公开(公告)号：US20150271948A1

公开(公告)日：2015-09-24

申请号：US14646444

申请日：2013-10-29

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L33/64 ,  H01L23/34 ,  H01L23/373

CPC classification number: H05K7/205 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/32 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/023 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

Abstract translation: 半导体器件包括载体主体上的半导体元件，其包括陶瓷体和直接连接到陶瓷体的热敏电阻传感器结构。 热敏电阻传感器结构被集成到载体主体中并且包括散热器，载体主体安装在散热器上。

公开(公告)号：US20150144983A1

公开(公告)日：2015-05-28

申请号：US14403143

申请日：2013-04-17

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Sebastian Brunner

IPC: H01L27/02 ,  H01L33/48

CPC classification number: H01L27/0248 ,  H01L25/167 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip, arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.

Abstract translation: 一种发光二极管器件包括具有至少一个空腔的载体，发光二极管芯片以至少部分地凹入至少一个空腔中的方式布置，并且ESD保护元件由部分区域 的承运人。 此外，发光二极管器件包括具有至少一个空腔的载体，布置在载体上的发光二极管芯片，以及至少部分地凹入至少一个空腔中的电气部件。 此外，发光二极管装置包括由载体的部分区域形成的ESD保护元件。

公开(公告)号：US20140319974A1

公开(公告)日：2014-10-30

申请号：US14365968

申请日：2012-10-02

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Jörg Lauenstein

IPC: H01C7/00 ,  H01L29/861 ,  H01L41/047 ,  H01G4/012 ,  H01F27/06

CPC classification number: H01C7/008 ,  H01C1/142 ,  H01C7/18 ,  H01F27/06 ,  H01F2027/065 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01L29/861 ,  H01L41/0472

Abstract: An electrical component includes a main body, a metallic contact structure, which is in direct contact with the main body, and an electrically insulating passivation layer provided with an opening. The metallic contact structure is connected to an external contact-making element through the opening. Furthermore, the external contact-making element is covered and enclosed by a flexible metal composite layer. A method for producing an electrical component is also specified.

Abstract translation: 电气部件包括与主体直接接触的主体，金属接触结构以及设置有开口的电绝缘钝化层。 金属接触结构通过开口连接到外部接触元件。 此外，外部接触元件被柔性金属复合层覆盖并包围。 还规定了用于制造电气部件的方法。

公开(公告)号：US20140252403A1

公开(公告)日：2014-09-11

申请号：US14351051

申请日：2012-10-26

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H02H9/04 ,  H01L33/64 ,  H01L33/62

CPC classification number: H02H9/04 ,  H01C7/12 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16

Abstract: An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged.

Abstract translation: ESD保护组件包括陶瓷材料和BGA或LGA终端。 此外，ESD保护部件包括具有下侧的基体。 基体包括陶瓷材料。 至少一个浮动内部电极位于距离两个至100个陶瓷颗粒的下侧一定距离处。 而且，组件还包括载体，LED和ESD保护组件布置在该载体上。

公开(公告)号：US10818641B2

公开(公告)日：2020-10-27

申请号：US16086567

申请日：2017-03-21

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Stephan Steinhauser ,  Günter Pudmich ,  Edmund Payr ,  Sebastian Brunner

IPC: H01L23/48 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L33/50 ,  H01L27/02 ,  H01L33/64 ,  H01L33/00

Abstract: A multi-LED system is disclosed. In an embodiment a multi-LED system includes a ceramic multilayer substrate in which at least two ESD protection structures are integrated, at least two light-emitting diodes arranged on the substrate and at least two capping layers covering one of the light-emitting diodes.

公开(公告)号：US20190148346A1

公开(公告)日：2019-05-16

申请号：US16099126

申请日：2017-03-30

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner

IPC: H01L25/075 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H05K1/0206 ,  H05K1/0259 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174

Abstract: A multi-LED system includes a carrier; and a plurality of light-emitting diodes arranged on the carrier, wherein the carrier has a main body, and a plurality of electrical components are embedded in the main body.

公开(公告)号：US20190103384A1

公开(公告)日：2019-04-04

申请号：US16086567

申请日：2017-03-21

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Stephan Steinhauser ,  Günter Pudmich ,  Edmund Payr ,  Sebastian Brunner

IPC: H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/50 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/504 ,  H01L33/641

Abstract: A multi-LED system is disclosed. In an embodiment a multi-LED system includes a ceramic multilayer substrate in which at least two ESD protection structures are integrated, at least two light-emitting diodes arranged on the substrate and at least two capping layers covering one of the light-emitting diodes.

公开(公告)号：US10225965B2

公开(公告)日：2019-03-05

申请号：US15100283

申请日：2014-11-25

Applicant: EPCOS AG

Inventor： Oliver Dernovsek ,  Thomas Feichtinger

IPC: H01L33/60 ,  H01L23/552 ,  H01L25/16 ,  H01L41/053 ,  H05K9/00 ,  H01C1/06 ,  H01G2/22 ,  H01G4/224 ,  H01G4/30 ,  H01C7/18 ,  H01C7/02 ,  H01C7/04 ,  H01C7/10

Abstract: What is specified is an electronic component (100) comprising a functional body (1) provided with a reflection structure (2) wherein the reflection structure (2) is arranged and designed to reflect radiation that impinges on the electronic component (100) from outside away from the functional body (1) and wherein the electronic component (100) is radiation-passive.

公开(公告)号：US10021776B2

公开(公告)日：2018-07-10

申请号：US14654369

申请日：2013-12-12

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Axel Pecina

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H01L33/64

CPC classification number: H05K1/0204 ,  H01L33/642 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T156/10 ,  H01L2924/00

Abstract: A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.

公开(公告)号：US10014459B2

公开(公告)日：2018-07-03

申请号：US15508361

申请日：2015-08-05

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L23/34 ,  H01L23/60 ,  H01L33/48 ,  H01L21/02

CPC classification number: H01L33/62 ,  H01L21/0254 ,  H01L23/34 ,  H01L23/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/48 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode device is specified, comprising at least one carrier and a light-emitting diode arranged thereon. The carrier comprises a plurality of polymer layers arranged one above another. At least one polymer layer has a cutout, in which an electrical component is embedded.