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    System and method for forming uniform rigid interconnect structures
    3.
    发明授权
    System and method for forming uniform rigid interconnect structures 有权
    用于形成均匀刚性互连结构的系统和方法

    公开(公告)号：US08796132B2

    公开(公告)日：2014-08-05

    申请号：US13539188

    申请日：2012-06-29

    申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    IPC分类号： H01L21/60 ,  H01L21/48

    CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

    摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

    System and Method for Forming Uniform Rigid Interconnect Structures
    9.
    发明申请
    System and Method for Forming Uniform Rigid Interconnect Structures 有权
    形成均匀刚性互连结构的系统和方法

    公开(公告)号：US20140004660A1

    公开(公告)日：2014-01-02

    申请号：US13539188

    申请日：2012-06-29

    申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    IPC分类号： H01L21/50

    CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

    摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。