公开(公告)号：US20100207157A1

公开(公告)日：2010-08-19

申请号：US12767845

申请日：2010-04-27

Applicant: Stefano SCHIAFFINO ,  Daniel A. STEIGERWALD ,  Mari HOLCOMB ,  Grigoriy BASIN ,  Paul MARTIN ,  John EPLER

Inventor： Stefano SCHIAFFINO ,  Daniel A. STEIGERWALD ,  Mari HOLCOMB ,  Grigoriy BASIN ,  Paul MARTIN ,  John EPLER

IPC: H01L33/62

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

Abstract translation: 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US07736945B2

公开(公告)日：2010-06-15

申请号：US11611775

申请日：2006-12-15

Applicant: Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

Inventor： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

Abstract translation: 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US20080157114A1

公开(公告)日：2008-07-03

申请号：US12049239

申请日：2008-03-14

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC: H01L33/00

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US08771577B2

公开(公告)日：2014-07-08

申请号：US12706149

申请日：2010-02-16

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: B29C43/18

CPC classification number: H01L33/504 ,  B29C43/18 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

Abstract translation: 包括波长转换材料的柔性膜位于光源上。 柔性膜符合预定的形状。 在一些实施例中，光源是安装在支撑衬底上的发光二极管。 二极管与模具中的压痕对准，使得柔性膜设置在支撑基板和模具之间。 透明成型材料设置在支撑基板和模具之间。 将支撑基板和模具压在一起以使模制材料填充凹陷。 柔性膜符合光源或模具的形状。

公开(公告)号：US20130133836A1

公开(公告)日：2013-05-30

申请号：US13816540

申请日：2011-07-19

Applicant: Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

Inventor： Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

IPC: B32B37/10

CPC classification number: B32B37/10 ,  B29C43/18 ,  B32B37/003 ,  B32B37/1009 ,  B32B39/00 ,  B32B2309/12 ,  B32B2309/65 ,  B32B2309/68 ,  B32B2457/08 ,  H01L33/52 ,  H05K3/284 ,  H05K2203/1311 ,  Y10T156/1744

Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

Abstract translation: 提供了一种层叠装置，其使树脂膜完全符合基板的突出和凹陷部分，并且使得适形树脂膜的膜厚度在更严格的水平上均匀。 为此，层压装置包括层压机构，其包括：封闭空间形成接收器，其能够在其中接收临时层压体; 以及用于在由封闭空间形成接收器形成的封闭空间中以非接触关系向临时层叠体施加压力的压力层压机，以从临时层压体形成端部层叠体。

公开(公告)号：US20110031516A1

公开(公告)日：2011-02-10

申请号：US12537909

申请日：2009-08-07

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: H01L33/00 ,  H01L21/56

CPC classification number: H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16 ,  H01L2933/0041

Abstract: A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.

Abstract translation: 描述了一种用于制造发光器件的方法，其中倒装芯片发光二极管（LED）管芯的阵列安装在基座晶片上。 在每个LED管芯上同时模制半球形的第一硅氧烷层。 将预先形成的柔性荧光体层，包括注入硅氧烷的荧光体粉末层压在第一硅氧烷层上，以符合半球形第一硅氧烷层的外表面。 然后在荧光体层上模制硅树脂透镜。 通过预处理荧光体层，可以使荧光体层具有非常严格的公差并进行测试。 通过模制的半球状硅氧烷层将荧光体层与LED芯片分开，颜色与视角是恒定的，并且荧光体不会被热降解。 柔性荧光体层可以包括多个不同的荧光体层，并且可以包括反射器或其它层。

公开(公告)号：US07344902B2

公开(公告)日：2008-03-18

申请号：US11069418

申请日：2005-02-28

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC: H01L21/00

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US08899291B2

公开(公告)日：2014-12-02

申请号：US13816540

申请日：2011-07-19

Applicant: Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

Inventor： Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

IPC: B32B37/10 ,  B29C43/18 ,  B32B39/00 ,  B32B37/00 ,  H05K3/28 ,  H01L33/52

CPC classification number: B32B37/10 ,  B29C43/18 ,  B32B37/003 ,  B32B37/1009 ,  B32B39/00 ,  B32B2309/12 ,  B32B2309/65 ,  B32B2309/68 ,  B32B2457/08 ,  H01L33/52 ,  H05K3/284 ,  H05K2203/1311 ,  Y10T156/1744

Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

Abstract translation: 提供了一种层叠装置，其使树脂膜完全符合基板的突出和凹陷部分，并且使得适形树脂膜的膜厚度在更严格的水平上均匀。 为此，层压装置包括层压机构，其包括：封闭空间形成接收器，其能够接收临时层压体; 以及用于在由封闭空间形成接收器形成的封闭空间中以非接触关系向临时层叠体施加压力的压力层压机，以从临时层压体形成端部层叠体。

公开(公告)号：US08471280B2

公开(公告)日：2013-06-25

申请号：US12613924

申请日：2009-11-06

Applicant: Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

Inventor： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

IPC: H01L23/29

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.

Abstract translation: 在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度的金柱。 金柱结合到底座电极。 然后将底部填充材料模制以填充LED底部和底座之间的空隙。 底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。 氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。 氧化铝是白色粉末。 底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。 底部填充物也随机化光散射，改善光提取。 分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

公开(公告)号：US08232117B2

公开(公告)日：2012-07-31

申请号：US12771809

申请日：2010-04-30

Applicant: Grigoriy Basin ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Paul S. Martin

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/14 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

Abstract: An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

Abstract translation: 具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。 然后去除生长衬底，例如通过激光剥离。 然后蚀刻LED层的暴露表面以改善光提取。 然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。 然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。 然后将底座晶片切割以产生单独的LED。 有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。