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    LAMINATING APPARATUS
    21.
    发明申请
    LAMINATING APPARATUS 有权
    层压装置

    公开(公告)号：US20130133836A1

    公开(公告)日：2013-05-30

    申请号：US13816540

    申请日：2011-07-19

    Applicant: Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

    Inventor： Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

    IPC: B32B37/10

    CPC classification number: B32B37/10 ,  B29C43/18 ,  B32B37/003 ,  B32B37/1009 ,  B32B39/00 ,  B32B2309/12 ,  B32B2309/65 ,  B32B2309/68 ,  B32B2457/08 ,  H01L33/52 ,  H05K3/284 ,  H05K2203/1311 ,  Y10T156/1744

    Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

    Abstract translation: 提供了一种层叠装置，其使树脂膜完全符合基板的突出和凹陷部分，并且使得适形树脂膜的膜厚度在更严格的水平上均匀。 为此，层压装置包括层压机构，其包括：封闭空间形成接收器，其能够在其中接收临时层压体; 以及用于在由封闭空间形成接收器形成的封闭空间中以非接触关系向临时层叠体施加压力的压力层压机，以从临时层压体形成端部层叠体。

    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER
    22.
    发明申请
    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER 审中-公开
    LED与硅胶层和层压式远距离磷酸盐层

    公开(公告)号：US20110031516A1

    公开(公告)日：2011-02-10

    申请号：US12537909

    申请日：2009-08-07

    Applicant: Grigoriy Basin ,  Paul S. Martin

    Inventor： Grigoriy Basin ,  Paul S. Martin

    IPC: H01L33/00 ,  H01L21/56

    CPC classification number: H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16 ,  H01L2933/0041

    Abstract: A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.

    Abstract translation: 描述了一种用于制造发光器件的方法，其中倒装芯片发光二极管（LED）管芯的阵列安装在基座晶片上。 在每个LED管芯上同时模制半球形的第一硅氧烷层。 将预先形成的柔性荧光体层，包括注入硅氧烷的荧光体粉末层压在第一硅氧烷层上，以符合半球形第一硅氧烷层的外表面。 然后在荧光体层上模制硅树脂透镜。 通过预处理荧光体层，可以使荧光体层具有非常严格的公差并进行测试。 通过模制的半球状硅氧烷层将荧光体层与LED芯片分开，颜色与视角是恒定的，并且荧光体不会被热降解。 柔性荧光体层可以包括多个不同的荧光体层，并且可以包括反射器或其它层。

    Silicone based reflective underfill and thermal coupler
    25.
    发明授权
    Silicone based reflective underfill and thermal coupler 有权
    硅基反射底部填充和热耦合器

    公开(公告)号：US08471280B2

    公开(公告)日：2013-06-25

    申请号：US12613924

    申请日：2009-11-06

    Applicant: Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    Inventor： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    IPC: H01L23/29

    CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.

    Abstract translation: 在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度的金柱。 金柱结合到底座电极。 然后将底部填充材料模制以填充LED底部和底座之间的空隙。 底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。 氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。 氧化铝是白色粉末。 底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。 底部填充物也随机化光散射，改善光提取。 分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

    LED wafer with laminated phosphor layer
    26.
    发明授权
    LED wafer with laminated phosphor layer 有权
    LED晶圆与叠层荧光粉层

    公开(公告)号：US08232117B2

    公开(公告)日：2012-07-31

    申请号：US12771809

    申请日：2010-04-30

    Applicant: Grigoriy Basin ,  Paul S. Martin

    Inventor： Grigoriy Basin ,  Paul S. Martin

    IPC: H01L21/00

    CPC classification number: H01L33/0079 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/14 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    Abstract: An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

    Abstract translation: 具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。 然后去除生长衬底，例如通过激光剥离。 然后蚀刻LED层的暴露表面以改善光提取。 然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。 然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。 然后将底座晶片切割以产生单独的LED。 有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。

    LED WAFER WITH LAMINATED PHOSPHOR LAYER
    27.
    发明申请
    LED WAFER WITH LAMINATED PHOSPHOR LAYER 有权
    带有层压磷光体层的LED波片

    公开(公告)号：US20110266569A1

    公开(公告)日：2011-11-03

    申请号：US12771809

    申请日：2010-04-30

    Applicant: Grigoriy Basin ,  Paul S. Martin

    Inventor： Grigoriy Basin ,  Paul S. Martin

    IPC: H01L33/44 ,  H01L33/00 ,  H01L21/78 ,  H01L33/48

    CPC classification number: H01L33/0079 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/14 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    Abstract: An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

    Abstract translation: 具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。 然后去除生长衬底，例如通过激光剥离。 然后蚀刻LED层的暴露表面以改善光提取。 然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。 然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。 然后将底座晶片切割以产生单独的LED。 有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。

    Substrate removal during LED formation
    29.
    发明授权
    Substrate removal during LED formation 有权
    LED形成过程中的基板去除

    公开(公告)号：US07867793B2

    公开(公告)日：2011-01-11

    申请号：US11775059

    申请日：2007-07-09

    Applicant: Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    Inventor： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

    IPC: H01L21/00

    CPC classification number: H01L33/0079 ,  H01L24/97 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.

    Abstract translation: 在将LED安装到底座之前，使用底层填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底层填充层可以用作移除生长衬底期间的薄且脆性LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或副安装座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。

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