公开(公告)号：US08890293B2

公开(公告)日：2014-11-18

申请号：US13328715

申请日：2011-12-16

Applicant: Chih-Hung Lu ,  Song-Bor Lee ,  Ching-Chen Hao

Inventor： Chih-Hung Lu ,  Song-Bor Lee ,  Ching-Chen Hao

IPC: H01L29/40

CPC classification number: H01L21/763 ,  H01L21/76 ,  H01L21/823481 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A guard ring for a through via, and a method of manufacture thereof, is provided. The guard ring comprises one or more rings around a through via, wherein the rings may be, for example, circular, rectangular, octagon, elliptical, square, or the like. The guard ring may be formed from a contact through an inter-layer dielectric layer and interconnect structures (e.g., vias and lines) extending through the inter-metal dielectric layers. The guard ring may contact a well formed in the substrate.

Abstract translation: 提供了通孔的保护环及其制造方法。 保护环包括围绕通孔的一个或多个环，其中环可以是例如圆形，矩形，八边形，椭圆形，正方形等。 保护环可以由通过层间电介质层的接触和延伸穿过金属间介电层的互连结构（例如，通孔和线）形成。 保护环可以接触在衬底中形成的阱。

公开(公告)号：US08890274B2

公开(公告)日：2014-11-18

申请号：US13546847

申请日：2012-07-11

Applicant: Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Mirng-Ji Lii

Inventor： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Mirng-Ji Lii

IPC: H01L23/48

CPC classification number: H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14683 ,  H01L31/02002 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.

Abstract translation: 一种设备包括在图像传感器芯片的表面处的金属焊盘，其中图像传感器芯片包括图像传感器。 螺柱凸块设置在金属垫的上方并电连接到金属垫。 凸起凸块包括凸起区域和连接到凸起区域的尾部区域。 尾部区域包括基本上垂直于金属垫的顶表面的金属线部分。 尾部区域足够短，能够抵抗重力。

公开(公告)号：US08850672B2

公开(公告)日：2014-10-07

申请号：US13151274

申请日：2011-06-02

Applicant: Ching-Chen Yang

Inventor： Ching-Chen Yang

IPC: F16B2/12 ,  B25B5/06 ,  B25B5/02

CPC classification number: F16B2/12 ,  B25B5/068 ,  Y10T24/44017 ,  Y10T24/44573 ,  Y10T24/4459 ,  Y10T24/44615

Abstract: A fixture includes an elongated rod, a first jaw and a second jaw. The first jaw and the second jaw are assembled with the elongated rod. The second jaw has a pivotal portion and a grip. A trigger is connected outside the pivotal portion. A front chamber is formed in the pivotal portion for receiving a plurality of clasping pieces and a restoring spring penetrated by the elongated rod. The restoring spring pushes the clasping pieces to synchronously drive a push rod connected to the trigger. Each of the clasping pieces is formed with a groove facing the restoring spring. The restoring spring is formed with a guiding section bent toward the clasping pieces. The guiding section is disposed in the groove to guide the second jaw to advance smoothly.

Abstract translation: 固定装置包括细长杆，第一颚和第二颚。 第一颚和第二颚与细长杆组装。 第二颚具有枢转部分和手柄。 触发器连接在枢转部分的外部。 在所述枢转部分中形成有前室，用于容纳多个夹紧件和由细长杆穿过的复原弹簧。 复位弹簧推动夹紧件同步驱动连接到触发器的推杆。 每个夹紧件形成有面向复原弹簧的凹槽。 复位弹簧形成有朝向夹紧件弯曲的引导部。 引导部分设置在槽中以引导第二钳口平稳前进。

公开(公告)号：US08832945B2

公开(公告)日：2014-09-16

申请号：US13517833

申请日：2012-06-14

Applicant: Ching-Chen Yang

Inventor： Ching-Chen Yang

IPC: B26B13/16

CPC classification number: B26B13/16 ,  B23D29/00

Abstract: Tin snips includes two cutting blades intersecting each other for cutting and two handles for activating the cutting of the two cutting blades. A safety device is disposed in the tin snips for preventing the two cutting blades from opening. The safety device includes a protrusion extending from an edge of one of the handles, a recess provided in an edge of the handle having the protrusion, and a buckling element connected to the other of the handles. The buckling element includes two movable portions rotatable to cover a position where the two handles are drawn to a closed position, an engaging portion disposed between the two movable portions to cross the protrusion to engage into the recess when the movable portions rotate, and a restricting portion connected between the two movable portions and the engaging portion.

Abstract translation: 锡切片包括两个相互交叉切割的切割刀片和两个用于激活两个切割刀片切割的手柄。 安全装置设置在锡夹中，以防止两个切割刀片打开。 所述安全装置包括从所述手柄中的一个的边缘延伸的突起，设置在具有所述突起的所述手柄的边缘中的凹部以及连接到所述手柄中的另一个的屈曲元件。 弯曲元件包括两个可旋转的可移动部分，以可覆盖两个把手被拉到关闭位置的位置，设置在两个可移动部分之间的接合部分，以在可动部分旋转时与突起交叉以接合到凹部中， 连接在两个可移动部分和接合部分之间的部分。

公开(公告)号：US20140253021A1

公开(公告)日：2014-09-11

申请号：US14017090

申请日：2013-09-03

Applicant: Hok-Sum Horace Luke ,  Ching Chen

Inventor： Hok-Sum Horace Luke ,  Ching Chen

IPC: H04B5/00

CPC classification number: H04W12/06 ,  B60L11/1822 ,  B60L11/1824 ,  B60L11/1846 ,  B60L2240/70 ,  B60L2250/20 ,  H02J5/00 ,  H02J7/0013 ,  H02J7/0027 ,  H02J7/0045 ,  H02J7/02 ,  H02J7/345 ,  H02J2007/0001 ,  H02J2007/0096 ,  H02J2007/0098 ,  H04B5/0031 ,  H04B5/0062 ,  H04B5/02 ,  Y02T10/7011 ,  Y02T10/7072 ,  Y02T10/7291 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163 ,  Y02T90/169 ,  Y04S30/14

Abstract: A network of collection, charging and distribution machines collect, charge and distribute portable electrical energy storage devices (e.g., batteries, supercapacitors or ultracapacitors). To charge, the machines employ electrical current from an external source, such as the electrical grid or an electrical service of an installation location. Users may also use portable charging devices that authenticate portable electrical energy storage devices or are authenticated by portable electrical energy storage devices before the charging is allowed or enabled. This authentication may be via wired or wireless communication channels between the portable charging device and portable electrical energy storage device, such as via near field communication (NFC) channels.

Abstract translation: 收集，充电和分配机器的网络收集，充电和分发便携式电能存储装置（例如，电池，超级电容器或超级电容器）。 为了充电，机器采用来自外部源的电流，例如电网或安装位置的电气服务。 用户还可以使用认证便携式电能存储设备的便携式充电设备，或者在允许或启用充电之前由便携式电能存储设备进行认证。 该认证可以通过例如经由近场通信（NFC）信道的便携式充电装置和便携式电能存储装置之间的有线或无线通信信道。

公开(公告)号：US08736014B2

公开(公告)日：2014-05-27

申请号：US12271617

申请日：2008-11-14

Applicant: Bo-Jiun Lin ,  Ching-Yu Lo ,  Hai-Ching Chen ,  Tien-I Bao ,  Chen-Hua Yu

Inventor： Bo-Jiun Lin ,  Ching-Yu Lo ,  Hai-Ching Chen ,  Tien-I Bao ,  Chen-Hua Yu

IPC: H01L21/31

CPC classification number: H01L21/3121 ,  C23C18/1212 ,  C23C18/122 ,  C23C18/1254 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02304

Abstract: A semiconductor device and method for making such that provides improved mechanical strength is disclosed. The semiconductor device comprises a semiconductor substrate; an adhesion layer disposed over the semiconductor substrate; and a porous low-k film disposed over the semiconductor substrate, wherein the porous low-k film comprises a porogen and a composite bonding structure including at least one Si—O—Si bonding group and at least one bridging organic functional group.

Abstract translation: 公开了一种提供改进的机械强度的半导体器件和制造方法。 半导体器件包括半导体衬底; 设置在半导体衬底上的粘附层; 以及设置在所述半导体衬底上的多孔低k膜，其中所述多孔低k膜包含致孔剂和包含至少一个Si-O-Si键合基团和至少一个桥连有机官能团的复合键合结构。

公开(公告)号：US08735278B2

公开(公告)日：2014-05-27

申请号：US13550951

申请日：2012-07-17

Applicant: Ming Han Lee ,  Hai-Ching Chen ,  Hsiang-Huan Lee ,  Tien-I Bao ,  Chi-Lin Teng

Inventor： Ming Han Lee ,  Hai-Ching Chen ,  Hsiang-Huan Lee ,  Tien-I Bao ,  Chi-Lin Teng

IPC: H01L21/4763

CPC classification number: H01L23/53238 ,  H01L21/76834 ,  H01L21/76867 ,  H01L21/76885 ,  H01L21/76897 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure is directed to a method of manufacturing an interconnect structure in which a low-k dielectric layer is formed over a semiconductor substrate followed by formation of a copper or copper alloy layer over the low-k dielectric layer. The copper or copper alloy layer is patterned and etched to form a copper body having recesses, which are then filled with a low-k dielectric material. The method allows for formation of a damascene structures without encountering the various problems presented by non-planar features and by porus low-K dielectric damage.

Abstract translation: 本公开涉及一种制造互连结构的方法，其中在半导体衬底上形成低k电介质层，然后在低k电介质层上形成铜或铜合金层。 铜或铜合金层被图案化和蚀刻以形成具有凹部的铜体，然后填充有低k电介质材料。 该方法允许形成镶嵌结构，而不会遇到由非平面特征和孔隙低K电介质损伤所呈现的各种问题。

公开(公告)号：US08733389B2

公开(公告)日：2014-05-27

申请号：US13370175

申请日：2012-02-09

Applicant: Chu-wan Hong ,  Ching-chen Shieh ,  Yuan-hao Chang ,  Tsung-yi Lo

Inventor： Chu-wan Hong ,  Ching-chen Shieh ,  Yuan-hao Chang ,  Tsung-yi Lo

IPC: F15B13/00

CPC classification number: F16K11/0856 ,  F16K27/065 ,  Y10T137/5109 ,  Y10T137/86566 ,  Y10T137/86831 ,  Y10T137/86871 ,  Y10T137/87249

Abstract: A mixed water control valve having a body and a spindle is disclosed. The body has two inlet pipes and two outlet pipes which are longitudinally corresponding to the two inlet pipes. The two inlet pipes are branched into a upper inlet pipe and a lower inlet pipe which are disposed in different height positions. The spindle is rotatably assembled in the body. The spindle has an upper and a lower inlets corresponding to the height of the upper and the lower inlet pipe and. The spindle also has an upper outlet and a lower outlet respectively corresponding to the two outlet pipe. Thereby, the spindle is detachable and convenient to repair and replace and the spindle is also capable of changing mounting directions to change the flowing directions of water and then to match the different arrangements of the inlet pipes of cold and hot water.

Abstract translation: 公开了一种具有主体和主轴的混合水控制阀。 本体具有两个入口管和两个出口管，其纵向对应于两个入口管。 两个入口管分支成设置在不同高度位置的上入口管和下入口管。 主轴可旋转地组装在主体中。 主轴具有对应于上部和下部入口管的高度的上部和下部入口。 主轴还具有分别对应于两个出口管的上出口和下出口。 因此，主轴可拆卸，便于修理和更换，主轴还能够改变安装方向以改变水的流动方向，然后匹配冷热水和热水入口管的不同布置。

公开(公告)号：US20140042621A1

公开(公告)日：2014-02-13

申请号：US13570065

申请日：2012-08-08

Applicant: Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

Inventor： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

IPC: H01L23/498 ,  H01L21/28 ,  H01L21/50

CPC classification number: H01L24/05 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85375 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20751

Abstract: An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.

Abstract translation: 一个实施例是一种封装封装（PoP）器件，其包括在第一衬底上的第一封装和在第一封装上的第二封装。 设置在第一封装和第二封装之间的多个线棒，并且多个线棒将第一封装耦合到第二封装。 多个线棒中的每一个包括固定到第一基板上的接合焊盘的第一高度的导线，并且多个线棒中的每一个嵌入焊接接头中。

公开(公告)号：US08629519B2

公开(公告)日：2014-01-14

申请号：US13333951

申请日：2011-12-21

Applicant: Chien-Min Lee ,  Kuang-Ching Chen ,  Fu-Tai Liou

Inventor： Chien-Min Lee ,  Kuang-Ching Chen ,  Fu-Tai Liou

IPC: H01L29/82

CPC classification number: H01L43/02 ,  G01R33/098 ,  H01F10/3254 ,  H01L27/22

Abstract: A tunneling magnetoresistance sensor including a substrate, an insulating layer, a tunneling magnetoresistance component and an electrode array is provided. The insulating layer is disposed on the substrate. The tunneling magnetoresistance component is embedded in the insulating layer. The electrode array is formed in a single metal layer and disposed in the insulating layer either below or above the TMR component. The electrode array includes a number of separate electrodes. The electrodes are electrically connected to the tunneling magnetoresistance component to form a current-in-plane tunneling conduction mode. The tunneling magnetoresistance sensor in this configuration can be manufactured with a reduced cost and maintain the high performance at the same time.

Abstract translation: 提供了包括基板，绝缘层，隧道磁阻部件和电极阵列的隧道式磁阻传感器。 绝缘层设置在基板上。 隧道磁阻分量嵌入在绝缘层中。 电极阵列形成在单个金属层中，并且设置在TMR部件的下方或上方的绝缘层中。 电极阵列包括多个单独的电极。 电极电连接到隧道磁阻分量以形成电流 - 平面隧穿传导模式。 这种结构中的隧道磁阻传感器可以以降低的成本制造并且同时保持高性能。