Abstract:
Three flip-flops receive a common data signal input through a data terminal based on different timing signals which are obtained from an external timing signal and differ from one another by a specific delay step. A judging circuit judges whether or not the output data of the three flip-flops coincide with one another. If all the output data coincide with one another, the latch timing is maintained, whereas if the output data of the flip-flop latching the data signal at a fastest or latest timing differs from the output data of the flip-flop latching the data signal at the central timing, the judging circuit changes the variable timing to obtain a suitable latch timing.
Abstract:
When voltage changes occur in the battery used as a power supply in a fuel injection system, the amount of fuel injection also changes and the required amount of fuel injected cannot be obtained. To eliminate this problem, a fuel injector system is provided which has a fuel injection valve with at least one coil, a power supply, a power supply voltage detector, and a control unit for controlling the fuel injection valve. The control unit sets a reference value of a power supply voltages, and the above-mentioned fuel injection valve is controlled so as to obtain the required ampere-turns by reducing the resultant inductance of the coil when a power supply voltage detection value is less than the above-mentioned reference value, and the resultant inductance of the coil is increased when the power voltage detection value is greater than the reference value.
Abstract:
DLL circuit with a small minimum delay time while allowing a wide range of adjustment of the delay time. The DLL circuit according includes a first delay circuit for delaying an input clock signal (CLK1) to output a plurality of delayed clock signals (T1 to TN), a first selector (7) for selecting a first delayed clock signal (CLK_E) and a second delayed clock signal (CLK_O) from among the plurality of delayed clock signals (T1 to TN), for output, a second delay circuit (3) for delaying the input clock signal (CLK1) to generate a slightly delayed clock signal (CLKD), a second selector (4) for selecting two selected clock signals (FDLE, FDLO) from among the slightly delayed clock signal (CLKD), first delayed clock signal (CLK_E), and second delayed clock signal (CLK_O), and a delay synthesis circuit (5) for generating an internal clock signal (CLKIN) from the selected clock signals (FDLE, FDLO), for output.
Abstract translation:DLL电路具有较小的最小延迟时间,同时允许宽范围的延时调整。 所述DLL电路包括用于延迟输入时钟信号(CLK1)以输出多个延迟的时钟信号(T 1>到T N N)的第一延迟电路, 第一选择器(7),用于从多个延迟时钟信号(T 1至T N N)中选择第一延迟时钟信号(CLK_E)和第二延迟时钟信号(CLK_O) 用于输出用于延迟输入时钟信号(CLK 1)以产生稍微延迟的时钟信号(CLKD)的第二延迟电路(3);第二选择器(4),用于选择两个选择的时钟信号(FDLE, (CLKD),第一延迟时钟信号(CLK_E)和第二延迟时钟信号(CLK_O)的延迟合成电路(5),以及用于产生内部时钟信号(CLK < SUB>)从所选择的时钟信号(FDLE,FDLO)中输出。
Abstract:
In a data transfer system for use in an integrated circuit, a data output circuit comprises a D-FF for latching data to be transferred, in synchronism with an external clock signal, an output buffer receiving and outputting the data latched in the D-FF, and another output buffer receiving the external clock signal for outputting a delayed clock signal which is delayed from the external clock signal by a delay amount of the D-FF. On the other hand, a data input circuit including a first D-FF for receiving the data to be transferred outputted from the D-FF of the data output circuit, in synchronism with the delayed clock signal supplied from the D-FF of the data output circuit, and a second D-FF for fetching the data received in the first D-FF, in synchronism with the external clock signal.
Abstract:
In a semiconductor integrated circuit apparatus, a semiconductor chip (device, or module) has input/output portions each connected to two external pins (or terminals). The two external pins are connected to an incoming transmission line and an outgoing transmission line, respectively. The following formula is satisfied: ##EQU1## where Z is an impedance of each of the transmission lines; L1 and L2 are inductances of the two pins; and C1 is a capacitance of each of the input/output portions.
Abstract:
A semiconductor memory device includes a plurality of memory blocks, a write circuit for writing data into the memory blocks, a read circuit for reading data from the memory blocks, a plurality of serial registers, each of which is connected to the corresponding memory block to output serially a plurality of data read from the memory block, a plurality of switches, each of which is arranged between two adjacent ones of the serial registers to connect the serial registers in series, and a coincidence detection circuit for detecting a coincidence of data outputted from a final serial register arranged at a final end of the serial registers connected by the switches with data outputted from a serial register arranged immediately before the final serial register.
Abstract:
A single-component developing apparatus comprising a developer holding member having a peripheral surface, a power supply section applying an AC developing bias voltage to the developer holding member, the AC developing bias voltage having a waveform with predetermined minimum value, maximum value and period, an electrostatic latent image receiving member opposing the developer holding member across a gap having predetermined width, a developer supplying section supplying a developer to the developer holding member, and a developer regulating member forming developer into a thin layer on the peripheral surface of the developer holding member by pressing on the developer holding member.In this arrangement the developer holding member transports the thin layer of developer towards the electrostatic latent image receiving member, and the transported thin layer of developer flies from the developer holding member across the gap to the electrostatic latent image receiving member in accordance with the AC developing bias voltage. The waveform of the AC developing bias voltage satisfies the inequality:t.sub.A /T.ltoreq.0.4wherein t.sub.A is rise time from minimum value to maximum value, and T is the period.
Abstract:
A semiconductor laser with a self-sustained pulsation is disclosed in which a first cladding layer of first conductive type, an active layer and a second cladding layer of second conductive type having a striped ridge are formed in that order on a semiconductor substrate of first conductive type. The first and second cladding layers have a refractive index smaller than and a band gap larger than the active layer. A saturable optical absorbing layer having a band gap of energy substantially equal to the energy corresponding to lasing wavelength is formed in both the first and second cladding layers. Further, a barrier layer having a refractive index smaller than and a band gap larger than the first and second cladding layers is formed between the first cladding layer and the active layer and/or between the active layer and the second cladding layer.
Abstract:
A surface-emitting-type semiconductor laser device having a buried structure wherein a burying part having a current blocking function is formed around a buried part comprising an active region. A reflecting mirror consisting of a semiconductor multilayer film is installed on the buried part and the burying part, and the Bragg wavelength of this semiconductor multilayer film is set in matching with a longitudinal mode one mode higher than the longitudinal mode of oscillation in pulse operation. This semiconductor multilayer film has a configuration wherein two kinds of GaAlAs layers having different composition ratios of Al are laminated alternately, and the layer thickness of each GaAlAS layer constituting the semiconductor multilayer film is set so as to able to realize the Bragg wavelength calculated theoretically.
Abstract:
A semiconductor device includes a plurality of signal terminals on each of a plurality of vertically stacked semiconductor chips, each plurality of signal terminals connected to vertically aligned signal terminals of an adjacent semiconductor chip by through silicon vias, a common test terminal on each of the plurality of vertically stacked semiconductor chips connected to a vertically aligned common test terminal of an adjacent semiconductor chip by a through silicon via; a plurality of spiral test terminals on the plurality of vertically stacked semiconductor chips, each spiral test terminal connected to a non-vertically aligned spiral test terminal of an adjacent semiconductor chip by a through silicon via, and a conductive line arranged along a periphery of at least one of the plurality of vertically stacked semiconductor chips, the conductive line connected to a respective common test terminal and a respective spiral test terminal.