公开(公告)号：US20050282415A1

公开(公告)日：2005-12-22

申请号：US11027215

申请日：2004-12-29

Applicant: Ping Wang ,  Yan-Fang Li

Inventor： Ping Wang ,  Yan-Fang Li

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.

Abstract translation: 一种具有改进的焊盘的印刷电路板，用于防止由围绕焊盘的电路的轴向引线（30,31）引起的印刷电路板的短路，包括一对通孔（10,11），一对 围绕对应的通孔的第一焊盘（20,21）和与相应的第一焊盘相邻的一对第二焊盘（40,41）。 当使用贴片机将部件插入印刷电路板的通孔时，从第一焊盘延伸出来的轴向引线的弯曲部分将落入第二焊盘。

公开(公告)号：US20050270620A1

公开(公告)日：2005-12-08

申请号：US10863638

申请日：2004-06-08

Applicant: Frederick Bauer ,  Robert Turnbull ,  Thomas Guarr ,  Leroy Kloeppner ,  David Eaton ,  Joel Stray ,  Barry Nelson

Inventor： Frederick Bauer ,  Robert Turnbull ,  Thomas Guarr ,  Leroy Kloeppner ,  David Eaton ,  Joel Stray ,  Barry Nelson

IPC: B60R1/08 ,  B60R1/12 ,  G02B27/00 ,  G02F1/15 ,  H05K1/02 ,  H05K1/03 ,  H05K3/32

CPC classification number: B60R1/12 ,  B60R1/088 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2054

Abstract: According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first substrate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.

Abstract translation: 根据本发明，后视镜包括具有前表面和后表面的第一基板，设置在第一基板的表面上的反射涂层以及固定到第一基板的后表面的电子电路部件。 镜元件可以是电致变色镜元件，其包括位于第一衬底前面的透明第二衬底。 固定到后表面的电子部件可以是用于电致变色镜元件的驱动电路的部件。 后视镜元件还可以包括设置在电耦合到电气部件的第一基板的后表面上的导电跟踪。 跟踪可以用于将驱动电路电耦合到电致变色镜元件的电极。 可以使用包括喷墨印刷技术的许多方法将痕迹沉积在后表面上。

公开(公告)号：US20050265009A1

公开(公告)日：2005-12-01

申请号：US10953790

申请日：2004-09-30

Applicant: Thomas Fussinger ,  Dennis Thompson

Inventor： Thomas Fussinger ,  Dennis Thompson

IPC: G01R31/02 ,  G01R31/28 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K7/06

CPC classification number: G01R31/2812 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09663 ,  H05K2201/10651 ,  H05K2203/168 ,  Y02P70/611 ,  Y02P70/613

Abstract: The invention provides an arrangement and method for detecting shorts between solder pads 31-34 in the production testing of circuit boards. The invention is particularly suitable for circuits driven by a constant current source or sink 6. By providing a conductor 101-103 between the solder pads, connected by a resistive path 11 to a source of potential 12, an additional current will flow through the resistive path to the solder pads if a short circuit exists in the region wherein the conductor is positioned. The additional current can be detected by applying a test probe in a circuit including the solder pads. The invention also provides an arrangement and method for detecting whether a polarity sensitive component 1 has been correctly connected to terminals 4, 5 on the circuit board. The component 1 can be a capacitor having one relatively wide positive terminal 2 and one relatively narrow negative terminal 3. The positive and negative terminals are intended to be connected to a positive and a negative connector respectively on the circuit board. Auxiliary pads 6a, 6b coupled to the positive connector 4 are provided juxtaposed with the negative connector 5 such that, if the capacitor is wrongly placed, the positive terminal 2 of the capacitor connects the negative connector 5 with the auxiliary connector 6a, 6b. Thus, the capacitor 1 is short-circuit and the misplacement can be detected by a suitable testing method.

Abstract translation: 本发明提供一种用于检测电路板生产测试中焊盘31-34之间的短路的布置和方法。 本发明特别适用于由恒流源或汇6驱动的电路。 通过在阻焊路径11连接到电位12的焊盘之间提供导体101-103，如果在导体是的区域中存在短路，附加电流将流过阻焊路径到焊盘 定位。 可以通过在包括焊盘的电路中施加测试探针来检测附加电流。 本发明还提供一种用于检测极性敏感元件1是否已经正确地连接到电路板上的端子4,5的布置和方法。 元件1可以是具有一个相对宽的正极端子2和一个相对窄的负极端子3的电容器。 正极和负极端子分别连接到电路板上的正极和负极连接器。 耦合到正极连接器4的辅助焊盘6a，6b与负极连接器5并置，使得如果电容器被错误地放置，电容器的正极端子2将负极连接器5与辅助连接器6a连接， 6 b。 因此，电容器1是短路的，并且可以通过合适的测试方法检测错位。

公开(公告)号：US06697215B2

公开(公告)日：2004-02-24

申请号：US09858108

申请日：2001-05-15

Applicant: Mikio Sekine

Inventor： Mikio Sekine

IPC: G11B1702

CPC classification number: H05K1/141 ,  H02K11/215 ,  H02K11/33 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2201/10939

Abstract: An index signal output device where a magnetic flux detector is moved in the direction of a relevant tangent to the circumference of a rotor yoke so that the phase difference between an index signal detected by the magnetic flux detector and an index reference signal previously recorded on a floppy disk is within a prescribed range. The lead terminals of the magnetic flux detector are connected to detection signal output terminals on a printed circuit board, and the magnetic flux detector is moved for adjustment in the direction of the tangent by flexing the lead terminals using a tool.

Abstract translation: 一种索引信号输出装置，其中磁通检测器沿与转子轭的圆周相切的切线的方向移动，使得由磁通检测器检测到的指标信号和先前记录在转子轭上的指标参考信号之间的相位差 软盘在规定范围内。 磁通检测器的引线端子连接到印刷电路板上的检测信号输出端子，并且通过使用工具使引线端子弯曲来使磁通量检测器沿切线方向移动。

公开(公告)号：US06677707B1

公开(公告)日：2004-01-13

申请号：US09612163

申请日：2000-07-08

Applicant: Thomas Dietiker

Inventor： Thomas Dietiker

IPC: H01L3300

CPC classification number: H05K3/3426 ,  H01L33/62 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10787 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00012

Abstract: A unique side mounted LED and side sensing photo-transistor with free-end contacts, useful for thin profile side and back lighting and low-profile touch screen photo-circuits, and a method of manufacturing the side mounted side emitting or sensing photo circuit components.

Abstract translation: 独特的侧面安装的LED和具有自由端触点的侧面感测光电晶体管，用于薄型侧面和背面照明以及低调触摸屏光电路，以及制造侧面安装侧发射或感测光电路部件的方法 。

公开(公告)号：US20030134528A1

公开(公告)日：2003-07-17

申请号：US10341468

申请日：2003-01-14

Applicant: YAZAKI CORPORATION

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: H01R012/00

CPC classification number: B60R16/0238 ,  H01R9/2466 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/2036 ,  Y10S439/949

Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.

Abstract translation: 端子安装结构包括板（21）。 该结构包括安装在板上的端子（26）。 端子包括可移除地连接到连接部件（16,17,18）的第一端（26a）。 端子包括在升高位置焊接到板的第二端（26b）。 端子包括在端子的中间并且相对于相应的第一和第二端成各个角度的弯曲部分（26d）。 该结构包括面对板的保持构件（30,40），并且保持弯曲部分。

公开(公告)号：US06515244B1

公开(公告)日：2003-02-04

申请号：US09971904

申请日：2001-10-05

Applicant: Brooks H Danley ,  Steven Douglas Thomson ,  Duane Zedric Collins ,  Paul Alfred Behrendsen

Inventor： Brooks H Danley ,  Steven Douglas Thomson ,  Duane Zedric Collins ,  Paul Alfred Behrendsen

IPC: H01H900

CPC classification number: H05K1/189 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/055 ,  H05K2201/10083 ,  H05K2201/10424 ,  H05K2201/10651

Abstract: An actuator housing isolator plate is used in an actuator array having two or more actuator assemblies connected to each other by a flexible circuit. The isolator plate prevents the actuator housings, in which the actuator assemblies are disposed, from contacting the flexible circuit. Thus, the likelihood of the actuator housings shorting out the flexible circuit is eliminated. The isolator plate further includes isolator posts that prevent the flexible circuit from contacting itself when it is folded over on top of the actuator housings.

Abstract translation: 致动器壳体隔离板用于具有通过柔性电路彼此连接的两个或更多个致动器组件的致动器阵列。 隔离板防止其中设置有致动器组件的致动器壳体接触柔性电路。 因此，消除了致动器壳体使柔性电路短路的可能性。 隔离板还包括隔离柱，当隔离器柱折叠在致动器壳体的顶部上时，防止柔性电路自身接触。

公开(公告)号：US06432745B1

公开(公告)日：2002-08-13

申请号：US08866064

申请日：1997-05-30

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L2144

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US20010053040A1

公开(公告)日：2001-12-20

申请号：US09858108

申请日：2001-05-15

Applicant: Alps Electric Co., Ltd.

Inventor： Mikio Sekine

IPC: G11B017/02

CPC classification number: H05K1/141 ,  H02K11/215 ,  H02K11/33 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2201/10939

Abstract: An index signal output device where a magnetic flux detector is moved in the direction of a relevant tangent to the circumference of a rotor yoke so that the phase difference between an index signal detected by the magnetic flux detector and an index reference signal previously recorded on a floppy disk is within a prescribed range. The lead terminals of the magnetic flux detector are connected to detection signal output terminals on a printed circuit board, and the magnetic flux detector is moved for adjustment in the direction of the tangent by flexing the lead terminals using a tool.

Abstract translation: 一种索引信号输出装置，其中磁通检测器沿与转子轭的圆周相切的切线的方向移动，使得由磁通检测器检测到的指标信号和先前记录在转子轭上的指标参考信号之间的相位差 软盘在规定范围内。 磁通检测器的引线端子连接到印刷电路板上的检测信号输出端子，并且通过使用工具使引线端子弯曲来使磁通量检测器沿切线方向移动。

公开(公告)号：US06246587B1

公开(公告)日：2001-06-12

申请号：US09204531

申请日：1998-12-03

Applicant: Philip H. Chen

Inventor： Philip H. Chen

IPC: H05K332

CPC classification number: H01R4/04 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.

Abstract translation: 具有更高安装强度的表面贴装器件封装及其方法。 在一个实施例中，电子设备由设备封装和一个或多个导电端子组成。 对于表面安装，器件端子各自设置有使用导电粘合剂粘合到电路板上的相应接触焊盘的安装表面。 端子还设置有跨过安装表面的至少一个凹槽。 当使用导电粘合剂将装置安装在电路板上时，该槽用于将导电粘合剂形成在接触垫上的脊或“阻挡”。 这提供了增加的安装强度，这可以消除额外的粘合剂材料对装置的侧面加强的需要，从而允许电路板上的装置的堆积密度的增加。