公开(公告)号：US20140199840A1

公开(公告)日：2014-07-17

申请号：US14143276

申请日：2013-12-30

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Thomas H. Osterheld ,  Hung Chen ,  Terrance Y. Lee

IPC: H01L21/306 ,  H01L21/67

CPC classification number: B24B37/044 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

Abstract: In one aspect, a substrate polishing apparatus is disclosed. The apparatus has a polishing platform having two or more zones, each zone adapted to contain a different slurry component. In another aspect, a substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

Abstract translation: 一方面，公开了一种基板研磨装置。 该设备具有具有两个或更多个区域的抛光平台，每个区域适于容纳不同的浆料组分。 在另一方面，提供一种基板抛光系统，其具有用于保持基板的保持器，具有抛光垫的抛光平台和适于以定时顺序分配至少两种不同的浆料组分的分配系统，所述浆料组分选自 的氧化浆料组分，材料去除浆料组分和腐蚀抑制浆料组分。 提供了适于抛光底物的抛光方法和系统，以及许多其它方面。

公开(公告)号：US11673225B2

公开(公告)日：2023-06-13

申请号：US17555056

申请日：2021-12-17

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B33Y10/00 ,  B29C64/112 ,  B24B37/26 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/209 ,  B33Y80/00 ,  B24D18/00 ,  B29C35/08 ,  B29K75/00 ,  B29K509/02 ,  B29K105/00 ,  B29K105/16 ,  B29L31/00

CPC classification number: B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/209 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US10281261B2

公开(公告)日：2019-05-07

申请号：US15184276

申请日：2016-06-16

Applicant: Applied Materials, Inc.

Inventor： Khokan C. Paul ,  Edward Budiarto ,  Todd Egan ,  Mehdi Vaez-Iravani ,  Jeongmin Lee ,  Dale R. Du Bois ,  Terrance Y. Lee

IPC: G01B11/06 ,  H01L21/66 ,  G01B7/06 ,  C23C16/52 ,  C23C16/509 ,  H01J37/32 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to apparatus and methods for forming films having uniformity of thickness on substrates. Embodiments of the present disclosure may be used to measure thickness or other properties of films being deposited on a substrate without knowing beforehand the surface properties of the substrate. Embodiments of the present disclosure may be used to measure thickness or other properties of a plurality of layers being formed. For example, embodiments of the present disclosure may be used in measuring thickness of vertical memory stacks.

公开(公告)号：US10060032B2

公开(公告)日：2018-08-28

申请号：US15802496

申请日：2017-11-03

Applicant: Applied Materials, Inc.

Inventor： Nagarajan Rajagopalan ,  Xinhai Han ,  Michael Wenyoung Tsiang ,  Masaki Ogata ,  Zhijun Jiang ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Jianhua Zhou ,  Ramprakash Sankarakrishnan ,  Amit Kumar Bansal ,  Jeongmin Lee ,  Todd Egan ,  Edward Budiarto ,  Dmitriy Panasyuk ,  Terrance Y. Lee ,  Jian J. Chen ,  Mohamad A. Ayoub ,  Heung Lak Park ,  Patrick Reilly ,  Shahid Shaikh ,  Bok Hoen Kim ,  Sergey Starik ,  Ganesh Balasubramanian

IPC: G01B11/06 ,  C23C16/52 ,  H01L21/687 ,  C23C16/509 ,  H01L21/67 ,  G01N21/55 ,  G01N21/65 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/455 ,  H01L21/00

CPC classification number: C23C16/52 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509 ,  C23C16/5096 ,  G01B11/0625 ,  G01B11/0683 ,  G01N21/55 ,  G01N21/658 ,  G01N2201/1222 ,  H01L21/00 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/687

Abstract: A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.

公开(公告)号：US20170355140A1

公开(公告)日：2017-12-14

申请号：US15688408

申请日：2017-08-28

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C64/209 ,  B24D18/00 ,  B33Y10/00 ,  B29C64/20 ,  B29C64/112 ,  B24B37/26 ,  B33Y80/00 ,  B29C35/08 ,  B29L31/00 ,  B29K509/02 ,  B29K105/16 ,  B29K75/00 ,  B29K105/00

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US20170297163A1

公开(公告)日：2017-10-19

申请号：US15635770

申请日：2017-06-28

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Thomas H. Osterheld ,  Hung Chen ,  Terrance Y. Lee

IPC: B24B37/04 ,  H01L21/321 ,  B24B57/02

CPC classification number: B24B37/044 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

Abstract: A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

公开(公告)号：US20160347002A1

公开(公告)日：2016-12-01

申请号：US15237140

申请日：2016-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C67/00 ,  B33Y30/00 ,  B24D18/00 ,  B33Y50/02 ,  B33Y80/00 ,  B24B37/26 ,  B33Y10/00 ,  B29C35/08

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US20150226540A1

公开(公告)日：2015-08-13

申请号：US14422148

申请日：2013-10-23

Applicant: Applied Materials, Inc.

Inventor： Nagarajan Rajagopalan ,  Xinhai Han ,  Michael Tsiang ,  Masaki Ogata ,  Zhijun Jiang ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Jianhua Zhou ,  Ramprakash Sankarakrishnan ,  Ganesh Balasubramanian ,  Amit Kumar Bansal ,  Jeongmin Lee ,  Todd Egan ,  Edward Budiarto ,  Dmitriy Panasyuk ,  Terrance Y. Lee ,  Jian J. Chen ,  Mohamad A. Ayoub ,  Heung Lak Park ,  Patrick Reilly ,  Shahid Shaikh ,  Bok Hoen Kim ,  Sergey Starik

IPC: G01B11/06 ,  C23C16/46 ,  C23C16/505 ,  C23C16/50 ,  C23C16/458

CPC classification number: C23C16/52 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509 ,  C23C16/5096 ,  G01B11/0625 ,  G01B11/0683 ,  G01N21/55 ,  G01N21/658 ,  G01N2201/1222 ,  H01L21/00 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/687

Abstract: Apparatus and method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.

Abstract translation: 描述了根据PECVD工艺处理衬底的设备和方法。 调整衬底的温度分布以改变衬底上的沉积速率分布。 调整等离子体密度分布以改变跨衬底的沉积速率分布。 暴露于等离子体的室表面被加热以改善等离子体密度均匀性并减少在室表面上形成低质量的沉积物。 原位计量可用于监测沉积过程的进展并触发涉及衬底温度曲线，等离子体密度分布，压力，温度和反应物流动的控制动作。