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    Electrical connector
    241.
    发明授权
    Electrical connector 失效
    电连接器

    公开(公告)号：US4648666A

    公开(公告)日：1987-03-10

    申请号：US751760

    申请日：1985-07-03

    Applicant: Gregory R. Lovell

    Inventor： Gregory R. Lovell

    IPC: H01R12/04 ,  H05K3/34 ,  H05K7/10 ,  H01R9/09

    CPC classification number: H05K3/3426 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  Y02P70/613

    Abstract: An electrical connector for electrically and mechanically attaching a leadless chip carrier to a printed circuit board. More particularly the connector includes a dielectric frame member having recess along the outwardly facing sides and contacts, received in the recesses, having contact sections extending above and below the frame member and outwardly therefrom for soldered engagement with respective chip carrier and circuit board. Projections extending outwardly from the recesses are received in holes in the contacts to retain the contacts in the recesses.

    Abstract translation: 一种用于将无引线芯片载体电气和机械地附接到印刷电路板的电连接器。 更具体地，连接器包括具有沿着面向外侧的凹部和容纳在凹部中的触头的电介质框架构件，其具有在框架构件的上方和下方延伸的接触部分，并且向外从而与相应的芯片载体和电路板焊接。 从凹部向外延伸的突起容纳在触点中的孔中，以将触点保持在凹部中。

    Method of making a vibration-resistant electrical component and connection lead combination, particularly exhaust gas composition sensor
    242.
    发明授权
    Method of making a vibration-resistant electrical component and connection lead combination, particularly exhaust gas composition sensor 失效
    制造抗振电气部件和连接引线组合的方法，特别是废气组成传感器

    公开(公告)号：US4524038A

    公开(公告)日：1985-06-18

    申请号：US424536

    申请日：1982-09-27

    Applicant: Wolfgang Heinemann ,  Rainer Noack ,  Helmut Weyl

    Inventor： Wolfgang Heinemann ,  Rainer Noack ,  Helmut Weyl

    IPC: G01N27/04 ,  G01N27/00 ,  G01N27/02 ,  G01N27/12 ,  G01N27/407 ,  H01R4/00 ,  H01R43/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/32 ,  H05K3/40 ,  B28B23/00

    CPC classification number: G01N27/4075 ,  H05K3/321 ,  H05K3/4092 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10946 ,  H05K2203/1453 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172

    Abstract: To manufacture a vibration-resistant, shock-resistant electrical connection on a ceramic substrate (11) having an electrically conductive layer (12) applied to a surface (13, 19) thereof, a groove or channel-like depression (16, 20) is formed in the surface, preferably also including a through-bore (18), into which a conductor (17) is placed. The space between the conductor and the groove, the through-bore, if provided, and an extending groove at the other surface (19) of the substrate is filled with a sinterable mass (21), preferably a cermet, containing a metal which is compatible with the metal of the conductor wire (17), both for example containing platinum. As a starting material, the plate with the grooves therein is extrusion-pressed, pre-sintered at a low temperature to give it form stability, then the electrode (12) is applied, then the electrical conductor (17) and the cermet is applied and then the entire sub-assembly is fired to sintering temperature, e.g. about 1500.degree. C.; if desired, a further protective coating (22) of magnesium spinel may be plasma-sprayed on. Due to shrinkage of the ceramic components, the wire (17) will be securely held in position in the groove, and the cermet additionally forming an electrical connection between the wire and the substrate (11). For additional strain relief, the groove can be undulating (FIG. 3).

    Abstract translation: 为了在具有施加到其表面（13,19）上的导电层（12）的陶瓷衬底（11）上制造抗振动，抗冲击的电连接，具有凹槽或槽状凹陷（16,20） 形成在表面中，优选地还包括通孔（18），导体（17）放置在通孔中。 导体和槽之间的空间，通孔（如果设置的话）和在基板的另一个表面（19）处的延伸槽填充有可烧结块（21），优选金属陶瓷，其包含金属 与导线（17）的金属相容，例如包含铂。 作为起始材料，其中具有凹槽的板被挤压压制，在低温下预烧结以形成稳定性，然后施加电极（12），然后施加电导体（17）和金属陶瓷 然后将整个子组件烧制到烧结温度，例如 约1500℃。 如果需要，镁尖晶石的另外的保护涂层（22）可以被等离子体喷涂。 由于陶瓷部件的收缩，电线（17）将牢固地保持在凹槽中的适当位置，并且金属陶瓷体另外形成电线与基板（11）之间的电连接。 对于额外的应变消除，凹槽可以起伏（图3）。

    Circuit board and contact assemblies
    243.
    发明授权
    Circuit board and contact assemblies 失效
    电路板和接触组件

    公开(公告)号：US4392181A

    公开(公告)日：1983-07-05

    申请号：US259748

    申请日：1981-05-01

    Applicant: Gary D. Jabben

    Inventor： Gary D. Jabben

    IPC: H05K1/14 ,  H05K1/18

    CPC classification number: H05K1/144 ,  H01R12/52 ,  H05K2201/1028 ,  H05K2201/10946

    Abstract: A row of connectors 14 is assembled on a printed circuit board 11 by inserting a leg section 41 of each terminal 14 into a mounting aperture 32 and bending a flat contact portion 42 of each terminal 14 to fit into a pocket 47 formed in the surface of the board. Printed circuit conductors 13 are next screened onto the board 11 with a portion of the conductors positioned over some of the contact portions 42 of terminals 14 to provide edge connections for the printed circuits 12. Metal strips conductors 13 are then fastened to the board 11 and end portions thereof are welded to the contact portions 42 of other terminals 14 to provide edge connections for the metal strips conductors 13.

    Abstract translation: 一排连接器14通过将每个端子14的腿部41插入到安装孔32中并弯曲每个端子14的平坦接触部分42而装配在印刷电路板11上，以装配到形成在 董事会。 印刷电路导体13接下来被屏蔽到板11上，其中一部分导体位于端子14的一些接触部分42上，以提供印刷电路12的边缘连接。金属带导体13然后被固定到板11上， 其端部焊接到其他端子14的接触部分42，以提供用于金属带导体13的边缘连接。

    Circuit assembly as for a T-element
    244.
    发明授权
    Circuit assembly as for a T-element 失效
    电路组件为T元件

    公开(公告)号：US4017821A

    公开(公告)日：1977-04-12

    申请号：US636428

    申请日：1975-12-01

    Applicant: Gerhard Schmidt

    Inventor： Gerhard Schmidt

    IPC: H01R9/00 ,  H01C1/16 ,  H01C10/50 ,  H01L23/498 ,  H01R12/72 ,  H05K3/22 ,  H01C10/06

    CPC classification number: H01L23/49811 ,  H01R12/728 ,  H05K3/222 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/10287 ,  H05K2201/10946

    Abstract: A circuit assembly as for an attenuation circuit is constructed upon a glass or ceramic substrate. T-element attenuators are formed on one face of the substrate by a film-circuit technique. Connections to electrodes of the T-element resistances are made by contact elements having clamping portions which engage an edge of the substrate to overlie the respective electrodes. One side of each contact element is extended from the clamping portion to form a contact arm having a forked end spaced adjacent the face of the substrate. The electrodes and contact elements are spaced apart longitudinally of the substrate and the contact arms alternate longitudinally between front and back faces thereof. Wire bridge connections are then readily made between successive arms on one or the other side of the substrate to turn on or off the individual T-element attenuator. Further, a connecting rod extends from each contact element normally to the edge of the substrate and parallel to the face of the substrate to engage a bore in a carrier plate upon assembly. Such rods connect to cross-pieces to facilitate assembly onto the substrate, one cross-piece for each set of contact elements having connecting arms on one side of the substrate.

    Abstract translation: 用于衰减电路的电路组件被构造在玻璃或陶瓷衬底上。 通过薄膜电路技术在衬底的一个面上形成T元件衰减器。 与T形电阻器的电极的连接由具有夹持部分的接触元件制成，该夹持部分接合衬底的边缘以覆盖相应的电极。 每个接触元件的一侧从夹持部分延伸以形成接触臂，该接触臂具有邻近衬底的表面间隔开的叉形端。 电极和接触元件在衬底的纵向间隔开，并且接触臂在其正面和背面之间纵向交替。 然后，在衬底的一个或另一侧上的连续的臂之间容易地形成电线桥接，以打开或关闭单独的T元件衰减器。 此外，连接杆从每个接触元件正常延伸到基板的边缘并且平行于基板的表面，以在组装时接合载体板中的孔。 这样的杆连接到横梁以便于组装到基底上，每组接触元件的一个横截面具有在基底的一侧上的连接臂。

    Method of forming an electrical network package
    245.
    发明授权
    Method of forming an electrical network package 失效
    形成电气网络封装的方法

    公开(公告)号：US3939558A

    公开(公告)日：1976-02-24

    申请号：US548326

    申请日：1975-02-10

    Applicant: Richard E. Riley

    Inventor： Richard E. Riley

    IPC: H05K1/09 ,  H05K1/16 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  H05K13/00 ,  H05K3/10

    CPC classification number: H05K3/281 ,  H05K1/167 ,  H05K1/092 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K3/3405 ,  H05K3/386 ,  Y10T29/41 ,  Y10T29/4913

    Abstract: A method of forming an electrical network package in which a B-stage thermosetting adhesive material is sandwiched between and adheres together a substrate bearing a network of electric circuit elements, and a protective superstrate. The component package is first heated sufficiently to initiate the formation of the adhesive into a gel. The package may then be cooled, and is momentarily compressed in order to flow the adhesive material into sealing relation with the electric network and to inhibit relative slippage between the substrate and superstrate followed by further heating to fully cure the adhesive.Except for the momentary compression, the entire curing sequence is performed without the application of external pressures, thereby considerably simplifying the requisite machinery. The method is adaptable to mass production techniques by employing a single continuous adhesive tape and lead frame in connection with a multiplicity of substrates.

    Abstract translation: 一种形成电气网络封装的方法，其中B阶热固性粘合剂材料夹在一起，并且将具有电路元件网络的基板和保护性覆层粘合在一起。 首先将组分包装充分加热以引发粘合剂形成凝胶。 然后可以将包装冷却，并且被瞬间压缩以使粘合剂材料流动成与电网的密封关系，并且抑制基材和上层之间的相对滑动，随后进一步加热以使粘合剂完全固化。

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