公开(公告)号：US10297712B2

公开(公告)日：2019-05-21

申请号：US14312554

申请日：2014-06-23

Applicant: APPLE INC.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  H01L33/04 ,  F21V7/00 ,  H01L29/06 ,  H01L33/00 ,  H01L27/15 ,  H01L33/28 ,  H01L33/30 ,  H01L25/075 ,  H01L33/20

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：US20190096864A1

公开(公告)日：2019-03-28

申请号：US15908478

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Edzer Huitema ,  Vaibhav Patel ,  Tore Nauta ,  Xia Li ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：US10121864B2

公开(公告)日：2018-11-06

申请号：US15282200

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L29/167 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  B32B38/18

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US09895902B2

公开(公告)日：2018-02-20

申请号：US15279083

申请日：2016-09-28

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: G01P15/125 ,  B41J2/385 ,  H01L25/075 ,  B25J15/00 ,  H01L21/683 ,  B81C99/00 ,  B41J2/39 ,  H01L21/67 ,  H01L33/00 ,  H01L23/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20160336484A1

公开(公告)日：2016-11-17

申请号：US15223900

申请日：2016-07-29

Applicant: Apple Inc.

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan ,  Daniel Arthur Haeger

IPC: H01L33/14 ,  H01L27/15 ,  H01L33/42 ,  H01L33/30 ,  H01L33/00 ,  H01L25/075 ,  H01L33/06

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：US09478583B2

公开(公告)日：2016-10-25

申请号：US14563772

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L27/15 ,  H01L33/62 ,  H01L51/00

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/44 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/24 ,  H01L2251/5338 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y02E10/549 ,  Y02P70/521

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.

Abstract translation: 描述了适合的电子设备和用于形成这种设备的方法。 适应电子器件的实施例可以包括厚度为50μm或更小的硅衬底。 电耦合到控制器芯片的LED阵列可以形成在硅衬底的表面上。 在一个实施例中，顶部钝化层形成在LED阵列上，一个或多个控制器芯片和硅衬底的顶表面上。 实施例还包括形成在硅衬底的底表面上的底部钝化层。

公开(公告)号：US20160308103A1

公开(公告)日：2016-10-20

申请号：US15192936

申请日：2016-06-24

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Kevin K.C. Chang ,  Andreas Bibl

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/06 ,  H01L33/32 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US20240234399A9

公开(公告)日：2024-07-11

申请号：US18494109

申请日：2023-10-25

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20210028153A1

公开(公告)日：2021-01-28

申请号：US16998917

申请日：2020-08-20

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US10665578B2

公开(公告)日：2020-05-26

申请号：US15908478

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Edzer Huitema ,  Vaibhav Patel ,  Tore Nauta ,  Xia Li ,  Hsin-Hua Hu

IPC: H01L21/78 ,  H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56 ,  H01L21/683 ,  H01L25/075

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.