公开(公告)号：US08759713B2

公开(公告)日：2014-06-24

申请号：US12484225

申请日：2009-06-14

申请人： Jayna Sheats

发明人： Jayna Sheats

IPC分类号： B23K26/38

CPC分类号： H01L29/0657 ,  H01L23/5389 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49147 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process bonds multiple interconnect wires to bond pads with electrical linkages between the bond pads and then subsequently separates the adjacent bond pads.

摘要翻译： 本发明公开了用于分离IC制造和组装分离的IC部件以形成完整IC结构的方法和装置。 在一个实施例中，将IC结构分成多个分立组件的本发明可以利用专用IC制造设备的优点并实现更具成本效益的产品。 在另一个实施例中，本芯片组装在接合焊盘之间提供高密度互连线，从而实现小芯片组件的经济有效的组装。 在一个方面，本发明的方法将多个互连线连接到在接合焊盘之间具有电连接的焊盘，然后随后分离相邻的接合焊盘。

公开(公告)号：US20140004660A1

公开(公告)日：2014-01-02

申请号：US13539188

申请日：2012-06-29

申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

IPC分类号： H01L21/50

CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

公开(公告)号：US08461694B1

公开(公告)日：2013-06-11

申请号：US13715771

申请日：2012-12-14

申请人： UTAC Thai Limited

发明人： Saravuth Sirinorakul

IPC分类号： H01L23/48

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.

摘要翻译： 封装包括第一电镀区域，第二电镀区域，附接到第一电镀区域的管芯，以及将管芯耦合到第二电镀区域的接合。 该封装还包括封装第一和第二电镀区域的管芯，接合和顶表面的模制件，使得第一和第二电镀区域的底表面暴露在封装外部。 另外的实施例包括制造包装的方法。

公开(公告)号：US20130143365A1

公开(公告)日：2013-06-06

申请号：US13757231

申请日：2013-02-01

申请人： Masafumi MATSUMOTO ,  Tatsuya IWASA ,  Junji YAMADA ,  Masaru FURUKAWA

发明人： Masafumi MATSUMOTO ,  Tatsuya IWASA ,  Junji YAMADA ,  Masaru FURUKAWA

IPC分类号： H01L23/00

CPC分类号： H01L24/43 ,  H01L23/053 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/43 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

摘要翻译： 半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。 金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

公开(公告)号：US08410586B2

公开(公告)日：2013-04-02

申请号：US12247031

申请日：2008-10-07

申请人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

发明人： Edmund Riedl ,  Steffen Jordan ,  Christof Matthias Schilz ,  Fee Hoon Wong

IPC分类号： H01L21/50 ,  H01L23/495

CPC分类号： H01L23/3142 ,  C25D3/56 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.

摘要翻译： 半导体封装包括半导体部件，其包括具有多个内部接触焊盘的电路载体，半导体芯片和多个电连接。 粘合促进层设置在半导体部件的至少一部分上，并且塑料封装材料至少封装半导体芯片，多个电连接和多个内部接触焊盘。 选择性地激活半导体部件的表面区域。

公开(公告)号：US08399976B2

公开(公告)日：2013-03-19

申请号：US12247515

申请日：2008-10-08

申请人： Masafumi Matsumoto ,  Tatsuya Iwasa ,  Junji Yamada ,  Masaru Furukawa

发明人： Masafumi Matsumoto ,  Tatsuya Iwasa ,  Junji Yamada ,  Masaru Furukawa

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/43 ,  H01L23/053 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/43 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

摘要翻译： 半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。 金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

公开(公告)号：US08387238B2

公开(公告)日：2013-03-05

申请号：US12484230

申请日：2009-06-14

申请人： Jayna Sheats

发明人： Jayna Sheats

IPC分类号： H01R43/00 ,  H01L21/44

CPC分类号： H01L21/76867 ,  H01L23/52 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/18 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49117 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process provides multiple interconnect wires in the form of a ribbon between the bond pads, and then subsequently separates the ribbon into multiple individual interconnect wires.

公开(公告)号：US20130042960A1

公开(公告)日：2013-02-21

申请号：US13578740

申请日：2011-04-29

申请人： Christoph B. Luechinger ,  Orlando L. Valentin ,  Tao Xu

发明人： Christoph B. Luechinger ,  Orlando L. Valentin ,  Tao Xu

IPC分类号： B29C65/08 ,  H01L31/18

CPC分类号： H01L31/18 ,  H01L24/45 ,  H01L31/0504 ,  H01L31/188 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/13091 ,  Y02E10/50 ,  H01L2224/48 ,  H01L2924/00

摘要： An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.

摘要翻译： 提供超声波粘接机。 超声波接合机包括在接合操作期间构造成支撑工件的支撑结构。 所述超声波接合装置还包括位于所述支撑结构上方的上部接合工具，其被配置为将上部接合材料接合到所述工件的上侧;以及下部接合工具，其位于所述支撑结构的下方，并且被配置为将下部接合材料接合到 工件的下侧。 超声波接合机也可以是被配置为将上导电带和下导电带接合到太阳能基板的超声波带接合机。

公开(公告)号：US08375577B2

公开(公告)日：2013-02-19

申请号：US12133335

申请日：2008-06-04

申请人： Will Wong ,  Nghia Thuc Tu ,  Jaime Bayan ,  David Chin

发明人： Will Wong ,  Nghia Thuc Tu ,  Jaime Bayan ,  David Chin

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T428/12438 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/83205 ,  H01L2924/00012

摘要： The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. In one embodiment, a foil carrier structure is formed by ultrasonically bonding portions of a conductive foil to a metallic carrier. The bonded portions define panels in the foil carrier structure. In some embodiments, the foil carrier structure is cut to form multiple isolated panels that are sealed along their peripheries. Each isolated panel may be approximately the size of a conventional leadframe strip or panel. As a result, existing packaging equipment may be used to add dice, bonding wires and molding material to the panel. The ultrasonic welding helps prevent unwanted substances from penetrating the foil carrier structure during such processing steps. After the carrier portion of the molded foil carrier structure is removed, the structure is singulated into integrated circuit packages. Some embodiments relate to methods that utilize some or all of the aforementioned operations. Other embodiments relate to arrangements used in the above processes.

摘要翻译： 本发明涉及使用薄箔在集成电路封装中形成电互连的方法和布置。 在一个实施例中，通过将导电箔的部分超声波结合到金属载体上来形成箔载体结构。 接合部分限定箔载体结构中的面板。 在一些实施例中，切割箔载体结构以形成沿其周边密封的多个隔离板。 每个隔离的面板可以是常规引线框条或面板的尺寸。 因此，可以使用现有的包装设备将骰子，接合线和模制材料添加到面板。 超声波焊接有助于防止在这种加工步骤期间不需要的物质渗透到箔片载体结构。 在模制的箔载体结构的载体部分被去除之后，将结构分成集成电路封装。 一些实施例涉及利用上述操作中的一些或全部的方法。 其他实施例涉及上述方法中使用的布置。

公开(公告)号：US08360304B2

公开(公告)日：2013-01-29

申请号：US13381140

申请日：2010-07-19

申请人： Sung Sig Kang ,  Hing Kuong Wong ,  Samuel Capistrano, III ,  Abdul Shukor Mohd Salleh ,  Wun Man Oranna Yauw

发明人： Sung Sig Kang ,  Hing Kuong Wong ,  Samuel Capistrano, III ,  Abdul Shukor Mohd Salleh ,  Wun Man Oranna Yauw

IPC分类号： B23K31/00 ,  B23K5/22

CPC分类号： B23K37/0426 ,  B23K20/007 ,  B23K20/10 ,  B23K37/0408 ,  B23K2101/42 ,  H01L24/78 ,  H01L2224/4824 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.

摘要翻译： 提供一种操作引线接合机的方法。 该方法包括以下步骤：（1）通过引线接合机的装置夹具提供固定在接合位置的工件; （2）将所述装置夹具升高到所述工件上方的第一高度，所述装置夹具在第一高度处保持第一预定时间段; 和（3）在步骤（2）之后将装置夹紧件升高到工件上方的第二高度，第二高度比第一高度更远离工件。