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    PACKAGING PHOTON BUILDING BLOCKS WITH TOP SIDE CONNECTIONS AND INTERCONNECT STRUCTURE
    22.
    发明申请
    PACKAGING PHOTON BUILDING BLOCKS WITH TOP SIDE CONNECTIONS AND INTERCONNECT STRUCTURE 有权

    公开(公告)号：US20210126175A1

    公开(公告)日：2021-04-29

    申请号：US17092500

    申请日：2020-11-09

    申请人： BRIDGELUX, INC.

    发明人： R. Scott West

    IPC分类号： H01L33/62 ,  H01L33/64 ,  H05K1/02

    摘要： Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

    Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array
    28.
    发明申请
    Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array 审中-公开
    使用LED芯片测量封装LED阵列的硅胶内部的温度

    公开(公告)号：US20150355032A1

    公开(公告)日：2015-12-10

    申请号：US14829639

    申请日：2015-08-19

    申请人： Bridgelux, Inc.

    发明人： Babak Imangholi ,  Michael Neal Gershowitz ,  R. Scott West

    IPC分类号： G01K7/00 ,  H01L33/50 ,  H01L27/15 ,  H01L33/32

    CPC分类号： G01K7/00 ,  G01K7/01 ,  H01L27/156 ,  H01L33/32 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05B33/0851 ,  H05B37/02 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A light-emitting diode (LED) device includes first and second LED dies with the same structure and that are both encapsulated by the same silicone layer. The first LED is supplied with sufficient drive current to illuminate the LED. Control circuitry supplies the second LED with a constant current, determines the voltage across the second LED, and calculates the temperature of the second LED based on the voltage across the second LED. The constant current has a maximum magnitude that never exceeds the maximum magnitude of the drive current. The LED device is able to calculate the temperature of a diode with a gallium-nitride layer (GaN or GaInN) that is receiving a large drive current and emitting blue light by determining the voltage across an adjacent similar diode with a gallium-nitride layer through which a small constant current is flowing. Preferably, the band gap of the LEDs exceeds two electron volts.

    摘要翻译： 发光二极管（LED）装置包括具有相同结构的第一和第二LED管芯，并且都被相同的硅氧烷层封装。 第一个LED提供足够的驱动电流来照亮LED。 控制电路为第二个LED提供恒定电流，确定第二个LED两端的电压，并根据第二个LED两端的电压计算第二个LED的温度。 恒定电流具有不超过驱动电流的最大幅度的最大幅度。 LED器件能够通过用氮化镓层（GaN或GaInN）来测量具有氮化镓层（GaN或GaInN）的温度，该氮化镓层接收大的驱动电流并通过确定具有氮化镓层的相邻类似二极管的电压来发射蓝色光 其流过小的恒定电流。 优选地，LED的带隙超过两个电子伏特。

    Low-Profile Outdoor Lighting Module With Light Emitting Diodes
    29.
    发明申请
    Low-Profile Outdoor Lighting Module With Light Emitting Diodes 有权
    带发光二极管的小型户外照明模块

    公开(公告)号：US20150276144A1

    公开(公告)日：2015-10-01

    申请号：US14229903

    申请日：2014-03-29

    申请人： Bridgelux, Inc.

    发明人： Robert Tudhope ,  R. Scott West

    IPC分类号： F21K99/00 ,  H05K3/32 ,  F21V23/00 ,  F21V31/00 ,  F21V13/04 ,  F21V29/70

    CPC分类号： H05K3/32 ,  F21K9/00 ,  F21K9/90 ,  F21V5/08 ,  F21V7/05 ,  F21V13/04 ,  F21V23/005 ,  F21V29/70 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/10106 ,  Y02B20/72 ,  Y10T29/4913

    摘要： A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens.

    摘要翻译： 具有发光二极管（LED）的低调照明模块在模制塑料盖和印刷电路板（PCB）之间具有防水密封。 具有LED的衬底在PCB的下表面中嵌合成凹陷。 衬底顶部的着陆垫附着在凹槽中的接触垫上，PCB中的导体的延伸部分通过着陆焊盘电耦合到LED。 具有由平坦唇部包围的弯曲光学部分的透镜装配到PCB的上表面上的另一个凹陷中。 高反射性片材设置在透镜的平面下表面和上表面的凹陷的底部之间。 双面粘合片设置在模制塑料盖的内表面下方，并且在PCB的上表面和透镜的平唇之间。