公开(公告)号：US08772084B2

公开(公告)日：2014-07-08

申请号：US13618041

申请日：2012-09-14

Applicant: Jong-Gi Lee ,  Kwang-Yong Lee ,  Min-Ho Lee

Inventor： Jong-Gi Lee ,  Kwang-Yong Lee ,  Min-Ho Lee

IPC: H01L21/44 ,  H01L23/02

CPC classification number: H01L24/82 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/16225 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24145 ,  H01L2224/244 ,  H01L2224/24998 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.

Abstract translation: 制备具有形成在其上表面上的第一突起电极的第一半导体芯片。 具有第二投影电极的第二半导体芯片安装在第一半导体芯片上以暴露第一投影电极。 在第一投影电极和第二投影电极之间形成绝缘膜。 在绝缘膜中形成凹槽。 形成了用于填充凹槽内部并连接到第一突出电极和第二突起电极的互连。

公开(公告)号：US08664762B2

公开(公告)日：2014-03-04

申请号：US13594841

申请日：2012-08-26

Applicant: Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

Inventor： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

IPC: H01L23/48

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/12105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

Abstract: In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

Abstract translation: 在一个实施例中，半导体封装可以包括：半导体芯片，其具有形成在其第一表面上的芯片焊盘，用于密封半导体芯片并暴露半导体芯片的第一表面的密封构件，覆盖第一 并且直接接触密封部件的上表面的一部分。 导电布线还接触垫。 半导体封装还可以包括覆盖导电布线并具有露出导电布线部分的开口的密封剂。

公开(公告)号：US08254140B2

公开(公告)日：2012-08-28

申请号：US12357693

申请日：2009-01-22

Applicant: Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

Inventor： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC: H05K7/10

CPC classification number: H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

Abstract translation: 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US20090318653A1

公开(公告)日：2009-12-24

申请号：US12525589

申请日：2008-02-13

Applicant: Kyo-Duck Ahn ,  Jong-Gi Lee ,  Choun-San Kim ,  Young-Shin Kim

Inventor： Kyo-Duck Ahn ,  Jong-Gi Lee ,  Choun-San Kim ,  Young-Shin Kim

IPC: C08F220/04 ,  C08F220/06

CPC classification number: C08F220/04 ,  C08F220/06 ,  C08F220/10

Abstract: The present invention relates to a composition for manufacturing a carboxylic group-containing polymer and a carboxylic group-containing polymer manufactured by using the same. More particularly, the present invention relates to a composition for manufacturing a carboxylic group-containing polymer comprising an allyl monomer having a long chain of a hydrophilic part containing alkylene oxide and a side chain of a hydrophobic part containing fatty acid ester as a dispersion promoter; a vinyl group-containing unsaturated carboxylic acid; a vinyl group-containing crosslinking agent; and a radical polymerization initiator, and a carboxylic group-containing polymer manufactured by using the same wherein the polymer can be dispersed in water without stirring, its dispersion solution has low viscosity, and its neutralized viscous solution obtained by alkali neutralization has high viscosity and transparency. Therefore, the carboxylic group-containing polymer of the present invention can be effectively used in the fields of a thickener and a dispersion stabilizer for an emulsion, a suspension and the like.

Abstract translation: 本发明涉及用于制造含羧基聚合物的组合物和使用该组合物制造的含羧基聚合物。 更具体地说，本发明涉及一种含有羧基的聚合物的组合物，该组合物包含具有长链的含有烯化氧的亲水部分和含有脂肪酸酯的疏水部分的侧链作为分散促进剂的烯丙基单体， 含乙烯基的不饱和羧酸; 含乙烯基的交联剂; 和自由基聚合引发剂以及通过使用该聚合物制造的含羧基的聚合物，其中聚合物可以在不搅拌的情况下分散在水中，其分散溶液具有低粘度，并且其通过碱中和获得的中和的粘稠溶液具有高粘度和透明度 。 因此，本发明的含羧基的聚合物可以有效地用于乳液，悬浮液等的增稠剂和分散稳定剂领域。

公开(公告)号：US20090127314A1

公开(公告)日：2009-05-21

申请号：US12272867

申请日：2008-11-18

Applicant: Min-Ill KIM ,  Jong-Gi Lee ,  Kwang-Yong Lee ,  Ki-Kwon Jeong

Inventor： Min-Ill KIM ,  Jong-Gi Lee ,  Kwang-Yong Lee ,  Ki-Kwon Jeong

IPC: B23K3/00

CPC classification number: B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract translation: 一种在线封装装置包括第一处理单元，输入存储单元，加热单元和输出存储单元。 第一处理单元执行球连接处理或芯片安装处理。 在第一处理单元中完成处理的处理对象被接收在盒中以便被垂直堆叠，并且每个具有一个或多个处理对象的多个杂志被存储在输入堆叠器中。 加热单元通过感应加热方法对存储在输入堆叠器中的仓库中的处理对象进行回流处理。 回收处理完成的处理对象被接收在仓库中，然后存储在输出堆垛机中。

公开(公告)号：US06221371B1

公开(公告)日：2001-04-24

申请号：US09308031

申请日：1999-05-10

Applicant: In-sub Baik ,  Jong-gi Lee ,  Byeong-deog Park ,  Yoon Kim ,  Myung-jin Lee

Inventor： In-sub Baik ,  Jong-gi Lee ,  Byeong-deog Park ,  Yoon Kim ,  Myung-jin Lee

IPC: A61K600

CPC classification number: A61Q19/00 ,  A61K8/68 ,  A61Q5/00 ,  A61Q5/02 ,  A61Q17/00 ,  A61Q19/08 ,  C07C235/08 ,  C07C235/74 ,  C07H15/12

Abstract: The present invention relates to pseudoceramide derivatives represented by formula(I) or (II): R1—COCHR2CONR3R4  (I) R1—CH(OH)CHR2CONR3R4  (II) wherein, each of R1 and R2 represents linear or branched alkyl group or alkenyl group having 6˜22 carbon atoms; each of R3 and R4 represents hydrogen, methyl, ethyl, propyl, or linear or branched C2˜C6 alkyl group having one or more hydroxyl group(s), or monosaccharide, a process for preparing the same, and dermatologic external preparations containing the same. When the pseudoceramide derivatives according to the present invention are applied in an dermatologic external preparations the moisture-retaining property and resilience of skin and hair is enhanced such so that the derivatives are useful in protection of skin-aging. In addition, the derivatives are useful for inducing the formation of lipid layer on damaged skin and for preventing the inhibition of lipid synthesis.

Abstract translation: 本发明涉及由式（I）或（II）表示的假花生酰胺衍生物：其中，R1和R2各自表示具有6〜22个碳原子的直链或支链烷基或烯基; R 3和R 4各自表示氢，甲基，乙基，丙基或具有一个或多个羟基或单糖的直链或支链C 2 -C 6烷基，其制备方法和含有该羟基的皮肤外用制剂 。 当根据本发明的假心外酰胺衍生物应用于皮肤外用制剂时，皮肤和毛发的保湿性和弹性得到增强，使得衍生物可用于保护皮肤老化。 此外，该衍生物可用于诱导损伤皮肤上形成脂质层并防止脂质合成的抑制。