缘树脂层，其一侧形成有包括电路图案的第一电路层，另一侧 形成包括连接焊盘的第二电路层，焊盘在通孔上方突出; 形成在所述第一电路层上的积聚层，所述堆积层包括多个绝缘层和多个电路层; 以及形成在积层层的最外层上的阻焊层。

公开(公告)号：US08592135B2

公开(公告)日：2013-11-26

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/26

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US20120148960A1

公开(公告)日：2012-06-14

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/20 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US08198550B2

公开(公告)日：2012-06-12

申请号：US12385003

申请日：2009-03-27

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H01R12/04

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.

摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 该制造方法包括将电路层和绝缘材料压入绝缘层中以形成水平表面，同时使连接垫在表面平齐的步骤。 该方法使印刷电路板变薄，提高了可靠性和设计自由度。

公开(公告)号：US20120066902A1

公开(公告)日：2012-03-22

申请号：US13301063

申请日：2011-11-21

申请人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

发明人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

IPC分类号： H05K3/10

CPC分类号： H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land.

摘要翻译： 一种制造印刷电路板的方法，包括：制备双面基板，其包括绝缘层，形成在所述绝缘层的一侧上的第一铜层和形成在所述绝缘层的另一侧上的第二铜层; 通过所述第二铜层和所述绝缘层形成通孔; 在所述通孔的内壁上形成镀层; 并且在双面基板上形成通孔，包括形成在具有最小直径并且具有小于通孔的最小直径的线宽度的通孔的表面上的电路图案的第一电路层，以及 第二电路层包括较低的焊盘。

公开(公告)号：US20100175915A1

公开(公告)日：2010-07-15

申请号：US12385003

申请日：2009-03-27

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/00 ,  H05K3/34

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom.

摘要翻译： 本发明涉及一种印刷电路板及印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并具有嵌入绝缘层中的连接焊盘，例如 连接焊盘的一侧与绝缘层的表面齐平，以及被配置为保护电路层免受外部环境的绝缘材料，并具有连接焊盘暴露的开口。 本发明使得印刷电路板变薄，提高了可靠性和设计自由度。

公开(公告)号：US06525463B1

公开(公告)日：2003-02-25

申请号：US09323520

申请日：1999-06-01

申请人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

发明人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

IPC分类号： H01J150

CPC分类号： H01J29/68 ,  H01J31/127

摘要： A flat panel display device comprises a cathode on a first substrate for emitting electrons, a magnetic plate including first region focusing electrons emitted from the cathode to display an image and second region for applying the uniform magnetic field into the holes in the first region, and a fluorescent layer on the second substrate, on which the electrons outputted from the holes are impacted. In the second region, there are holes having the same shape and pitch as the first region.

摘要翻译： 平板显示装置包括用于发射电子的第一基板上的阴极，包括聚焦从阴极发射的电子以显示图像的第一区域的磁性板和用于将均匀磁场施加到第一区域中的孔的第二区域，以及 在第二基板上的从孔中输出的电子受到冲击的荧光层。 在第二区域中，具有与第一区域相同的形状和间距的孔。

公开(公告)号：US08377748B2

公开(公告)日：2013-02-19

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。