-
公开(公告)号：US11772227B2
公开(公告)日：2023-10-03
申请号：US16837975
申请日：2020-04-01
发明人： James Jeng-Jyi Hwang , He Hui Peng , Jiann Lih Wu , Chi-Ming Yang
CPC分类号： B24B37/042 , B24B37/20
摘要： An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a slurry temperature control device coupled to the shiny dispenser and configured to control a temperature of the abrasive slurry. The slurry temperature control device includes a heat transferring portion surrounding a portion of the slurry dispenser, and a thermos-electric (TE) chip coupled to the heat transferring portion and configured to control the temperature of the abrasive slurry.
-
公开(公告)号：US20230264319A1
公开(公告)日：2023-08-24
申请号：US18094225
申请日：2023-01-06
CPC分类号： B24B41/061 , B24B37/20
摘要： A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism. Embodiments of the present disclosure will provide a method of supporting a buffing pad in a horizontal pre-clean module. The method includes mechanically clamping or retaining a buffing pad on a peripheral edge of the buffing pad, wherein the coupling base and the pad carrier are coupled and disposed in a horizontal pre-clean module, and supporting the buffing pad and preventing the buffing pad from sagging, by use of one or more pad retaining features.
-
公开(公告)号：US20230256567A1
公开(公告)日：2023-08-17
申请号：US18306170
申请日：2023-04-24
IPC分类号： B24D11/00 , B29C64/112 , B29C64/393 , B33Y30/00 , B33Y80/00 , B33Y50/02 , B33Y10/00 , B29C64/282 , B29C64/40 , C09G1/16
CPC分类号： B24D11/006 , B29C64/40 , B29C64/112 , B29C64/282 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , C09G1/16 , B24B37/20
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
-
公开(公告)号：US20190030675A1
公开(公告)日：2019-01-31
申请号：US15664092
申请日：2017-07-31
发明人： Kei-Wei Chen , Chih Hung Chen
IPC分类号： B24B37/015 , B24B37/20
CPC分类号： B24B37/015 , B24B37/20 , B24B37/30 , B24B53/017
摘要： A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
-
公开(公告)号：US10074542B2
公开(公告)日：2018-09-11
申请号：US15267183
申请日：2016-09-16
发明人： Akihiro Kubo , Teruhiko Kodama
IPC分类号： B24B37/20 , H01L21/304 , H01L21/67 , H01L21/02 , H01L21/308
CPC分类号： H01L21/304 , B24B37/20 , H01L21/02052 , H01L21/0274 , H01L21/3043 , H01L21/3086 , H01L21/6704 , H01L21/67051 , H01L21/67092 , H01L21/67219 , H01L21/68728 , H01L21/68742 , H01L21/6875
摘要： There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.
-
公开(公告)号：US09987720B2
公开(公告)日：2018-06-05
申请号：US15008707
申请日：2016-01-28
摘要： A method for operating a polishing head is provided. The method includes keeping a stator of at least one electromagnetism actuated pressure sector stationary with respect to a carrier head, and electromagnetically and linearly moving an active cell of the electromagnetism actuated pressure sector with the stator to linearly move the active cell with respect to the carrier head.
-
公开(公告)号：US09962805B2
公开(公告)日：2018-05-08
申请号：US15136706
申请日：2016-04-22
IPC分类号： B24B37/00 , B24B37/20 , B24B37/005
CPC分类号： B24B37/20 , B24B37/005 , B24B37/30
摘要： A polisher head of a polishing apparatus includes a membrane and a first local pressure nodule and a second local pressure nodule physically contacting the membrane. The first local pressure nodule is configured to apply a first local force to the membrane and the second local pressure nodule is configured to apply a second local force to the membrane. The first local pressure nodule and the second local pressure nodule are independently controllable.
-
公开(公告)号：US09950405B2
公开(公告)日：2018-04-24
申请号：US14445867
申请日：2014-07-29
申请人： Semiconductor Manufacturing International (Beijing) Corporation , Semiconductor Manufacturing International (Shanghai) Corporation
发明人： Wufeng Deng
IPC分类号： B24B37/04 , H01L21/306 , B24B57/02 , H01L21/321 , H01L21/67 , B24B37/20 , B24B37/24 , B23H3/02 , B24D3/00 , H05K3/07 , B23H7/14
CPC分类号： B24B37/04 , B23H3/02 , B23H7/14 , B24B37/044 , B24B37/046 , B24B37/20 , B24B37/24 , B24B57/02 , B24D3/00 , H01L21/30625 , H01L21/32115 , H01L21/3212 , H01L21/32125 , H01L21/67051 , H01L21/6715 , H05K3/07
摘要： A chemical mechanical planarization (CMP) apparatus is provided. The CMP apparatus includes at least one platen; and a polishing pad disposed on the platen. The CMP apparatus also includes a polishing head disposed above the platen and configured to clamp a to-be-polished wafer; and a basic solution supply port disposed above the platen and configured to supply a basic solution onto a surface of the polishing pad. Further, the CMP apparatus includes a slurry arm disposed above the platen and configured to supply a polish slurry on the surface of the polishing pad; and a deionized water supply port configured to supply deionized water onto the surface of the polishing pad. Further, the CMP apparatus also includes a negative power source configured to apply a negative voltage onto the surface of the polishing pad.
-
公开(公告)号：US20180079147A1
公开(公告)日：2018-03-22
申请号：US15494332
申请日：2017-04-21
CPC分类号： G01B11/0608 , B24B37/20 , B24B37/245 , B24B37/26 , B24D18/009 , B29C64/112 , B29C64/129 , B29C64/277 , B29C64/386 , B29L2031/736 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y80/00 , G01N2015/1075 , G01N2015/1493
摘要： A method of additive manufacturing includes dispensing successive layers of feed material to form a polishing pad, and directing first and second radiation beams toward the layers of feed material to form a polishing pad. Dispensing each successive layer of the layers of feed material includes dispensing a drop of feed material, and directing the first and second radiation beams toward the layers of feed material includes, for each successive layer, directing the first radiation beam toward the drop of feed material to cure an exterior surface of the drop of feed material, and directing the second radiation beam toward the drop of feed material to cure an interior volume of the drop of feed material.
-
公开(公告)号：US09884400B2
公开(公告)日：2018-02-06
申请号：US14872370
申请日：2015-10-01
发明人： Chung-Chih Feng , I-Peng Yao , Wen-Chieh Wu , Hsin-Ru Song
CPC分类号： B24B37/20 , B24B37/22 , B24B37/24 , B24D3/28 , B24D18/0027
摘要： The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.
-
-
-
-
-
-
-
-
-
搜索结果
573 条记录 (耗时 0.027 秒)
