公开(公告)号：US08035878B2

公开(公告)日：2011-10-11

申请号：US12977637

申请日：2010-12-23

申请人： Akihiro Murata ,  Hiroaki Hosomi

发明人： Akihiro Murata ,  Hiroaki Hosomi

IPC分类号： G02B26/08

CPC分类号： G02B26/085 ,  Y10T74/1526

摘要： An actuator, includes: a weight part; a supporting part supporting the weight part; a connecting part coupling the weight part rotatable to the supporting part and having an elastic part; a driving member for driving and rotating the weight part; and a semiconductor circuit for driving the weight part. The driving member is operated to torsionally deform the elastic part and rotate the weight part. The elastic part has a first silicon part that is mainly made of silicon and a first resin part that is mainly made of resin and coupled to the first silicon part. The supporting part has at least a second silicon part made mainly of silicon and coupled to the first silicon part of the elastic part. The semiconductor circuit is provided on the second silicon part of the supporting part.

公开(公告)号：US07884990B2

公开(公告)日：2011-02-08

申请号：US12767914

申请日：2010-04-27

申请人： Akihiro Murata ,  Hiroaki Hosomi

发明人： Akihiro Murata ,  Hiroaki Hosomi

IPC分类号： G02B26/08

CPC分类号： G02B26/085 ,  Y10T74/1526

摘要： An actuator, includes: a weight part; a supporting part supporting the weight part; a connecting part coupling the weight part rotatable to the supporting part and having an elastic part; a driving member for driving and rotating the weight part; and a semiconductor circuit for driving the weight part. The driving member is operated to torsionally deform the elastic part and rotate the weight part. The elastic part has a first silicon part that is mainly made of silicon and a first resin part that is mainly made of resin and coupled to the first silicon part. The supporting part has at least a second silicon part made mainly of silicon and coupled to the first silicon part of the elastic part. The semiconductor circuit is provided on the second silicon part of the supporting part.

摘要翻译： 致动器包括：重量部件; 支撑部分的支撑部分; 连接部，其将所述重量部分可旋转地支撑在所述支撑部上并具有弹性部; 用于驱动和旋转所述重物部件的驱动构件; 以及用于驱动重量部分的半导体电路。 操作驱动构件以使弹性部件扭转变形并使重物部分旋转。 弹性部分具有主要由硅制成的第一硅部分和主要由树脂制成的第一树脂部分，并与第一硅部分相连。 支撑部分具有至少第二硅部分，主要由硅制成，并与弹性部分的第一硅部分耦合。 半导体电路设置在支撑部件的第二硅部分上。

公开(公告)号：US07286244B2

公开(公告)日：2007-10-23

申请号：US10953876

申请日：2004-09-29

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： G01B9/02

CPC分类号： G01J3/26 ,  G01J3/0256 ,  G01N21/31 ,  G02B26/001

摘要： An analyzer includes an optical tunable filter 1 for selectively outputting light having a predetermined wavelength, and a PD 421 for receiving light outputted from the optical tunable filter 1 and then passed through or reflected by an object to be measured. The optical tunable filter 1 includes a first substrate 3 including a movable portion 31 having a light transmitting property; a second substrate 2 having a light transmitting property, the second substrate being provided so as to be opposed to the first substrate; a first gap 21 and a second gap 22 which are respectively provided between the movable portion 31 of the first substrate 3 and the second substrate 2; an interference portion which cases interference with light that enters the optical tunable filter 1 and that has the predetermined wavelength between the movable portion and the second substrate 2 by means of the second gap 22; and a driving portion for changing a distance of the second gap 22 by displacing the movable portion 31 with respect to the second substrate 2 using the first gap 21.

摘要翻译： 分析器包括用于选择性地输出具有预定波长的光的光学可调谐滤光器1和用于接收从光学可调谐滤光器1输出的光然后通过或被待测物体反射的PD 421。 光可调谐滤光器1包括具有透光性的可动部31的第一基板3; 具有透光性的第二基板2，第二基板设置成与第一基板相对; 分别设置在第一基板3的可动部31和第二基板2之间的第一间隙21和第二间隙22; 干涉部分，其通过第二间隙22干扰进入光可调谐滤光器1并具有预定波长的可移动部分和第二基板2之间的光; 以及用于通过使用第一间隙21使可动部31相对于第二基板2移位来改变第二间隙22的距离的驱动部。

公开(公告)号：US07029946B2

公开(公告)日：2006-04-18

申请号：US10671010

申请日：2003-09-25

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/12 ,  H01L21/32051 ,  H01L21/76804 ,  H01L23/3114 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes the steps of forming a stress relief layer on a wafer such that the stress relief layer is away from at least part of electrodes formed on the wafer; forming a wiring layer in which lines that extend from the electrodes to the stress relief layer are formed; forming outer electrodes that are over the stress relief layer and are connected to the lines in the wiring layer; and forming a dielectric layer by applying dielectric liquid by an inkjet method to portions in the lines where the outer electrodes are connected to form a capacitor. The step of forming the dielectric layer is conducted after the step of forming the wiring layer.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：在晶片上形成应力消除层，使得应力消除层远离形成在晶片上的电极的至少一部分; 形成从电极延伸到应力消除层的线形成的布线层; 形成在所述应力消除层上方并与所述布线层中的线连接的外部电极; 以及通过喷墨法将介电液体施加到外部电极连接的线路中的部分以形成电容器而形成电介质层。 在形成布线层的步骤之后进行形成介电层的步骤。

公开(公告)号：US06972636B2

公开(公告)日：2005-12-06

申请号：US10436373

申请日：2003-05-12

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H01P1/203 ,  H01P1/10 ,  H01P1/12 ,  H01P1/205 ,  H01P11/00 ,  H03H7/12

CPC分类号： H01P11/00 ,  H01P1/127

摘要： A BPF 20, which is a filter circuit, is formed by arranging a plurality of wiring patterns 21a, 21b and 22a to 22c on a substrate 10. Also, a freely movable impedance control rod 26 is formed so as to interfere with characteristics of the wiring patterns 21a, 21b and 22a to 22c of the BPF 20 without touching them. Interfering with the characteristics means cutting the passage of the frequency at the BPF 20, so that switching depends on whether the frequency is passed or cut.

摘要翻译： 作为滤波器电路的BPF 20通过在基板10上配置多个布线图案21a，21b和22a至22c而形成。 此外，可自由移动的阻抗控制棒26形成为与BPF20的布线图案21a，21b和22a至22c的特性相干扰而不接触它们。 干扰特性意味着在BPF 20处切断频率的通过，使切换取决于频率是否通过或切断。

公开(公告)号：US20050068627A1

公开(公告)日：2005-03-31

申请号：US10915122

申请日：2004-08-10

申请人： Ryosuke Nakamura ,  Shinichi Kamisuki ,  Akihiro Murata ,  Mitsuhiro Yoda

发明人： Ryosuke Nakamura ,  Shinichi Kamisuki ,  Akihiro Murata ,  Mitsuhiro Yoda

IPC分类号： G02B5/28 ,  G01J3/26 ,  G02B5/20 ,  G02B26/00 ,  G02B27/00

CPC分类号： G02B26/001 ,  G01J3/26

摘要： A tunable optical filter is provided by joining a movable unit that supports a movable body moving up and down freely, and whose top surface has a highly reflective film formed thereon, a drive electrode unit in which a drive electrode facing the movable body with an electrostatic gap EG therebetween is formed, and an optical gap unit in which a highly reflective film facing the highly reflective film with an optical gap OG therebetween is formed.

摘要翻译： 通过连接支撑可自由上下移动的移动体并且其上表面具有形成在其上的高反射膜的可移动单元来提供可调谐滤光器;驱动电极单元，其中驱动电极面对可移动体具有静电 形成间隙EG，并且形成光学间隙单元，其中形成面对具有光学间隙OG的高反射膜的高反射膜。

公开(公告)号：US06793405B1

公开(公告)日：2004-09-21

申请号：US09509669

申请日：2000-04-04

申请人： Akihiro Murata ,  Shojiro Kitamura

发明人： Akihiro Murata ,  Shojiro Kitamura

IPC分类号： G02B636

CPC分类号： G02B6/42 ,  G02B6/4214 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module which can be made more compact and lightweight. An end portion (18) of a mounting substrate (10) forms a mirror which reflects light through 90 degrees. A surface-emission laser (22) is disposed so that a light-emitting aperture (28) faces the end portion (18). Within the mounting substrate (10) are formed a core (12) extending along the plane of the mounting substrate (10) and a cladding (14). The mounting substrate (10) doubles as an optical waveguide. Therefore, the optical module can be made thinner. As a result, the optical module can be made more compact and lightweight.

摘要翻译： 可以制造更加紧凑和轻便的光学模块。 安装基板（10）的端部（18）形成将光反射90度的反射镜。 面发光激光器（22）设置成使得发光孔（28）面向端部（18）。 在安装基板（10）内形成有沿安装基板（10）的平面延伸的芯（12）和包层（14）。 安装基板（10）兼作光波导。 因此，可以使光模块变薄。 结果，可以使光学模块更加紧凑和重量轻。

公开(公告)号：US06724061B2

公开(公告)日：2004-04-20

申请号：US09971619

申请日：2001-10-09

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H01L310203

CPC分类号： H01L33/56 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01S5/0222 ,  H01S5/02228 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/53191 ,  H01L2224/0401

摘要： The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is defined between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.

摘要翻译： 本发明提供了一种具有光学元件，基底和柔性构件的光学装置。 柔性构件的第一部分设置成与衬底间隔开，围绕第一部分的第二部分粘附到衬底上，并且在第一部分和衬底之间限定封闭空间。 光学元件安装在封闭空间内的基板上。

公开(公告)号：US06586274B2

公开(公告)日：2003-07-01

申请号：US09944218

申请日：2001-09-04

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： H01L2144

CPC分类号： H01L24/48 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H05K1/056 ,  H05K3/427 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/09636 ,  H05K2201/09645 ,  H05K2203/1438 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

摘要： A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.

公开(公告)号：US06568863B2

公开(公告)日：2003-05-27

申请号：US09800482

申请日：2001-03-08

申请人： Akihiro Murata

发明人： Akihiro Murata

IPC分类号： G02B636

CPC分类号： H01L21/568 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4242 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4274 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a platform includes the steps of providing an interconnecting line adhering first and second regions of a mold, disposing an optical fiber with its end surface facing the mold, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line and the molding material together with the optical fiber from the mold.