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公开(公告)号：US20230380422A1
公开(公告)日：2023-11-30
申请号：US18247325
申请日：2021-05-07
申请人： IBIDEN CO., LTD.
发明人： Katsuya OHNO , Tomohiro NOHARA , Kumiko TAKADA
摘要： The objective of the invention is to provide a plant activator with superior plant growth-promoting effect and low toxicity and soil contamination. A plant activator comprising, as an active ingredient,
a hydroxy fatty acid derivative of general formula (I) and/or (II):
HOOC—(R1)—CH(OH)—CH(OH)—CH═CH—CH(OH)—R2 (I),
HOOC—(R1)—CH(OH)—CH═CH—CH(OH)—CH(OH)—R2 (II),
(wherein, R1 is a straight or branched hydrocarbon group with 4 to 12 carbon atoms, optionally comprises one or more double bonds and/or OH groups, and the position of the double bond is not limited, provided that the double bond is comprised, and R2 is a straight or branched hydrocarbon group with 2 to 8 carbon atoms, optionally comprises one or more double bonds and/or OH groups, and the position of the double bond is not limited, provided that the double bond is comprised) or a salt or an ester thereof.-
公开(公告)号：US11832397B2
公开(公告)日：2023-11-28
申请号：US17105768
申请日：2020-11-27
申请人： IBIDEN CO., LTD.
发明人： Masashi Awazu , Keisuke Kojima
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/24 , H05K3/30 , H05K3/34 , H05K3/40 , H05K3/46 , H01L21/48 , H01L21/66 , H01L21/683 , H01L21/768 , H01L23/00 , H01L23/15 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/525 , H01L23/538 , H05K3/42
CPC分类号： H05K3/3452 , H05K1/116 , H05K3/422 , H05K3/4661 , H05K3/4679 , H05K2201/09563
摘要： A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductors, respectively, and a solder resist layer formed on the resin insulating layer such that the metal posts have lower portions embedded in the solder resist layer and upper portions exposed from the solder resist layer, respectively. The metal posts are formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts.
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公开(公告)号：US11792929B2
公开(公告)日：2023-10-17
申请号：US17588457
申请日：2022-01-31
申请人： IBIDEN CO., LTD.
发明人： Takema Adachi , Daisuke Minoura
IPC分类号： H05K1/02 , H05K1/09 , H05K3/10 , H05K3/26 , H05K3/38 , H01L23/13 , H01L23/60 , H01L23/498 , H05K1/11 , H05K3/42
CPC分类号： H05K1/116 , H05K3/26 , H05K3/389 , H05K3/422 , H05K2201/0989
摘要： A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor penetrating through the second insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the second insulating layer. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is in contact with the connection conductor and the wiring pattern is covered by the coating film, the conductor pad of the first conductor layer has a surface facing the second insulating layer and having a first surface roughness higher than a surface roughness of a surface of the wiring pattern, and the coating film has opening such that the opening is exposing the conductor pad entirely.
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公开(公告)号：US11792925B2
公开(公告)日：2023-10-17
申请号：US17555575
申请日：2021-12-20
申请人： IBIDEN CO., LTD.
发明人： Kyohei Yoshikawa
CPC分类号： H05K1/0313 , H05K1/0298 , H05K1/11 , H05K1/0242 , H05K1/0296
摘要： A printed wiring board includes a first resin insulating layer, a second resin insulating layer formed on a surface of the first layer, and a conductor layer formed on the surface of the first layer such that the second layer is covering the conductor layer and that the conductor layer includes first, second, third, fourth, fifth, and sixth circuits such that the third and fourth circuits are sandwiching the first circuit and that the fifth and sixth circuits are sandwiching the second circuit. Widths between the first and third circuits and between the first and fourth circuits are 5 μm to 14 μm, and when a width between the second and fifth circuits and a width between the second and sixth circuits is 20 μm or more, the upper surface of the first circuit, and the upper surface and side walls of the second circuit are formed to have unevenness.
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公开(公告)号：US11789063B2
公开(公告)日：2023-10-17
申请号：US17488353
申请日：2021-09-29
申请人： IBIDEN CO., LTD.
发明人： Takayuki Mori , Taishi Takeda
CPC分类号： G01R31/2808 , G01R1/0416
摘要： A conduction inspection jig includes a first member having first openings, a second member having second openings and formed to be positioned above the first member, a third member formed to be positioned between the first member and the second member such that the third member forms a space between the first member and the second member and at least substantially surrounds the space, and a probe formed to pass through one of the first openings and one of the second openings such that the probe extends through the space formed between the first member and the second member.
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公开(公告)号：US20230292448A1
公开(公告)日：2023-09-14
申请号：US18182069
申请日：2023-03-10
申请人： IBIDEN CO., LTD.
发明人： Kentaro WADA , Koji KONDO
CPC分类号： H05K3/38 , H05K3/4688 , H05K1/112
摘要： A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.
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公开(公告)号：US11729912B2
公开(公告)日：2023-08-15
申请号：US17388134
申请日：2021-07-29
申请人： IBIDEN CO., LTD.
发明人： Kosuke Ikeda
CPC分类号： H05K1/119 , H05K3/381 , H05K1/0373 , H05K3/108 , H05K2201/0344
摘要： A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.
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公开(公告)号：US11729911B2
公开(公告)日：2023-08-15
申请号：US17674038
申请日：2022-02-17
申请人： IBIDEN CO., LTD.
发明人： Akinori Yoshida , Katsuhiko Tanno
CPC分类号： H05K1/111 , H05K3/34 , H05K3/4007 , H05K3/4605
摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including conductor pads, an underlayer formed on one of the conductor pads and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer. The conductor pads include a second conductor pad such that the second conductor pad is the one of the conductor pads having the underlayer.
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公开(公告)号：US11683891B2
公开(公告)日：2023-06-20
申请号：US17450591
申请日：2021-10-12
申请人： IBIDEN CO., LTD.
发明人： Yasuhiro Kawai
CPC分类号： H05K3/4038 , H05K1/0269 , H05K2203/166
摘要： A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.
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公开(公告)号：US11658534B2
公开(公告)日：2023-05-23
申请号：US17450856
申请日：2021-10-14
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC分类号： H02K3/26
CPC分类号： H02K3/26 , H02K2203/03
摘要： A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
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