公开(公告)号：US20110014448A1

公开(公告)日：2011-01-20

申请号：US12805179

申请日：2010-07-15

申请人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

发明人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

IPC分类号： C08K3/22 ,  B32B27/38 ,  B32B27/18

CPC分类号： H01B3/006 ,  H01B3/36 ,  H01B3/40 ,  H01G4/10 ,  H01G4/12 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0209

摘要： A paste composition containing an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 μm or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition containing an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 μm and is 3 times or more the minimum mean particle diameter.

摘要翻译： 一种含有无机填料，树脂和溶剂的糊剂组合物，其中糊料组合物的特征在于它含有一种或多种沸点为160℃或更高的溶剂，其中平均粒径 为5μm以下，溶剂的总含量相对于糊剂组合物的总量为25重量％以下，含有无机填料和树脂的电介质组合物，其中无机填料包括至少为无机填料 两种平均粒径，平均粒径的最大平均粒径为0.1〜5μm，为最小平均粒径的3倍以上。

公开(公告)号：US20090270541A1

公开(公告)日：2009-10-29

申请号：US12312436

申请日：2007-11-06

申请人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08K3/30

CPC分类号： G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

摘要： Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability.Means for Solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

摘要翻译： 问题：本发明的目的是提供一种允许短时间固化并提供优异显影性的光波导形成膏组合物。 解决方法本发明涉及一种光波导形成用糊剂组合物，其包含（A）平均粒径为1nm以上且50nm以下的硫酸钡粒子，（B）具有聚合性基团的化合物和 羧基或具有聚合性基团的磷酸酯化合物，和（C）有机溶剂。

公开(公告)号：US20060159927A1

公开(公告)日：2006-07-20

申请号：US10551031

申请日：2004-03-25

申请人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

发明人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

IPC分类号： B32B27/38 ,  C08L63/00 ,  B32B37/00

CPC分类号： H01B3/40 ,  H01B3/006 ,  H01G4/10 ,  H01G4/12 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0209 ,  Y10T428/31511

摘要： A paste composition contains an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 μm or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition contains an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 μm and is 3 times or more to the minimum mean particle diameter. It is possible to obtain a high dielectric constant composition of which linear expansion coefficient is low, and which has a large capacitance.

摘要翻译： 糊剂组合物含有无机填料，树脂和溶剂，其中糊料组合物的特征在于它含有一种或多种沸点为160℃或更高的溶剂，其中平均粒径 为5μm以下，溶剂的总含量相对于糊剂组合物的总量为25重量％以下，电介质组合物含有无机填料和树脂，其中无机填料包括至少为无机填料 两种平均粒径和平均粒径的最大平均粒径为0.1-5μm，为最小平均粒径的3倍以上。 可以获得线性膨胀系数低的高介电常数组成，并且具有大的电容。

公开(公告)号：US09058912B2

公开(公告)日：2015-06-16

申请号：US12805179

申请日：2010-07-15

申请人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

发明人： Yoshitake Hara ,  Yuka Yamashiki ,  Manabu Kawasaki ,  Toshihisa Nonaka

IPC分类号： C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  H01B3/00 ,  H01B3/40 ,  H01G4/10 ,  H01G4/12 ,  H01G4/20 ,  H05K1/16 ,  H01B3/36

CPC分类号： H01B3/006 ,  H01B3/36 ,  H01B3/40 ,  H01G4/10 ,  H01G4/12 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0209

摘要： A paste composition containing an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 μm or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition containing an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 μm and is 3 times or more the minimum mean particle diameter.

摘要翻译： 一种含有无机填料，树脂和溶剂的糊剂组合物，其中糊料组合物的特征在于它含有一种或多种沸点为160℃或更高的溶剂，其中平均粒径 为5μm以下，溶剂的总含量相对于糊剂组合物的总量为25重量％以下，含有无机填料和树脂的电介质组合物，其中无机填料包括至少为无机填料 两种平均粒径，平均粒径的最大平均粒径为0.1〜5μm，为最小平均粒径的3倍以上。

公开(公告)号：US20130245160A1

公开(公告)日：2013-09-19

申请号：US13990880

申请日：2011-11-28

申请人： Akira Shimada ,  Yoichi Shinba ,  Toshihisa Nonaka

发明人： Akira Shimada ,  Yoichi Shinba ,  Toshihisa Nonaka

IPC分类号： C09J163/00 ,  C09J179/08

CPC分类号： C09J163/00 ,  C08G77/14 ,  C08K3/28 ,  C08K2003/2227 ,  C08L63/00 ,  C08L101/10 ,  C09J7/20 ,  C09J9/02 ,  C09J179/08 ,  C09J183/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  C08L79/08 ,  H01L2924/00

摘要： The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

摘要翻译： 本发明的目的是提供具有高导热性和优异粘合性的粘合剂组合物，并且其中控制导热填料的分散性。 粘合剂组合物构成为含有（A）可溶性聚酰亚胺，（B）环氧树脂和（C）导热性填料。 粘合剂组合物的特征在于，可溶性聚酰亚胺（A）含有作为源自二胺的成分的通式（1）表示的结构，粘合剂组合物中所含的导热性填料（C）的量不小于 60％（体积）。 （通式（1）中，X表示1〜10的整数，n表示1〜20的整数）。

公开(公告)号：US08247338B2

公开(公告)日：2012-08-21

申请号：US12863305

申请日：2009-01-14

申请人： Yoichi Shimba ,  Yoshitake Hara ,  Tsukuru Mizuguchi ,  Toshihisa Nonaka

发明人： Yoichi Shimba ,  Yoshitake Hara ,  Tsukuru Mizuguchi ,  Toshihisa Nonaka

IPC分类号： C04B35/00 ,  C08K3/22 ,  H01G4/10

CPC分类号： H01G4/206 ,  C04B35/4682 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/63404 ,  C04B35/63468 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01B3/12 ,  H01B3/306 ,  H01G4/1227 ,  H05K1/162 ,  H05K2201/0209 ,  C04B41/4529 ,  C04B41/5155 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5041 ,  C04B35/10 ,  C04B35/00 ,  C04B35/565 ,  C04B35/581

摘要： The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.

摘要翻译： 本发明涉及一种高介电常数糊剂组合物，其包含（A）具有钙钛矿晶体结构或复合钙钛矿晶体结构的无机颗粒，（B）由通式（1）至（4）中任一项所示的化合物 和（C）有机溶剂。 本发明提供一种高介电常数电介质组合物的高介电常数糊剂组合物，其具有高绝缘可靠性并在高温高湿度偏压试验中表现出令人满意的电阻。

公开(公告)号：US20120129988A1

公开(公告)日：2012-05-24

申请号：US13381879

申请日：2010-06-23

申请人： Koichi Fujimaru ,  Toshihisa Nonaka ,  Yoshiko Tatsuta

发明人： Koichi Fujimaru ,  Toshihisa Nonaka ,  Yoshiko Tatsuta

IPC分类号： C09J133/24 ,  H01L23/58 ,  H01L21/50 ,  H05K7/00

CPC分类号： C09J179/08 ,  C09J163/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81204 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512

摘要： Provided is an adhesive composition having both excellent storability and excellent connection reliability. The adhesive composition comprises (a) a polyimide soluble in organic solvents, (b) an epoxy compound, (c) particles of a curing accelerator, and (d) inorganic particles, the amounts of the organic-solvent-soluble polyimide (a) and the curing-accelerator particles (c) being 15-90 parts by weight and 0.1-50 parts by weight, respectively, per 100 parts by weight of the epoxy compound (b), and the content of the inorganic particles (d) being 30-80 wt. % of the total amount of (a) to (d).

摘要翻译： 提供具有优异的保存性和良好的连接可靠性的粘合剂组合物。 粘合剂组合物包含（a）可溶于有机溶剂的聚酰亚胺，（b）环氧化合物，（c）固化促进剂颗粒和（d）无机颗粒，有机溶剂可溶性聚酰亚胺（a） 和固化促进剂颗粒（c）相对于100重量份环氧化合物（b）分别为15〜90重量份和0.1-50重量份，无机颗粒（d）的含量为 30-80重量％ （a）至（d）总量的百分比。

公开(公告)号：US20110053759A1

公开(公告)日：2011-03-03

申请号：US12863305

申请日：2009-01-14

申请人： Yoichi Shimba ,  Yoshitake Hara ,  Tsukuru Mizuguchi ,  Toshihisa Nonaka

发明人： Yoichi Shimba ,  Yoshitake Hara ,  Tsukuru Mizuguchi ,  Toshihisa Nonaka

IPC分类号： C04B35/465 ,  H01B3/20

CPC分类号： H01G4/206 ,  C04B35/4682 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/63404 ,  C04B35/63468 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01B3/12 ,  H01B3/306 ,  H01G4/1227 ,  H05K1/162 ,  H05K2201/0209 ,  C04B41/4529 ,  C04B41/5155 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5041 ,  C04B35/10 ,  C04B35/00 ,  C04B35/565 ,  C04B35/581

摘要： The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.

摘要翻译： 本发明涉及一种高介电常数糊剂组合物，其包含（A）具有钙钛矿晶体结构或复合钙钛矿晶体结构的无机颗粒，（B）由通式（1）至（4）中任一项所示的化合物 和（C）有机溶剂。 本发明提供一种高介电常数电介质组合物的高介电常数糊剂组合物，其具有高绝缘可靠性并在高温高湿度偏压试验中表现出令人满意的电阻。

公开(公告)号：US20090123747A1

公开(公告)日：2009-05-14

申请号：US11921560

申请日：2006-06-05

申请人： Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： B32B27/38 ,  B32B33/00 ,  C08L71/02 ,  H01L23/00

CPC分类号： C09J179/08 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J163/00 ,  H01L21/563 ,  H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T428/287 ,  Y10T428/31515 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： [Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a semiconductor wafer provided with bump electrodes of which bump electrodes have a narrow pitch and a high pin proportion, that at the time of dicing, permits a high-speed cutting without any dicing dust contamination or defect, and that facilitates detection of alignment marks at the time of dicing and flip chip assembly.[Means for Solving Problems] There is provided an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

摘要翻译： [问题]提供一种半导体用粘合剂组合物，即使在弯曲时也能够不发生开裂或剥离的情况下进行处理，所以在层叠时允许层压在设置有突起电极的半导体晶片的电极侧 电极具有窄的间距和高的引脚比例，在切割时允许高速切割而没有任何切割粉尘污染或缺陷，并且便于在切割和倒装芯片组装时检测对准标记。 解决问题的手段提供一种半导体用粘合剂组合物，其包含有机溶剂可溶性聚酰亚胺（a），环氧化合物（b）和硬化促进剂（c）），其中，相对于100重量份环氧化合物 b）中，含有15〜90重量份的有机溶剂可溶性聚酰亚胺（a）和0.1〜10重量份的硬化促进剂（c），其中环氧化合物（b）含有在25℃下为液体的化合物 在1.013×10 5 N / m 2的范围内，化合物在25℃下为1.013×10 5 N / m 2，为固体，其中基于所有环氧化合物的液体化合物的比例为20重量％以上至60重量％ 或更少。

公开(公告)号：US20070147767A1

公开(公告)日：2007-06-28

申请号：US11713605

申请日：2007-03-05

申请人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

发明人： Toshihisa Nonaka ,  Noboru Asahi ,  Yoshiko Tatsuta

IPC分类号： G02B6/00

CPC分类号： G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068

摘要： This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10−5/° C. to 4×105/° C., and a true dependency value of its refractive index on the temperature of −1×10−4/° C. to 1×10−4/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.

摘要翻译： 本发明是一种用于光学配线的树脂组合物，其包含平均粒度为1nm至100nm的无机填料和具有n / >（其中n≠f是无机填料的折射率，n r是树脂的折射率）为0.8〜1.2，热膨胀系数为-1×10 -5±5℃至4×10 5 /℃，其折射率的真实依赖性值为-1×10 -4 / 在-20℃至90℃的温度范围内，基本上不能吸收波长在0.6至 0.9μm或1.2-1.6μm。 本发明还提供一种光电子电路板。