公开(公告)号：US09644146B2

公开(公告)日：2017-05-09

申请号：US13821412

申请日：2011-07-14

申请人： Masanobu Mizusaki ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

发明人： Masanobu Mizusaki ,  Yuichiro Yamada ,  Satoshi Enomoto ,  Yuki Hara ,  Hideo Kikuchi

IPC分类号： G02F1/1333 ,  C09K19/56 ,  C09K19/14 ,  C09K19/32 ,  C08F220/30 ,  C09K19/04 ,  G02F1/1337

CPC分类号： C09K19/56 ,  C08F220/30 ,  C09K19/14 ,  C09K19/32 ,  C09K2019/0448 ,  G02F1/133365 ,  G02F1/133788 ,  G02F2001/133726

摘要： The present invention provides a composition for forming a liquid crystal layer which enables to achieve takt time reduction and high display quality. The liquid crystal display device according to the present invention includes a liquid crystal material, and a monomer, the monomer being a compound having a structure that generates ketyl radicals when undergoing a hydrogen abstraction reaction caused by exposure to light.

公开(公告)号：US20120298310A1

公开(公告)日：2012-11-29

申请号：US13567112

申请日：2012-08-06

申请人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： B30B9/00

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。

公开(公告)号：US20100032832A1

公开(公告)日：2010-02-11

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。

公开(公告)号：US07538416B2

公开(公告)日：2009-05-26

申请号：US10991864

申请日：2004-11-19

申请人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

发明人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

摘要翻译： 树脂模制型半导体器件具有：半导体芯片（12），其安装在引线框架（9）的芯片焊盘部分（11）上; 将半导体芯片（12）的端子连接到引线框架（9）的内引线部分（13）的细金属线（14）; 和密封树脂（15），并且引线框架（9）经受镦锻处理，使得支撑部分（11）位于比内部引线部分（13）高的位置。 由于对应于镦粗阶梯差的厚度的密封树脂存在于支撑部分的下方，因此可以提高引线框架和密封树脂之间的粘合性，并且实现高可靠性和变薄。 由于至少一个槽部设置在每个内部引线部分（13）的表面中，所以对密封树脂（15）的锚定效应，作用在产品的引线部分上的应力和对金属细线的应力 （14）可以松弛，并且可以防止导线和细金属线剥离。

公开(公告)号：US06852374B2

公开(公告)日：2005-02-08

申请号：US10232651

申请日：2002-09-03

申请人： Masanobu Mizusaki ,  Tadashi Kawamura ,  Akiyoshi Fujii ,  Yuichiro Yamada

发明人： Masanobu Mizusaki ,  Tadashi Kawamura ,  Akiyoshi Fujii ,  Yuichiro Yamada

IPC分类号： G02F1/1337 ,  G02F1/139

CPC分类号： G02F1/1395 ,  G02F1/133753 ,  G02F1/133788 ,  G02F2001/133761 ,  Y10T428/1005

摘要： A liquid crystal display device includes two substrates, a liquid crystal layer sandwiched between the substrates and two alignment films, each being provided on one surface of associated one of the substrates so as to face the liquid crystal layer. The device defines multiple picture elements. At least one of the two alignment films is made of a polymer material that includes a main chain, an atomic group having a bond that is selectively cut when exposed to an actinic ray and a side chain bonded to the main chain via the atomic group. The polymer material with the side chain can give a pretilt angle of greater than 85 degrees but 90 degrees or less to liquid crystal molecules. The polymer material without the side chain can give a pretilt angle of 2 degrees to 15 degrees to the liquid crystal molecules.

摘要翻译： 液晶显示装置包括两个基板，夹在基板之间的液晶层和两个取向膜，各自设置在相关联的一个基板的一个表面上以面对液晶层。 该设备定义了多个图片元素。 两个取向膜中的至少一个由聚合物材料制成，该聚合物材料包括主链，具有当暴露于光化射线时选择性地切割的键的原子团和经由原子团键合到主链的侧链。 具有侧链的聚合物材料可以给予液晶分子大于85度但为90度或更小的预倾角。 没有侧链的聚合物材料可以给予液晶分子2度至15度的预倾角。

公开(公告)号：US06693358B2

公开(公告)日：2004-02-17

申请号：US09972884

申请日：2001-10-10

申请人： Yuichiro Yamada ,  Tsuyoshi Hamatani

发明人： Yuichiro Yamada ,  Tsuyoshi Hamatani

IPC分类号： H01L2348

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45166 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided. The semiconductor chip has a semiconductor substrate 13, first external electrodes 21 formed on the first surface 14 of the semiconductor substrate 13, second external electrodes 22 formed on the second surface 17 of the semiconductor substrate 13 and through holes 16 created in the semiconductor substrate 13, wherein the through holes 16 are provided in the inclined planes 15 formed so that the inner angles made up of the second surface 17 and the inclined planes 15 are obtuse angles and the first external electrodes 21 and the second external electrodes 22 are electrically connected through conductive patterns 19 formed so as to follow the inner walls of the through holes 16 and the inclined planes 15.

摘要翻译： 即使在多个半导体芯片层叠在布线基板上的情况下，半导体芯片也不会增加半导体器件的厚度或电路板面积，其中半导体芯片被层叠，并且不增加半导体芯片之间的线长度 其工艺以及半导体器件等。半导体芯片具有半导体衬底13，形成在半导体衬底13的第一表面14上的第一外部电极21，形成在半导体衬底13上的第二外部电极22 半导体基板13的第二表面17和在半导体基板13中形成的通孔16，其中通孔16设置在倾斜平面15中，使得由第二表面17和倾斜平面15构成的内角是 钝角和第一外部电极21和第二外部电极22通过导电性电连接 erns 19形成为跟随通孔16和倾斜平面15的内壁。

公开(公告)号：US06266115B1

公开(公告)日：2001-07-24

申请号：US08709783

申请日：1996-09-09

申请人： Takayuki Fujikawa ,  Akira Takeuchi ,  Norio Yamamoto ,  Yuichiro Yamada ,  Masaaki Ozaki

发明人： Takayuki Fujikawa ,  Akira Takeuchi ,  Norio Yamamoto ,  Yuichiro Yamada ,  Masaaki Ozaki

IPC分类号： G02F11337

CPC分类号： C09K19/0266 ,  C09K19/2021 ,  G02F1/1337 ,  G02F1/141 ,  G02F2001/1412 ,  G09G3/3633

摘要： A liquid crystal cell and liquid crystal display device include: two electrode substrates facing each other through a plurality of spacers; each electrode substrate being formed by superimposing a glass substrate, a transparent electrode and an alignment film; and an antiferroelectric liquid crystal being injected between alignment films; wherein, an alignment treatment is performed to each alignment film so that an angle of layer rotation of the antiferroelectric liquid crystal is defined within a predetermined allowable range.

摘要翻译： 液晶单元和液晶显示装置包括：通过多个间隔物彼此面对的两个电极基板; 每个电极基板通过叠加玻璃基板，透明电极和取向膜而形成; 并且在取向膜之间注入反铁电液晶; 其中，对每个取向膜进行取向处理，使得反铁电液晶的层旋转角度被限定在预定的允许范围内。

公开(公告)号：US5723299A

公开(公告)日：1998-03-03

申请号：US417103

申请日：1995-04-05

申请人： Graeme I. Bell ,  Yuichiro Yamada ,  Susumu Seino

发明人： Graeme I. Bell ,  Yuichiro Yamada ,  Susumu Seino

IPC分类号： G01N33/53 ,  A61K39/395 ,  C07K14/575 ,  C07K14/655 ,  C07K14/705 ,  C07K14/72 ,  C07K16/00 ,  C12N1/19 ,  C12N1/21 ,  C12N5/10 ,  C12N15/00 ,  C12N15/09 ,  C12N15/12 ,  C12P21/02 ,  C12P21/08 ,  C12R1/91 ,  G01N33/566

CPC分类号： C07K14/723

摘要： The invention relates generally to compositions of and methods for obtaining somatostatin receptors. The invention relates as well to the DNA sequences encoding somatostatin receptors, the recombinant vectors carrying those sequences, the recombinant host cells including either the sequences or vectors, and recombinant somatostatin receptor polypeptides. By way of example, the invention discloses the cloning and functional expression of at least three different somatostatin receptors, SSTR1, SSTR2 and SSTR3 from two different mammalian sources. The invention includes as well, methods for using the isolated, recombinant receptor polypeptides in assays designed to select and improve substances capable of interacting with somatostatin receptor polypeptides for use in diagnostic, drug design and therapeutic applications.

摘要翻译： 本发明一般涉及用于获得生长抑素受体的组合物和方法。 本发明还涉及编码生长抑素受体的DNA序列，携带这些序列的重组载体，包含序列或载体的重组宿主细胞和重组生长抑素受体多肽。 举例来说，本发明公开了来自两种不同哺乳动物来源的至少三种不同生长抑素受体SSTR1，SSTR2和SSTR3的克隆和功能表达。 本发明还包括在测定中使用分离的重组受体多肽的方法，其设计用于选择和改善能够与生长抑素受体多肽相互作用的物质，用于诊断，药物设计和治疗应用。

公开(公告)号：US5501739A

公开(公告)日：1996-03-26

申请号：US158305

申请日：1993-11-29

申请人： Yuichiro Yamada ,  Naoki Suzuki ,  Ryuzo Houchin ,  Noboru Nomura ,  Kousaku Yano ,  Yuka Terai

发明人： Yuichiro Yamada ,  Naoki Suzuki ,  Ryuzo Houchin ,  Noboru Nomura ,  Kousaku Yano ,  Yuka Terai

IPC分类号： H01L21/205 ,  B05D1/18 ,  B05D7/24 ,  C23C16/54 ,  H01L21/302 ,  C23C16/00

CPC分类号： B82Y30/00 ,  B05D1/185 ,  B05D1/60 ,  B82Y40/00 ,  C23C16/54

摘要： A forming apparatus of a thin film includes a processing chamber where a predetermined process is carried out on a surface of a supplied substrate. A feeding device is provided in the processing chamber for feeding material to form an organic molecular layer including silicon or germanium on the surface of the substrate. A forming method of a thin film includes the steps of forming the thin film on the surface of the supplied substrate in the processing chamber, and feeding material for forming the organic molecular layer, including silicon or germanium, on the formed thin film on the surface of the substrate through a feeding device in the processing chamber, and then forming the organic molecular layer on the surface of the substrate.

摘要翻译： 薄膜的形成装置包括处理室，其中在所提供的基板的表面上进行预定的处理。 在处理室中设置有供给装置，用于供给材料以在基板的表面上形成包括硅或锗的有机分子层。 薄膜的形成方法包括以下步骤：在处理室中供应的基板的表面上形成薄膜，以及在表面上形成的薄膜上形成有机分子层（包括硅或锗）的材料 通过处理室中的进料装置，然后在基材表面上形成有机分子层。

公开(公告)号：US5436155A

公开(公告)日：1995-07-25

申请号：US816283

申请日：1991-12-31

申请人： Graeme I. Bell ,  Yuichiro Yamada ,  Susumu Seino

发明人： Graeme I. Bell ,  Yuichiro Yamada ,  Susumu Seino

IPC分类号： G01N33/53 ,  A61K39/395 ,  C07K14/575 ,  C07K14/655 ,  C07K14/705 ,  C07K14/72 ,  C07K16/00 ,  C12N1/19 ,  C12N1/21 ,  C12N5/10 ,  C12N15/00 ,  C12N15/09 ,  C12N15/12 ,  C12P21/02 ,  C12P21/08 ,  C12R1/91 ,  G01N33/566 ,  C07K14/71

CPC分类号： C07K14/723

摘要： The invention relates generally to compositions of and methods for obtaining somatostatin receptors. The invention relates as well to the DNA sequences encoding somatostatin receptors, the recombinant vectors carrying those sequences, the recombinant host cells including either the sequences or vectors, and recombinant somatostatin receptor polypeptides. By way of example, the invention discloses the cloning and functional expression of at least three different somatostatin receptors, SSTR1, SSTR2 and SSTR3 from two different mammalian sources. The invention includes as well, methods for using the isolated, recombinant receptor polypeptides in assays designed to select and improve substances capable of interacting with somatostatin receptor polypeptides for use in diagnostic, drug design and therapeutic applications.

摘要翻译： 本发明一般涉及用于获得生长抑素受体的组合物和方法。 本发明还涉及编码生长抑素受体的DNA序列，携带这些序列的重组载体，包含序列或载体的重组宿主细胞和重组生长抑素受体多肽。 举例来说，本发明公开了来自两种不同哺乳动物来源的至少三种不同生长抑素受体SSTR1，SSTR2和SSTR3的克隆和功能表达。 本发明还包括在测定中使用分离的重组受体多肽的方法，其设计用于选择和改善能够与生长抑素受体多肽相互作用的物质，用于诊断，药物设计和治疗应用。