Discharge structure of printed circuit board
    201.
    发明授权
    Discharge structure of printed circuit board 失效
    印刷电路板的放电结构

    公开(公告)号:US06185105B2

    公开(公告)日:2001-02-06

    申请号:US09129998

    申请日:1998-08-06

    Abstract: In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion formed as a ground pattern is removed in vicinity of the high-impedance side leading portion of the current leading component and the high-impedance side electrode of the chip component to thereby form removed portions so that discharge paths are formed between the copper foil portion exposed through the removed portions and the leading portion and the electrode.

    Abstract translation: 在印刷电路板中,诸如具有一对引导部分的部件,具有一对电极的芯片部件等的电子部件连接到电路图案; 并且在芯片部件的电流引导部件和高阻抗侧电极的高阻抗侧引出部分附近除去覆盖形成为接地图案的铜箔部分的抗蚀剂层,从而形成去除部分,使得放电 在通过去除部分露出的铜箔部分与引导部分和电极之间形成通路。

    Construction for mounting electronic component on flexible substrate
    202.
    发明授权
    Construction for mounting electronic component on flexible substrate 失效
    将电子元件安装在柔性基板上的结构

    公开(公告)号:US6142791A

    公开(公告)日:2000-11-07

    申请号:US115647

    申请日:1998-07-15

    Abstract: The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate including a flexible sheet, bendable electrode pattern forming portions formed on the flexible sheet, and electrode patterns formed on the electrode pattern forming portions, an electronic component having electrode portions, and a clamping member having clamping pieces for clamping the electronic component therebetween. The electrode pattern forming portions are deflected, so as to cause the electrode patterns to be contacted with the electrode portions of the electronic component placed on the flexible substrate. By this, the electronic component is clamped by the clamping pieces of the clamping member through the deflected electrode pattern forming portions. Thus, the electronic component may be easily and positively secured to the flexible substrate, without employing additional reinforcing means such as adhesives.

    Abstract translation: 本发明提供一种安装结构,其中电子部件安装在柔性基板上。 安装结构包括柔性基板,其包括柔性片,形成在柔性片上的可弯曲电极图案形成部分,以及形成在电极图案形成部分上的电极图案,具有电极部分的电子部件,以及夹持件, 其间的电子部件。 电极图案形成部分被偏转,以使电极图案与放置在柔性基板上的电子部件的电极部分接触。 由此,电子部件通过夹持部件的夹紧片通过偏转的电极图形形成部夹持。 因此,电子部件可以容易且牢固地固定到柔性基板,而不需要附加的加强装置,例如粘合剂。

    Three-dimensional molded sockets for mechanical and electrical component
attachment
    203.
    发明授权
    Three-dimensional molded sockets for mechanical and electrical component attachment 失效
    用于机械和电气部件连接的三维模制插座

    公开(公告)号:US5994648A

    公开(公告)日:1999-11-30

    申请号:US826461

    申请日:1997-03-27

    Abstract: An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

    Abstract translation: 不需要焊接处理的电路组件,包括具有布置在其表面中的至少一个上的终端的电子部件,以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔,其中,空腔基本上符合电子形状 零件。 近似空腔是与电子部件的各个端子匹配的多个电触点,其中至少一个电触点连接到基板上的至少一个电路迹线。 空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合,使得当部件放置在其中时,部件保持在腔内。 组件设置在空腔中,使得其端子与其相应的电触点物理和电连接。

    Holder for an electrical or electronic component
    205.
    发明授权
    Holder for an electrical or electronic component 失效
    电器或电子部件的支架

    公开(公告)号:US5823793A

    公开(公告)日:1998-10-20

    申请号:US662211

    申请日:1996-06-12

    Abstract: A holder for an electrical or electronic component includes a body formed of electrically non-conductive material. The body is generally U-shaped having a pair of laterally spaced arms bridged by a bight. Conductive tracing on the arms establishes an electrical connection between the component and a printed circuit board when the holder is electrically connected to the printed circuit board and the terminals of a component contact the arms.

    Abstract translation: 用于电气或电子部件的保持器包括由非导电材料形成的主体。 身体通常为U形,具有一对横向间隔开的臂,由桥梁桥接。 当支架电连接到印刷电路板并且元件的端子接触臂时,臂上的导电跟踪在部件和印刷电路板之间建立电连接。

    Bond for tacking an electronic part
    209.
    发明授权
    Bond for tacking an electronic part 失效
    绑定电子零件

    公开(公告)号:US5741597A

    公开(公告)日:1998-04-21

    申请号:US453963

    申请日:1995-05-30

    Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond--is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

    Abstract translation: 将电子部件固定到电路板上,使电子部件的引线与构成在电路板上的膏状焊膏接触,然后将电路板加热,使熔融焊膏熔化,从而焊接 电子部件到电路板。 在该方法中,粘合剂中的固化剂的熔融温度,即粘合剂的硬化温度,高于膏状焊料的熔融温度,从而可以防止引线端子的下沉 电子部分进入熔化的奶油焊料。

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