Semiconductor memory device performing auto refresh in the self refresh mode
    21.
    发明申请
    Semiconductor memory device performing auto refresh in the self refresh mode 有权
    在自刷新模式下执行自动刷新的半导体存储器件

    公开(公告)号:US20060018174A1

    公开(公告)日:2006-01-26

    申请号:US11169241

    申请日:2005-06-27

    Abstract: Method and apparatus for use with multi-bank Synchronous Dynamic Random Access Memory (SDRAM) circuits, modules, and memory systems are disclosed. In one described embodiment, an SDRAM circuit receives a bank address to be used in an auto-refresh operation, and performs the auto-refresh operation on the specified bank and for a current refresh row. The device is allowed to enter a self-refresh mode before auto-refresh operations have been completed for all banks and the current refresh row. The memory device completes refresh operations for the current refresh row before proceeding to perform self-refresh operations for new rows. Other embodiments are described and claimed.

    Abstract translation: 公开了用于多存储体同步动态随机存取存储器(SDRAM)电路,模块和存储器系统的方法和装置。 在一个描述的实施例中,SDRAM电路接收要在自动刷新操作中使用的存储体地址,并对指定的存储体和当前刷新行执行自动刷新操作。 在所有存储区和当前刷新行完成自动刷新操作之前,允许该设备进入自刷新模式。 在继续对新行执行自刷新操作之前,内存设备完成当前刷新行的刷新操作。 描述和要求保护其他实施例。

    Circuits and methods for providing page mode operation in semiconductor memory device having partial activation architecture

    公开(公告)号:US06826115B2

    公开(公告)日:2004-11-30

    申请号:US10640146

    申请日:2003-08-13

    CPC classification number: G11C7/1021 G11C8/10 G11C8/12

    Abstract: A semiconductor memory device having a partial activation framework, which provides an efficient page mode operation while operating in a partial activation mode. Control circuits and methods are provided to enable a page mode operation (for read and write data accesses) in a semiconductor memory device (such as a DRAM, FCRAM) having a partial activation framework, resulting in an improved data access speed when data is written/read from memory locations having the same wordline address. In one aspect, a method for accessing data in a memory device comprises activating a first wordline corresponding to a first address to perform a data access operation, receiving a second address after the first address, if the second address is the same as the first address, generating a page mode enable signal for maintaining an activated state of the first wordline corresponding to the first address while activating a second wordline corresponding to the second address, and deactivating the first and second wordlines in response to disabling of the page mode enable signal.

    SEMICONDUCTOR MEMORY DEVICES AND RELATED METHODS OF OPERATION
    24.
    发明申请
    SEMICONDUCTOR MEMORY DEVICES AND RELATED METHODS OF OPERATION 有权
    半导体存储器件及其相关操作方法

    公开(公告)号:US20130322162A1

    公开(公告)日:2013-12-05

    申请号:US13907223

    申请日:2013-05-31

    Abstract: A semiconductor memory device includes a cell array including one or more bank groups, where each of the one or more bank groups includes a plurality of banks and each of the plurality of banks includes a plurality of spin transfer torque magneto resistive random access memory (STT-MRAM) cells. The semiconductor memory device further includes a source voltage generating unit for applying a voltage to a source line connected to the each of the plurality of STT-MRAM cells, and a command decoder for decoding a command from an external source in order to perform read and write operations on the plurality of STT-MRAM cells. The command includes a combination of at least one signal of a row address strobe (RAS), a column address strobe (CAS), a chip selecting signal (CS), a write enable signal (WE), and a clock enable signal (CKE)

    Abstract translation: 半导体存储器件包括一个单元阵列,其包括一个或多个存储体组,其中一个或多个存储体组中的每个组包括多个存储体,并且多个存储体中的每一个存储体包括多个自旋传递转矩磁阻随机存取存储器(STT -MRAM)细胞。 半导体存储器件还包括用于向连接到多个STT-MRAM单元中的每一个的源极线施加电压的源极电压产生单元,以及用于对来自外部源的命令进行解码的命令解码器,以执行读取和 对多个STT-MRAM单元进行写入操作。 该命令包括行地址选通(RAS),列地址选通(CAS),片选信号(CS),写使能信号(WE)和时钟使能信号(CKE)的至少一个信号 )

    Stress detection circuit and semiconductor chip including same
    27.
    发明授权
    Stress detection circuit and semiconductor chip including same 有权
    应力检测电路和包括其的半导体芯片

    公开(公告)号:US08042404B2

    公开(公告)日:2011-10-25

    申请号:US12128159

    申请日:2008-05-28

    Abstract: A stress detection circuit includes a function block and a detection signal generation circuit. The function block outputs a first voltage such that the first voltage is varied depending on an extent that the function block is stressed. The detection signal generation circuit generates a stress detection signal based on the first voltage and a second voltage during a test mode. The stress detection signal represents integration of the function block, and a level of the second voltage corresponds to a level of the first voltage before the function block is stressed.

    Abstract translation: 应力检测电路包括功能块和检测信号生成电路。 功能块输出第一电压,使得第一电压根据功能块受应力的程度而变化。 检测信号发生电路在测试模式期间产生基于第一电压和第二电压的应力检测信号。 应力检测信号表示功能块的积分,第二电压的电平对应于在功能块受到应力之前的第一电压的电平。

    Memory cell array and semiconductor memory device including the same
    28.
    发明授权
    Memory cell array and semiconductor memory device including the same 失效
    存储单元阵列和包括其的半导体存储器件

    公开(公告)号:US07894241B2

    公开(公告)日:2011-02-22

    申请号:US12326940

    申请日:2008-12-03

    CPC classification number: G11C11/4091 G11C7/065 G11C7/12 G11C11/4094

    Abstract: A memory cell array with open bit line structure includes a first sub memory cell array, a second sub memory cell array, a sense-amplifier/precharge circuit, first capacitors and second capacitors. The first sub memory cell array is activated in response to a first word line enable signal, and the second sub memory cell array is activated in response to a second word line enable signal. The sense-amplifier/precharge circuit is connected to the first sub memory cell array through first bit lines and to the second sub memory cell array through second bit lines, and the sense-amplifier/precharge circuit precharges the first bit lines and the second bit lines and amplifies data provided from the first sub memory cell array and the second sub memory cell array.

    Abstract translation: 具有开放位线结构的存储单元阵列包括第一子存储单元阵列,第二子存储单元阵列,读出放大器/预充电电路,第一电容器和第二电容器。 第一子存储单元阵列响应于第一字线使能信号被激活,并且第二子存储单元阵列响应于第二字线使能信号被激活。 感测放大器/预充电电路通过第一位线连接到第一子存储单元阵列,并通过第二位线连接到第二子存储单元阵列,并且读出放大器/预充电电路对第一位线和第二位进行预充电 并且放大从第一子存储单元阵列和第二子存储单元阵列提供的数据。

    Semiconductor memory device and testing method of the same
    29.
    发明授权
    Semiconductor memory device and testing method of the same 有权
    半导体存储器件及其测试方法相同

    公开(公告)号:US07734967B2

    公开(公告)日:2010-06-08

    申请号:US11863500

    申请日:2007-09-28

    CPC classification number: G11C29/14 G11C29/12015 G11C2029/3602

    Abstract: A semiconductor memory device, having a test mode and a normal mode, includes a frequency multiplier and a test command sequence generator. The frequency multiplier receives a test clock signal in the test mode and generates multiple internal test clock signals, each of which has a frequency equal to a frequency of an operation clock signal in the normal mode. The test clock signal has a frequency lower than the frequency of the operation clock signal. The test command sequence generator generates at least one command signal in response to the internal test clock signals in the test mode. The at least one command signal corresponds to at least one operation timing parameter of the semiconductor memory device that is to be measured. The frequency multiplier may include a Phase Locked Loop (PLL) or a Delay Locked Loop (DLL).

    Abstract translation: 具有测试模式和正常模式的半导体存储器件包括倍频器和测试命令序列发生器。 倍频器在测试模式下接收测试时钟信号,并产生多个内部测试时钟信号,每个内部测试时钟信号的频率等于正常模式下的工作时钟信号的频率。 测试时钟信号的频率低于操作时钟信号的频率。 测试命令序列发生器响应于测试模式中的内部测试时钟信号而产生至少一个命令信号。 所述至少一个命令信号对应于待测量的半导体存储器件的至少一个操作定时参数。 倍频器可以包括锁相环(PLL)或延迟锁定环(DLL)。

    Semiconductor memory device and redundancy method of the same
    30.
    发明申请
    Semiconductor memory device and redundancy method of the same 有权
    半导体存储器件和冗余方法相同

    公开(公告)号:US20080126876A1

    公开(公告)日:2008-05-29

    申请号:US11723473

    申请日:2007-03-20

    Applicant: Yun-Sang Lee

    Inventor: Yun-Sang Lee

    Abstract: A semiconductor memory device may include a memory cell array, a redundancy address decoder, a defective address detection unit, and a defective address program unit. The memory cell array includes a plurality of memory cell groups and a predetermined number of redundancy memory cell groups. The redundancy address decoder includes a predetermined number of redundancy decoders for accessing at least one group of the redundancy memory cell groups when a first defective address is identical to an externally applied address. The defective address detection unit performs a write operation and a read operation on the memory cell array during a test operation to detect a defective address, and outputs the detected defective address as the first defective address when the same defective address is detected a predetermined number of times or more. The defective address program unit receives and programs the first defective address output from the defective address detection unit during a program operation.

    Abstract translation: 半导体存储器件可以包括存储单元阵列,冗余地址解码器,缺陷地址检测单元和缺陷地址程序单元。 存储单元阵列包括多个存储单元组和预定数量的冗余存储单元组。 冗余地址解码器包括预定数量的冗余解码器,用于当第一缺陷地址与外部施加的地址相同时,用于访问至少一组冗余存储单元组。 缺陷地址检测单元在测试操作期间对存储单元阵列执行写入操作和读取操作以检测缺陷地址,并且当检测到相同的缺陷地址时,将检测到的缺陷地址作为第一缺陷地址输出到预定数量的 次以上。 缺陷地址程序单元在编程操作期间接收并编程从缺陷地址检测单元输出的第一缺陷地址。

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