Abstract:
In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion formed as a ground pattern is removed in vicinity of the high-impedance side leading portion of the current leading component and the high-impedance side electrode of the chip component to thereby form removed portions so that discharge paths are formed between the copper foil portion exposed through the removed portions and the leading portion and the electrode.
Abstract:
The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate including a flexible sheet, bendable electrode pattern forming portions formed on the flexible sheet, and electrode patterns formed on the electrode pattern forming portions, an electronic component having electrode portions, and a clamping member having clamping pieces for clamping the electronic component therebetween. The electrode pattern forming portions are deflected, so as to cause the electrode patterns to be contacted with the electrode portions of the electronic component placed on the flexible substrate. By this, the electronic component is clamped by the clamping pieces of the clamping member through the deflected electrode pattern forming portions. Thus, the electronic component may be easily and positively secured to the flexible substrate, without employing additional reinforcing means such as adhesives.
Abstract:
An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.
Abstract:
A support arrangement for mechanically securing and electrically contacting electronic components has a support member consisting of an electrically conducting material and having a contacting side. The support member has perpendicularly projecting hollow pins at the contacting side. The hollow pins are stamped into the support member. The electronic components have connecting tabs including an opening. The tabs are placed onto the hollow pins. The hollow pins project through the openings and the tabs. The heads of the hollow pins are then mechanically deformed and engage radially outwardly the circumferential edge of the openings of the tabs.
Abstract:
A holder for an electrical or electronic component includes a body formed of electrically non-conductive material. The body is generally U-shaped having a pair of laterally spaced arms bridged by a bight. Conductive tracing on the arms establishes an electrical connection between the component and a printed circuit board when the holder is electrically connected to the printed circuit board and the terminals of a component contact the arms.
Abstract:
A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.
Abstract:
A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).
Abstract:
A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastics material body (10). Electrical control connections to the semiconductor comprise first and second upstanding legs (12,14) which are offset from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads (16,18). The pads may be partially sheared, to step them, thereby allowing a single thickness leadframe to be used in the manufacture of the device. On the lower face of the body (10) there are channels (22,24) which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.
Abstract:
An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond--is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.
Abstract:
An electrical switch having an internal lighting circuit which does not interfere with the movements of the internal components of the switch. The lighting circuit of the electrical switch employs a circuit board for connecting one or more lamps to electrical contacts disposed on a wall of the switch housing thereby avoiding the manufacturing problems and expenses associated with employing the extended lead wires found in prior art switches.