公开(公告)号：US07975369B2

公开(公告)日：2011-07-12

申请号：US12565537

申请日：2009-09-23

Applicant: Ryan Adam Conger ,  Robert Ivan Rose ,  Dale Stewart Apgar ,  Robert Paul Stachow, Jr.

Inventor： Ryan Adam Conger ,  Robert Ivan Rose ,  Dale Stewart Apgar ,  Robert Paul Stachow, Jr.

IPC: B23P19/00

CPC classification number: H05K1/148 ,  H05K3/0064 ,  H05K2201/056 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53261 ,  Y10T29/53265

Abstract: A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other.

Abstract translation: 电路板组装夹具用于组装电路板组件。 该固定装置包括各自包括第一侧和相对的第二侧的支撑表面，其中每个第一侧使用至少一个柔性电路接收至少一个固定电路来耦合在一起。 固定装置还包括至少一个铰链以将支撑表面联接在一起，其中铰链使得支撑表面能够相对于彼此折叠成期望的对准并为组件提供结构支撑。 此外，固定装置包括从表面第一侧延伸的至少一个紧固机构，以将固定电路相对于支撑表面保持在适当的位置。 此外，固定装置包括至少一个保持器，其联接到至少一个支撑表面，以保持每个支撑表面相对于彼此的对准。

公开(公告)号：US20110140264A1

公开(公告)日：2011-06-16

申请号：US13024910

申请日：2011-02-10

Applicant: TAKAO YAMAZAKI

Inventor： TAKAO YAMAZAKI

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5387 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/92225 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00015 ,  H01L2224/0401

Abstract: There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package (FIG. 1).

Abstract translation: 提供了一种廉价的半导体器件，可以堆叠商业和质量保证（检查）的芯片尺寸封装，并且具有小的共平面度值和高安装可靠性。 一种半导体器件，其中柔性电路基板粘附到半导体封装的横向侧的至少一部分，并且位于半导体封装的焊球侧的柔性电路基板在内部的区域内折叠 的半导体封装的边缘（图1）。

公开(公告)号：US07924228B2

公开(公告)日：2011-04-12

申请号：US11993734

申请日：2006-07-11

Applicant: Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

Inventor： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

IPC: H01Q1/38 ,  H01Q1/00 ,  H01Q7/08

CPC classification number: H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

Abstract: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

Abstract translation: 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

公开(公告)号：US07889504B2

公开(公告)日：2011-02-15

申请号：US11961490

申请日：2007-12-20

Applicant: Wen-Jen Liau ,  Jin-Ching Guo ,  Ching-Sheng Chang ,  Hsin-Shun Chen

Inventor： Wen-Jen Liau ,  Jin-Ching Guo ,  Ching-Sheng Chang ,  Hsin-Shun Chen

IPC: H05K7/20

CPC classification number: H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/10053

Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.

Abstract translation: 一种便携式电子设备包括：具有相对的第一和第二表面并且设置有至少一个电子部件的印刷电路板，所述第一表面设置有电耦合到所述电子部件的至少一个导电焊盘; 以及柔性电路板，其具有堆叠在印刷电路板的第二表面上的主要部分，以及从主体部分延伸并折叠并叠放在印刷电路板的第一表面上的延伸部分。 延伸部分上设置有至少一个导电凸块。 主要部件的外表面设置有电耦合到导电凸块的至少一个输入键。 导电焊盘接合到导电凸块上。

公开(公告)号：US20100279742A1

公开(公告)日：2010-11-04

申请号：US12810794

申请日：2008-09-30

Applicant: Akihiro Miyashita ,  Hideki Kuga ,  Takahiro Naruse

Inventor： Akihiro Miyashita ,  Hideki Kuga ,  Takahiro Naruse

IPC: H04W88/02

CPC classification number: G02F1/13452 ,  G02F1/133385 ,  G02F1/133605 ,  G02F2001/133317 ,  G02F2001/133334 ,  G02F2201/50 ,  H04M1/0266 ,  H05K1/147 ,  H05K1/18 ,  H05K2201/056 ,  H05K2201/10136

Abstract: Disclosed is an electronic device which is formed thin while maintaining good display by a liquid crystal display unit. Specifically disclosed is an electronic device wherein a main substrate (130) mounted with an electronic component is so arranged as to face a reflecting sheet (126) which is formed on the back surface of a liquid crystal display unit (110). A flexible substrate (140) arranged between the liquid crystal display unit (110) and the main substrate (130) is connected to a surface (132) of the main substrate (130), which surface (132) is on the side of the reflecting sheet (126). A protective sheet (150) covering the reflecting sheet (126) is interposed between the flexible substrate (140) and the reflecting sheet (126).

Abstract translation: 公开了一种电子设备，其通过液晶显示单元保持良好的显示而形成为薄型。 具体公开了一种电子装置，其中安装有电子部件的主基板（130）被布置为面对形成在液晶显示单元（110）的背面上的反射片（126）。 布置在液晶显示单元（110）和主基板（130）之间的柔性基板（140）连接到主基板（130）的表面（132），该表面（132）位于主表面 反射片（126）。 覆盖反射片（126）的保护片（150）介于柔性基板（140）和反射片（126）之间。

公开(公告)号：US07796399B2

公开(公告)日：2010-09-14

申请号：US12317892

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/18 ,  H05K7/20 ,  H01R12/24 ,  H01R43/02 ,  H04L12/50 ,  H01L23/34

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

公开(公告)号：US07771213B2

公开(公告)日：2010-08-10

申请号：US12308243

申请日：2007-02-22

Applicant: Sun-Ki Kim ,  Seung-Jin Lee

Inventor： Sun-Ki Kim ,  Seung-Jin Lee

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R13/2414 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/056 ,  Y10S439/927

Abstract: A solderable electric contact terminal includes; an insulating foam rubber having a predetermined volume; an insulating non-foam rubber coating layer adhered to the insulating foam rubber such that the insulating non-foam rubber encloses the insulating foam rubber; and a heat resistant polymer film having inner surface adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer, and outer surface on which a metal layer is integrally formed.

Abstract translation: 可焊接电接触端子包括： 具有预定体积的绝缘泡沫橡胶; 绝缘非泡沫橡胶涂层粘附到绝缘泡沫橡胶上，使得绝缘非泡沫橡胶包围绝缘泡沫橡胶; 以及耐热聚合物膜，其具有粘附到绝缘非泡沫橡胶涂层的内表面，使得耐热聚合物膜包围绝缘非泡沫橡胶涂层以及金属层整体形成的外表面。

公开(公告)号：US07768796B2

公开(公告)日：2010-08-03

申请号：US12147218

申请日：2008-06-26

Applicant: James W. Cady ,  Paul Goodwin

Inventor： James W. Cady ,  Paul Goodwin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US07760086B2

公开(公告)日：2010-07-20

申请号：US11592766

申请日：2006-11-03

Applicant: Steve B. Hunter ,  John A Voltz ,  Brent W. Lewis ,  Harold S. Wylie

Inventor： Steve B. Hunter ,  John A Voltz ,  Brent W. Lewis ,  Harold S. Wylie

IPC: G08B21/00

CPC classification number: G08B13/128 ,  G06F21/87 ,  G06F2221/2101 ,  H05K1/0275 ,  H05K1/0393 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A tamper respondent enclosure including (a) a circuit board; (b) an enclosure surrounding the circuit board; (c) a tamper respondent sensor having (i) a substrate with first and second sides; (ii) a first layer of conductive traces on the first side; (d) wherein the tamper respondent sensor is wrapped around the enclosure with at least one overlap region; and (e) wherein only at the at least one overlap region the tamper respondent sensor has a second layer of conductive traces on the second side. Preferably, the substrate is insulating and made of opaque PET, and the first layer is adjacent the enclosure.

Abstract translation: 篡改答复的机箱，包括（a）电路板; （b）围绕电路板的外壳; （c）篡改答复传感器，具有（i）具有第一和第二侧面的基板; （ii）第一侧上的第一导电迹线层; （d）其中所述篡改响应传感器用至少一个重叠区域围绕所述外壳缠绕; 和（e）其中仅在所述至少一个重叠区域处，所述篡改响应传感器在所述第二侧上具有第二层导电迹线。 优选地，基板是绝缘的并且由不透明PET制成，并且第一层与外壳相邻。

公开(公告)号：US20100164363A1

公开(公告)日：2010-07-01

申请号：US12719386

申请日：2010-03-08

Applicant: Si-Duk SUNG ,  Byung-Sik Koh

Inventor： Si-Duk SUNG ,  Byung-Sik Koh

IPC: H01J1/62

CPC classification number: H05B33/22 ,  H01L27/3276 ,  H05B33/10 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10128

Abstract: A display device includes an insulating substrate having an upper surface and a lower surface opposing the upper surface, a display element including a first electrode, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer, a first film connected to a first side of the upper surface, and a first circuit substrate connected to the first film and including a first surface facing the display element, a second surface opposing the first surface, and an electric element protruding from the second surface.

Abstract translation: 显示装置包括具有上表面和与上表面相对的下表面的绝缘基板，显示元件包括第一电极，第一电极上的有机发光层和有机发光层上的第二电极， 第一膜连接到上表面的第一侧，第一电路基板连接到第一膜并且包括面向显示元件的第一表面，与第一表面相对的第二表面和从第二表面突出的电元件。