公开(公告)号：US06222272B1

公开(公告)日：2001-04-24

申请号：US09173683

申请日：1998-10-16

申请人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

发明人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

IPC分类号： H01L2941

CPC分类号： H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

摘要： In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

摘要翻译： 在形成有导电电路的薄膜载体中，相对于要形成导电路径的特定位置形成开口。 开口是通孔，填充有导电材料以形成导电路径。 导电电路具有根据某些公式提供的凹面。 薄膜载体可以处理细调和高度密集的安装，同时禁止通过外力从导电路径拉出。 电影载体不会受到导电路径的影响，并且具有增加的电连接可靠性。

公开(公告)号：US09566663B2

公开(公告)日：2017-02-14

申请号：US12663185

申请日：2008-06-05

申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

IPC分类号： B23K26/00 ,  B23K26/02 ,  B23K26/38 ,  B23K26/40

CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

公开(公告)号：US08778118B2

公开(公告)日：2014-07-15

申请号：US12820375

申请日：2010-06-22

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B32B38/04 ,  B32B27/32 ,  H01L21/26

CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

摘要： A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

摘要翻译： 一种激光加工部件的制造方法，其中，使用具有规定的物理特性的材料，在基材上至少设置有作为激光加工用的粘合片的压敏粘合剂层。 该方法包括通过压敏粘合剂层将激光加工用粘合片粘合到工件的激光射出侧，通过用照射2倍以下的激光束照射工件进行加工 在作业中形成通孔的强度高于用于引起作业烧蚀的阈值的照射强度，以及在加工后的工作中剥离用于激光加工的压敏粘合片。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。

公开(公告)号：US08168030B2

公开(公告)日：2012-05-01

申请号：US11331465

申请日：2006-01-13

申请人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

发明人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

IPC分类号： B32B38/00 ,  B32B38/04 ,  B26D1/00

CPC分类号： B23K26/40 ,  B23K26/38 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/02 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/34 ,  B23K2103/38 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  H05K3/0026 ,  Y10T83/04 ,  Y10T83/0405 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T156/1082

摘要： Providing a method of manufacturing a laser processed part capable of processing at high speed and high precision when processing a workpiece by optical absorption ablation of laser beam, effectively suppressing contamination of a workpiece surface by decomposition products, and recovering the workpiece easily after processing. Another object is to present an adhesive sheet for laser processing preferably used in the method of manufacturing a laser processed part.

摘要翻译： 提供一种制造激光加工部件的方法，其能够通过激光束的光吸收消融处理工件时以高速和高精度进行处理，有效地抑制了分解产物对工件表面的污染，并且在加工后容易地回收工件。 另一个目的是提出一种用于激光加工的粘合片，优选用于制造激光加工部件的方法。

公开(公告)号：US20100167076A1

公开(公告)日：2010-07-01

申请号：US12663185

申请日：2008-06-05

申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

IPC分类号： B23K26/00 ,  B29C35/08

CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

公开(公告)号：US20090174119A1

公开(公告)日：2009-07-09

申请号：US12349958

申请日：2009-01-07

申请人： Naoyuki MATSUO ,  Atsushi HINO

发明人： Naoyuki MATSUO ,  Atsushi HINO

IPC分类号： B29C35/00

CPC分类号： B29C35/0888 ,  B29C59/04 ,  B29C2035/0838 ,  B29C2059/023 ,  B29L2007/001

摘要： The present invention aims at providing a method of manufacturing a patterned resin sheet, capable of implementing efficient and highly precise patterning. The method includes: pressing a perimeter portion of a roller against a surface of a resin sheet with the perimeter portion heated with a laser beam, by using a patterning member that includes a roller rotatable around an axis and has a patterning portion patterned in a recessed and projected geometry on the perimeter portion of the roller, thereby forming on the surface of the resin sheet a pattern that is oriented inversely to the recessed and projected geometry of the patterning portion; and rotating the roller to bring a portion pressed by the perimeter portion into motion, such that the pattern is continuously formed on the surface of the resin sheet.

摘要翻译： 本发明的目的在于提供一种制造图案化树脂片材的方法，该方法能够实现高效和高精度的图案化。 该方法包括：通过使用包括可围绕轴线旋转的辊的图案形成部件将辊的周边部分压靠在树脂片的表面上，周边部分被激光束加热，并且具有图案化成凹陷的图案形成部分 并且在辊的周边部分上的投影几何形状，从而在树脂片的表面上形成与图案形成部分的凹入和投影几何相反的图案; 并且使辊旋转以使由周边部分按压的部分运动，使得图案连续地形成在树脂片的表面上。

公开(公告)号：US06168910A

公开(公告)日：2001-01-02

申请号：US09334643

申请日：1999-06-17

申请人： Atsushi Hino ,  Hitoshi Ishizaka

发明人： Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： G03F726

CPC分类号： H05K3/0026 ,  B08B7/0042 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0676 ,  H05K3/0035 ,  H05K2203/0557 ,  Y10S430/146 ,  Y10S438/94 ,  Y10S438/945

摘要： A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.

摘要翻译： 公开了一种用于除去附着在形成在印刷电路板的树脂层中的孔的周边和内部的树脂层的材料的分解残渣和/或加工残留物的方法。 该方法提供了在孔处拍摄具有用于激光消融的波长的激光束，从而去除分解残余物和/或加工残留物; 通过光束整形光学器件重新形成垂直于激光束前进方向的截面形状; 并拍摄重新设置的激光束同时拍摄树脂层及其附近形成的所有孔，其中印刷电路板上的总照射面积为形成在印刷电路板上的孔的总截面积的200％-10,000％。 还公开了一种具有孔的印刷电路板的制造方法，所述印刷电路板具有：通过激光加工在印刷电路板的树脂层上形成孔，除去树脂层的材料的分解残渣和/或加工残渣， 附着在孔的周边和内部。

公开(公告)号：US06037103A

公开(公告)日：2000-03-14

申请号：US988138

申请日：1997-12-10

申请人： Atsushi Hino

发明人： Atsushi Hino

IPC分类号： B08B7/00 ,  B23K26/06 ,  B23K26/067 ,  H05K3/00 ,  H01R22/00

CPC分类号： H05K3/0026 ,  B08B7/0042 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0676 ,  H05K2203/0557 ,  H05K3/0035 ,  Y10S430/146 ,  Y10S438/94 ,  Y10S438/945

摘要： In a mask imaging method (by shooting a laser beam) for forming holes in a resin layer of a printed board, a sectional shape is reshaped by beam reshaping optics. Light path holes corresponding to the holes to be formed in the resin layer are used. The reshaped laser beam shoots the light path holes formed in the mask individually at once. Simultaneous passage of the laser beam through the light path holes formed in the mask is allowed, to form the holes in the resin layer. Exposure of the periphery and inside of a hole to the laser beam results in removal of a decomposition residue and/or processing residue.

摘要翻译： 在用于在印刷电路板的树脂层中形成孔的掩模成像方法（通过拍摄激光束）中，通过光束整形光学器件重新形成截面形状。 使用与在树脂层中形成的孔对应的通路孔。 重新成形的激光束立刻单独地射出形成在掩模中的光路孔。 允许激光束同时通过形成在掩模中的光路孔，以在树脂层中形成孔。 孔周边和内部暴露于激光束导致去除分解残留物和/或加工残留物。

公开(公告)号：US5691210A

公开(公告)日：1997-11-25

申请号：US728076

申请日：1996-10-09

申请人： Yoshihisa Mori ,  Atsushi Hino ,  Hitoshi Ishizaka

发明人： Yoshihisa Mori ,  Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/06 ,  G01R1/073 ,  H01L21/66

CPC分类号： G01R1/07314 ,  G01R1/0483

摘要： A method for fabrication of a probe structure comprising a circuit substrate comprising a circuit pattern formed on one side or inside of an insulating substrate and a positioning member formed on either side of said insulating substrate, said positioning member being capable of positioning and retaining a test target at a testing position of the probe structure, and the circuit pattern and the positioning member being in a positional relationship which establishes a continuity between the circuit pattern and a bump contact, which method comprises determining, on the same side of the substrate on which the positioning member has been formed, the position of the bump contact according to the position of the positioning member as a reference position, and forming the bump contact capable of establishing continuity with the circuit pattern. According to the method of the present invention, a probe structure can be obtained which is capable of positioning bump contacts and test target highly accurately as compared to conventional methods. In addition, since conventional production method can be applied to the manufacture of positioning member and bump contacts, highly precise products can be produced economically. The circuit substrate of the present invention which comprises a positioning member can be beneficially used for the production of the probe structure of the present invention.

摘要翻译： 一种用于制造探针结构的方法，其包括电路基板，该电路基板包括形成在绝缘基板的一侧或内侧上的电路图案和形成在所述绝缘基板两侧的定位部件，所述定位部件能够定位和保持测试 目标在探针结构的测试位置，并且电路图案和定位构件处于建立电路图案和凸块接触之间的连续性的位置关系，该方法包括在衬底的同一侧上确定 已经形成了定位构件，根据定位构件的位置作为基准位置的凸起接触的位置，并且形成能够与电路图案建立连续性的凸点接触。 根据本发明的方法，与传统方法相比，可以获得能够高度准确地定位凸块接触和测试目标的探针结构。 此外，由于可以将传统的制造方法应用于定位构件和凸起接触的制造，因此可以经济地制造高精度的产品。 包括定位构件的本发明的电路基板可有利地用于制造本发明的探针结构。

公开(公告)号：US20100273313A1

公开(公告)日：2010-10-28

申请号：US12820375

申请日：2010-06-22

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B32B38/04 ,  B32B27/32 ,  H01L21/26

CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

摘要： A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

摘要翻译： 一种激光加工部件的制造方法，其中，使用具有规定的物理特性的材料，在基材上至少设置有作为激光加工用的粘合片的压敏粘合剂层。 该方法包括通过压敏粘合剂层将激光加工用粘合片粘合到工件的激光射出侧，通过用照射2倍以下的激光束照射工件进行加工 在作业中形成通孔的强度高于用于引起作业烧蚀的阈值的照射强度，以及在加工后的工作中剥离用于激光加工的压敏粘合片。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。