公开(公告)号：US20100244195A1

公开(公告)日：2010-09-30

申请号：US12412702

申请日：2009-03-27

Applicant: Limin Lin ,  Bin Xie ,  Shu Yuan

Inventor： Limin Lin ,  Bin Xie ,  Shu Yuan

IPC: H01L29/20 ,  H01L21/302

CPC classification number: H01L33/0079

Abstract: A host substrate and method of making a host substrate for nitride based thin-film semiconductor devices are provided. According to one embodiment, the method includes the steps of providing a silicon layer; etching a pattern of holes in the silicon layer; plating the silicon layer with copper to fill the holes etched in the silicon layer; bonding the silicon layer to a gallium nitride (GaN) layer, the GaN layer attached to a sapphire substrate; and removing the sapphire substrate. The host substrate is configured to address the coefficient of thermal expansion (CTE) mismatch problem and reduce the amount of stress resulting from such CTE mismatch. A combination of metal and semiconductor materials provide for the desired thermal and electrical conductivity while providing for subsequent dicing and incorporation of the finished semiconductor devices into other circuits.

Abstract translation: 提供了一种主衬底和制造用于氮化物基薄膜半导体器件的主衬底的方法。 根据一个实施例，该方法包括提供硅层的步骤; 蚀刻硅层中的孔的图案; 用铜电镀硅层以填充蚀刻在硅层中的孔; 将所述硅层与氮化镓（GaN）层接合，所述GaN层附着在蓝宝石衬底上; 并去除蓝宝石衬底。 主机基板被配置为解决热膨胀系数（CTE）失配问题，并减少由这种CTE失配引起的应力的量。 金属和半导体材料的组合提供期望的热导电性和导电性，同时提供随后的切割和将成品半导体器件并入其它电路中。

公开(公告)号：US20100123241A1

公开(公告)日：2010-05-20

申请号：US12273434

申请日：2008-11-18

Applicant: Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

Inventor： Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

IPC: H01L23/04 ,  H01L21/00

CPC classification number: H01L23/16 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad.

Abstract translation: 本文公开的主题可涉及可用于例如闪存设备中的多芯片半导体器件的封装。 在示例性实施例中，半导体芯片可以包括穿硅通孔和侧壁衬垫。

公开(公告)号：US09334171B2

公开(公告)日：2016-05-10

申请号：US13163377

申请日：2011-06-17

Applicant: Bilge Yilmaz ,  Ulrich Müller ,  Meike Pfaff ,  Hermann Gies ,  Feng-Shou Xiao ,  Takashi Tatsumi ,  Xinhe Bao ,  Weiping Zhang ,  Dirk de Vos ,  Hiroyuki Imai ,  Bin Xie ,  Haiyan Zhang

Inventor： Bilge Yilmaz ,  Ulrich Müller ,  Meike Pfaff ,  Hermann Gies ,  Feng-Shou Xiao ,  Takashi Tatsumi ,  Xinhe Bao ,  Weiping Zhang ,  Dirk de Vos ,  Hiroyuki Imai ,  Bin Xie ,  Haiyan Zhang

IPC: C01B39/48 ,  B01J29/70 ,  C01B39/46 ,  B01J20/18 ,  B01J20/28 ,  C07C1/20 ,  C10G3/00 ,  C10G11/18 ,  C10G25/03 ,  C01B37/02 ,  B01D53/94

CPC classification number: C01B39/46 ,  B01D53/9418 ,  B01D2251/2067 ,  B01D2253/108 ,  B01D2253/3425 ,  B01D2255/20738 ,  B01D2255/20761 ,  B01D2255/50 ,  B01D2255/9207 ,  B01D2257/402 ,  B01D2257/404 ,  B01D2257/406 ,  B01D2258/012 ,  B01J20/186 ,  B01J20/28011 ,  B01J20/2803 ,  B01J20/28042 ,  B01J20/28057 ,  B01J29/70 ,  B01J2229/186 ,  C01B37/02 ,  C01B39/48 ,  C01P2006/12 ,  C07C1/20 ,  C07C2529/70 ,  C07C2529/80 ,  C10G3/49 ,  C10G11/18 ,  C10G25/03 ,  C10G2300/405 ,  C10G2300/70 ,  Y02C20/10 ,  Y02P20/153 ,  Y02P20/52 ,  Y02P30/20

Abstract: A process for the production of a zeolitic material having an LEV-type framework structure comprising YO2 and optionally comprising X203, wherein said process comprises preparing a mixture comprising one or more sources for YO2, one or more solvents, and optionally comprising seed crystals; and crystallizing the mixture; wherein Y is a tetravalent element, and X is a trivalent element, and wherein the crystallized mixture contains 0.1 wt.-% or less, more preferably 0.01 wt.-% or less of one or more metals M based on 100 wt.-% of YO2, wherein even more preferably the crystallized mixture contains no metal M, wherein M stands for sodium and/or potassium, wherein preferably M stands for the group of alkali and alkaline earth metals.

Abstract translation: 一种制备具有包含YO 2和任选地包含X 2 O 3的LEV型骨架结构的沸石材料的方法，其中所述方法包括制备包含一种或多种YO 2，一种或多种溶剂和任选地包含晶种的源的混合物; 并使混合物结晶; 其中Y是四价元素，X是三价元素，并且其中所述结晶混合物含有基于100重量％的0.1重量％或更少，更优选0.01重量％或更少的一种或多种金属M， 的YO 2，其中甚至更优选结晶的混合物不含金属M，其中M代表钠和/或钾，其中优选M代表碱金属和碱土金属。

公开(公告)号：US08430695B2

公开(公告)日：2013-04-30

申请号：US13108012

申请日：2011-05-16

Applicant: Chien-Jen Ting ,  Bin Xie

Inventor： Chien-Jen Ting ,  Bin Xie

IPC: H01R24/00

CPC classification number: H01R13/521 ,  H01R2107/00

Abstract: An electrical connector includes an insulative housing (1) defining a base portion and a tongue portion extending forwardly from the base portion; a plurality of terminals (2) each having a retention portion, a contacting portion extending forwardly from the retention portion and a tail portion; an insulative spacer disposed behind the base portion, and the insulative spacer (3) defining a plurality of positioning holes for the tail portions passing therethrough, respectively; and waterproof material (5) stuffing corresponding seam between the insulative spacer and the base portion.

Abstract translation: 电连接器包括限定基部的绝缘壳体（1）和从基部向前延伸的舌部; 多个端子（2），每个端子具有保持部分，从保持部分向前延伸的接触部分和尾部; 绝缘间隔件，分别设置在所述基部的后方，所述绝缘间隔件分别限定用于所述尾部穿过的多个定位孔; 和防水材料（5）在绝缘间隔件和基部之间填充相应的接缝。

公开(公告)号：US08033870B2

公开(公告)日：2011-10-11

申请号：US12978361

申请日：2010-12-23

Applicant: Bin Xie

Inventor： Bin Xie

IPC: H01R24/00

CPC classification number: H01R12/57 ,  H01R12/714 ,  H01R13/2428

Abstract: An electrical connector (100) includes an insulative housing (1) defining at least a passageway (11) and a mating face (101), at least a contact terminal (2) received in the passageway (11) and having a contact arm (24) extending beyond the mating face (101). The contact terminal (2) includes a base portion (23) with a cutout (233) providing a yielding space to receive a portion (241) of the contact arm (24) when it is depressed.

Abstract translation: 电连接器（100）包括至少限定通道（11）和配合面（101）的绝缘壳体（1），至少接收在通道（11）中的接触端子（2）并具有接触臂 24）延伸超过配合面（101）。 接触端子（2）包括具有切口（233）的基部（23），该凹部提供收容空间以在接触臂（24）被按压时接纳该接触臂（24）的一部分（241）。

公开(公告)号：US20110235299A1

公开(公告)日：2011-09-29

申请号：US12748997

申请日：2010-03-29

Applicant: Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

Inventor： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

IPC: H05K1/14 ,  H05K3/30 ,  B23P19/00

CPC classification number: H01L21/67333 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/1058 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract translation: 一种对准电子部件的方法，包括提供具有至少一个结构120的定位部件110，用于接收电子部件; 所述至少一个结构具有用于限制电子部件的运动的横向边界35,36; 将第一电子部件10a放置在所述至少一个结构中; 并且提供用于使所述第一电子部件与所述至少一个结构的横向边界主动对准的力。 例如，可以通过倾斜定位构件，通过提供抽吸或通过使用致动器来提供力。 还公开了一种用于对准电子部件的装置和堆叠的电子部件的3D系统。

公开(公告)号：US20090243046A1

公开(公告)日：2009-10-01

申请号：US12057241

申请日：2008-03-27

Applicant: Xunqing Shi ,  Wei Ma ,  Bin Xie ,  Chang Hwa Chung

Inventor： Xunqing Shi ,  Wei Ma ,  Bin Xie ,  Chang Hwa Chung

IPC: H01L23/538 ,  B23K26/22 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/8182 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

Abstract: There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.

Abstract translation: 描述了形成穿硅通孔以形成使用脉冲激光能量的两个堆叠的半导体部件之间的互连的方法。 在每个部件中形成孔，并且每个孔填充有由第一金属形成的塞子。 然后将一个部件堆叠在另一部件上，使得孔对准，并且施加激光能量的脉冲以在金属插塞之间形成结合。

公开(公告)号：US20070244758A1

公开(公告)日：2007-10-18

申请号：US11735828

申请日：2007-04-16

Applicant: Bin Xie

Inventor： Bin Xie

IPC: G06Q30/00

CPC classification number: G06Q30/02 ,  G06Q30/0239 ,  G06Q30/0253 ,  G06Q30/0601

Abstract: This invention relates to methods and systems of helping consumers to manage their shopping tasks with an internet based shopping task management service. Shopping related information along with other information collected by said service is taken into consideration in the process of selecting relevant advertising information. Selected advertising information is then presented to consumers through said service. Consumer reactions to presented advertising information as well as other information obtained by consumers are collected, stored and made available for consumers to process.

Abstract translation: 本发明涉及通过基于因特网的购物任务管理服务帮助消费者管理他们的购物任务的方法和系统。 在选择相关广告信息的过程中，考虑购物相关信息以及所述服务收集的其他信息。 所选择的广告信息然后通过所述服务呈现给消费者。 消费者对广告信息的消费者反应以及消费者获取的其他信息被收集，存储并提供给消费者进行处理。