Method for Producing a Semiconductor Chip Emitting Radiation, Semiconductor Chip Emitting Radiation, and Component Emitting Radiation
    21.
    发明申请
    Method for Producing a Semiconductor Chip Emitting Radiation, Semiconductor Chip Emitting Radiation, and Component Emitting Radiation 有权
    用于生产半导体芯片发射辐射,半导体芯片发射辐射和分量发射辐射的方法

    公开(公告)号:US20140008683A1

    公开(公告)日:2014-01-09

    申请号:US13991408

    申请日:2011-11-23

    IPC分类号: H01L33/50

    摘要: A method is provided for producing a radiation-emitting semiconductor chip, in which a first wavelength-converting layer is applied over the radiation exit face of a semiconductor body. The application method is selected from the following group: sedimentation, electrophoresis. In addition, a second wavelength-converting layer is applied over the radiation exit face of the semiconductor body. The second wavelength-converting layer is either produced in a separate method step and then applied or the application method is sedimentation, electrophoresis or printing. Furthermore, a radiation-emitting semiconductor chip and a radiation-emitting component are provided.

    摘要翻译: 提供了一种制造辐射发射半导体芯片的方法,其中将第一波长转换层施加在半导体本体的辐射出射面上。 应用方法选自下列组别:沉淀,电泳。 此外,在半导体本体的辐射出射面上施加第二波长转换层。 第二波长转换层是以单独的方法步骤生产的,然后施加或应用方法是沉降,电泳或印刷。 此外,提供了辐射发射半导体芯片和辐射发射部件。

    Method for manufacturing at least one optoelectronic semiconductor device
    23.
    发明授权
    Method for manufacturing at least one optoelectronic semiconductor device 有权
    制造至少一个光电半导体器件的方法

    公开(公告)号:US09406853B2

    公开(公告)日:2016-08-02

    申请号:US13982225

    申请日:2011-12-21

    摘要: A method for manufacturing at least one optoelectronic semiconductor device includes providing a substrate and applying a number of optoelectronic semiconductor chips, which are arranged spaced apart from one another in a lateral direction, on an upper face of the substrate. At least one reflective coating is applied to the exposed areas of the substrate and the lateral surfaces of the optoelectronic semiconductor chips. Openings are introduced into the reflective coating, which completely penetrate the reflective coating. Electrically conductive material is arranged on the reflective coating and at least on some parts of the openings. Radiation penetration surfaces of the optoelectronic semiconductor chips are free of the reflective coating and the reflective coating does not laterally extend beyond the optoelectronic semiconductor chips.

    摘要翻译: 一种用于制造至少一个光电子半导体器件的方法包括:在衬底的上表面上提供衬底和施加多个在横向彼此间隔开的光电子半导体芯片。 至少一个反射涂层施加到基板的暴露区域和光电子半导体芯片的侧表面。 开口被引入到完全穿透反射涂层的反射涂层中。 导电材料布置在反射涂层上并且至少在开口的某些部分上。 光电子半导体芯片的辐射穿透表面没有反射涂层,反射涂层不横向延伸超过光电子半导体芯片。

    Method for producing a semiconductor chip emitting radiation, semiconductor chip emitting radiation, and component emitting radiation
    24.
    发明授权
    Method for producing a semiconductor chip emitting radiation, semiconductor chip emitting radiation, and component emitting radiation 有权
    用于制造发射辐射的半导体芯片,发射辐射的半导体芯片和发射辐射的部件的方法

    公开(公告)号:US08962361B2

    公开(公告)日:2015-02-24

    申请号:US13991408

    申请日:2011-11-23

    IPC分类号: H01L21/00 H01L33/50

    摘要: A method is provided for producing a radiation-emitting semiconductor chip, in which a first wavelength-converting layer is applied over the radiation exit face of a semiconductor body. The application method is selected from the following group: sedimentation, electrophoresis. In addition, a second wavelength-converting layer is applied over the radiation exit face of the semiconductor body. The second wavelength-converting layer is either produced in a separate method step and then applied or the application method is sedimentation, electrophoresis or printing. Furthermore, a radiation-emitting semiconductor chip and a radiation-emitting component are provided.

    摘要翻译: 提供了一种制造辐射发射半导体芯片的方法,其中将第一波长转换层施加在半导体本体的辐射出射面上。 应用方法选自下列组别:沉淀,电泳。 此外,在半导体本体的辐射出射面上施加第二波长转换层。 第二波长转换层是以单独的方法步骤生产的,然后施加或应用方法是沉降,电泳或印刷。 此外,提供了发射辐射的半导体芯片和发射辐射的部件。

    OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND MODULE WITH A PLURALITY OF SUCH COMPONENTS
    25.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND MODULE WITH A PLURALITY OF SUCH COMPONENTS 有权
    光电子半导体元件和具有多个这种元件的模块

    公开(公告)号:US20150022762A1

    公开(公告)日:2015-01-22

    申请号:US14345645

    申请日:2012-08-16

    IPC分类号: H01L31/16 F21V8/00 G02F1/1335

    摘要: The invention relates to a semi-conductor component, comprising a semi-conductor chip (1) which has an active layer (1a) suitable for generating radiation and suitable for emitting radiation in the blue wavelength range. A first converter (3a) comprising a Ce doping is arranged downstream of the semiconductor chip (1) in the emission direction. In addition, a second converter (3b) comprising a minimum Ce doping of 1.5% is arranged downstream of the semiconductor chip (1) in the emission direction. The invention further relates to a module with a plurality of such components.

    摘要翻译: 本发明涉及一种半导体部件,其包括半导体芯片(1),该半导体芯片(1)具有适于产生辐射的适合于发射蓝色波长范围的辐射的有源层(1a)。 包括Ce掺杂的第一转换器(3a)在发射方向上布置在半导体芯片(1)的下游。 此外,包括1.5%的最小Ce掺杂的第二转换器(3b)在发射方向上布置在半导体芯片(1)的下游。 本发明还涉及具有多个这样的组件的模块。