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1.发明授权Three-dimensional molded sockets for mechanical and electrical component attachment 失效用于机械和电气部件连接的三维模制插座
公开(公告)号：US5994648A
公开(公告)日：1999-11-30
申请号：US826461
申请日：1997-03-27
CPC分类号： H05K3/326 , H05K1/119 , H05K1/183 , H05K1/184 , H05K1/0284 , H05K2201/09118 , H05K2201/09181 , H05K2201/09472 , H05K2201/09845 , H05K2201/1059 , H05K2201/10636 , H05K2201/10651 , H05K2201/10689 , H05K3/284 , Y02P70/611
摘要： An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.
摘要翻译： 不需要焊接处理的电路组件，包括具有布置在其表面中的至少一个上的终端的电子部件，以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔，其中，空腔基本上符合电子形状 零件。 近似空腔是与电子部件的各个端子匹配的多个电触点，其中至少一个电触点连接到基板上的至少一个电路迹线。 空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合，使得当部件放置在其中时，部件保持在腔内。 组件设置在空腔中，使得其端子与其相应的电触点物理和电连接。
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公开(公告)号：US5752851A
公开(公告)日：1998-05-19
申请号：US596841
申请日：1996-02-05
CPC分类号： H01R12/62
摘要： A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.
摘要翻译： 夹子连接器包括细长主体，从主体延伸的附接臂和用于施加从主体延伸的压力的突起。 主体基本上是细长的，连接臂在每一端处一个。 中间连接臂是多个突起，用于产生在其间具有空间并且适于与电导体对准的压力点，使得能够对电导体施加压力并且可以进行电连接。
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3.发明授权Enhanced plating adhesion through the use of metallized fillers in plastic substrate 失效通过在塑料基材中使用金属化填料增强镀层附着力
公开(公告)号：US5702584A
公开(公告)日：1997-12-30
申请号：US675308
申请日：1996-07-01
CPC分类号： C23C18/22 , B29C37/0082 , B29C70/64 , C23C18/1641 , C23C18/1653 , H05K3/381
摘要： A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
摘要翻译： 聚合物基板用金属镀覆，使用聚合物中的金属填料颗粒作为通过化学镀操作形成的金属层的固定点。 聚合物具有包括非金属填料颗粒和金属填料颗粒的填料; 可以蚀刻与聚合物表面相邻的非金属填料颗粒，以使靠近蚀刻表面的金属填料颗粒暴露。 暴露的金属填料颗粒用作无电镀层的固定点。
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4.发明授权
公开(公告)号：US5738797A
公开(公告)日：1998-04-14
申请号：US649377
申请日：1996-05-17
CPC分类号： H05K3/4685 , C23F1/02 , H05K3/062 , H05K3/205 , H05K2201/0361 , H05K2201/0394 , H05K2201/09018 , H05K2201/09118 , H05K2203/0152 , H05K2203/0369 , H05K2203/0376 , H05K3/0014
摘要： A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut. The molded circuit structure is then removed from the mold and the metallic foil is further etched to complete the forming of the circuit.
摘要翻译： 通过部分蚀刻具有涂层的箔形成三维多层电路结构。 通过提供金属箔，在金属箔的每一侧上施加可光限定的光致抗蚀剂，选择性地暴露和显影光致抗蚀剂以形成暴露区域和未曝光区域，以及用第二金属镀覆未曝光区域来形成预制电路。 将预电路放置在蚀刻溶液中，并且在蚀刻溶液部分蚀刻金属箔以切割第二金属之后移除。 然后将部分蚀刻的预循环弯曲成预定的形状。 然后将部分蚀刻的预制电路插入模腔中，使得电路结构的至少一个表面与模具相邻。 模具填充有聚合物树脂，使得聚合物树脂封装部分蚀刻的预循环的至少一部分并且基本上填充底切。 然后将模制电路结构从模具中取出，并且金属箔被进一步蚀刻以完成电路的形成。
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公开(公告)号：US20120127696A1
公开(公告)日：2012-05-24
申请号：US12951645
申请日：2010-11-22
申请人： Andrew Z. Glovatsky
发明人： Andrew Z. Glovatsky
IPC分类号： F25D27/00
CPC分类号： F25D27/00 , D06F58/20 , D06F2058/2883 , F21S43/237 , F25D23/028 , F25D2327/001 , G02B6/001
摘要： A signature lighting system for an appliance includes a carrier, a light guide disposed adjacent the carrier, a light source disposed adjacent the light guide and in electrical communication with a source of electrical energy to selectively energize the light source, wherein the light source emits light into the light guide, and a light housing received in the carrier and substantially enclosing the light source, wherein at least one of the light housing and the carrier militates against a relative motion between the light guide and the carrier.
摘要翻译： 用于器具的签名照明系统包括载体，邻近载体设置的光导，邻近光导设置并与电能源电连通的光源，以选择性地激励光源，其中光源发光 以及容纳在所述载体中并且基本上包围所述光源的灯壳体，其中所述灯壳体和所述载体中的至少一个能够抵抗所述光导和所述载体之间的相对运动。
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公开(公告)号：US07510400B2
公开(公告)日：2009-03-31
申请号：US11686101
申请日：2007-03-14
申请人： Andrew Z. Glovatsky , Jeff C. Lin
发明人： Andrew Z. Glovatsky , Jeff C. Lin
IPC分类号： H01R12/00
CPC分类号： F21V19/004 , F21S41/141 , F21V19/0025 , H01L2224/48091 , H01R13/24 , Y10S362/80 , H01L2924/00014
摘要： An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.
摘要翻译： LED互连弹簧夹组件包括具有中心腔和多个接触特征的壳体。 每个接触特征具有由壳体保持的部分和可操作以接触设置在壳体的中心空腔内的LED封装的端子的部分。 LED连接弹簧夹组件在安装到基板上时保持LED封装。
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公开(公告)号：US06449839B1
公开(公告)日：2002-09-17
申请号：US09655986
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
发明人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
IPC分类号： H05K302
CPC分类号： H05K3/4084 , H05K1/056 , H05K3/062 , H05K3/4092 , H05K3/44 , H05K3/445 , H05K2201/0305 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09554 , H05K2203/0195 , H05K2203/063 , Y10T29/49128 , Y10T29/49144 , Y10T29/49156
摘要： A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.
摘要翻译： 一种用于在多层电子电路板10内形成连接的方法。在一个非限制性实施例中，该方法包括在电路板10的部分上选择性地形成空气桥，并用冶金接合工具选择性地折叠气桥， 电路板10的互连层。
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公开(公告)号：US06279527B1
公开(公告)日：2001-08-28
申请号：US09690969
申请日：2000-10-17
IPC分类号： F02P2300
CPC分类号： F02M35/10249 , B60R16/0215 , F02D41/3005 , F02D2400/18 , F02D2400/21 , F02D2400/22 , F02M35/10216 , F02M35/10288 , F02M35/10301 , F02M35/10347 , F02M35/112 , F02M35/116 , F02M35/161 , F02M51/005 , H05K1/118
摘要： There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces. Each circuit trace carried by each carrier member terminates in a termination electrically connectable with an electrical engine element, such as an ignition coil, an electronic fuel injector, a spark plug, and/or a glow plug.
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9.发明授权
公开(公告)号：US5754398A
公开(公告)日：1998-05-19
申请号：US654489
申请日：1996-05-28
CPC分类号： B29C45/14344 , B29C45/14754 , H05K3/0058 , B29C45/14311 , H05K1/0271 , H05K2201/09036 , H05K2203/1327 , Y10T29/49172
摘要： A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.
摘要翻译： 提供一种承载电路的汽车部件及其制造方法。 在本发明的优选实施方案中，组分包括由在预定高温下熔融的聚合物制成的基材。 该部件还包括电路板，该电路板限定穿过其中的孔，其适于在升高的温度下接收熔融聚合物，以及由熔融聚合物通过该孔形成的紧固件。 紧固件与基板成一体，并将电路板机械地固定到基板上。 电路板由耐高温熔融聚合物熔化的材料制成。
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公开(公告)号：US5600181A
公开(公告)日：1997-02-04
申请号：US449591
申请日：1995-05-24
IPC分类号： H01L23/31 , H01L25/065 , H01L23/34
CPC分类号： H01L23/31 , H01L23/3135 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L24/48 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/181
摘要： An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.
摘要翻译： 机载芯片封装具有机械固定在印刷电路板上并与电路板上的输入/输出焊盘电连接的气密密封连接器。 将芯片机械地结合到板上，然后用合适的灌封材料单独封装。 整个组件涂覆有密封聚合物，其与气密连接器壳体的内侧部分重叠并且提供相对平滑的无缝隙的外表面。 在优选实施例中，整个组件被覆盖有金属层，以密封整个芯片上的组件。
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