公开(公告)号：US20090250259A1

公开(公告)日：2009-10-08

申请号：US12216435

申请日：2008-07-03

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H01R12/02 ,  B05D5/12 ,  B32B38/10

CPC分类号： H05K3/4007 ,  H01R12/523 ,  H05K3/0017 ,  H05K3/207 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/016 ,  H05K2203/1536

摘要： Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased.

摘要翻译： 本文公开了一种多层印刷电路板，包括：包括多个绝缘层和多个电路层的堆积层; 包含凸起的绝缘树脂层，形成在构成层一侧的最外层电路层上; 以及形成在积层的另一侧的最外层上的阻焊层。 多层印刷电路板通过在绝缘树脂层的一侧依次放置积层和阻焊层，另一侧设置有凸块来制造。 本发明的优点在于，多层印刷电路板的厚度减小，其制造工艺简化，生产效率提高。

公开(公告)号：US08022311B2

公开(公告)日：2011-09-20

申请号：US11797084

申请日：2007-04-30

申请人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

发明人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/205 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169

摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路容差中被最小化，从而被应用于 电容器用于RF匹配。

公开(公告)号：US20090223044A1

公开(公告)日：2009-09-10

申请号：US12453616

申请日：2009-05-15

申请人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H05K3/10

CPC分类号： G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

摘要翻译： 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

公开(公告)号：US08942004B2

公开(公告)日：2015-01-27

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

发明人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

IPC分类号： H05K1/18 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US06525463B1

公开(公告)日：2003-02-25

申请号：US09323520

申请日：1999-06-01

申请人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

发明人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

IPC分类号： H01J150

CPC分类号： H01J29/68 ,  H01J31/127

摘要： A flat panel display device comprises a cathode on a first substrate for emitting electrons, a magnetic plate including first region focusing electrons emitted from the cathode to display an image and second region for applying the uniform magnetic field into the holes in the first region, and a fluorescent layer on the second substrate, on which the electrons outputted from the holes are impacted. In the second region, there are holes having the same shape and pitch as the first region.

摘要翻译： 平板显示装置包括用于发射电子的第一基板上的阴极，包括聚焦从阴极发射的电子以显示图像的第一区域的磁性板和用于将均匀磁场施加到第一区域中的孔的第二区域，以及 在第二基板上的从孔中输出的电子受到冲击的荧光层。 在第二区域中，具有与第一区域相同的形状和间距的孔。

公开(公告)号：US20120087097A1

公开(公告)日：2012-04-12

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

发明人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US20090290832A1

公开(公告)日：2009-11-26

申请号：US12216995

申请日：2008-07-14

申请人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/132 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602

摘要： Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

摘要翻译： 这里公开了包括光波导的印刷电路板和制造该板的方法。 在该板中，光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于本发明的方法使用通常用于制造一般印刷电路板的工艺中的化学镀的镜子，所以适用于制造面积大的印刷电路板，并且镜具有高反射率和 在材料消耗方面效率高。

公开(公告)号：US20080212299A1

公开(公告)日：2008-09-04

申请号：US11797084

申请日：2007-04-30

申请人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

发明人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

IPC分类号： H05K1/18 ,  H01R43/00

CPC分类号： H05K1/162 ,  H05K3/205 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169

摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路公差中被最小化，从而被应用于 电容器用于RF匹配。

公开(公告)号：US20080000680A1

公开(公告)日：2008-01-03

申请号：US11819925

申请日：2007-06-29

申请人： Suk Hyeon Cho ,  Byoung Youl Min ,  Je Gwang Yoo ,  Hae Nam Seo ,  Byung Moon Kim ,  Ji Hong Jo ,  Han Seo Cho

发明人： Suk Hyeon Cho ,  Byoung Youl Min ,  Je Gwang Yoo ,  Hae Nam Seo ,  Byung Moon Kim ,  Ji Hong Jo ,  Han Seo Cho

IPC分类号： H05K1/03

CPC分类号： H05K1/0206 ,  H01L23/3735 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, which can achieve reliable heat resistance because heat radiation characteristics are improved, and processing costs of which are reduced because processing times are shortened.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，其可以提高热辐射特性，从而可以实现可靠的耐热性，并且由于加工时间缩短，其加工成本降低。

公开(公告)号：US20120080224A1

公开(公告)日：2012-04-05

申请号：US13137871

申请日：2011-09-20

申请人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

发明人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

IPC分类号： H05K9/00 ,  H05K3/02 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K3/28 ,  H05K2201/0195 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

摘要翻译： 提供了一种用于信号传输的电路板及其制造方法。 用于信号传输的电路板包括第一绝缘层，布置在第一绝缘层上的多个信号互连，布置在多个信号互连两侧的第一绝缘层上的接地互连，设置在第一绝缘层上的第一绝缘层 包括多个信号互连和接地互连的绝缘层，设置在第二绝缘层上的第一屏蔽层，用于电连接接地互连和第一屏蔽层并穿过第二绝缘层的第一屏蔽层，第二屏蔽层 设置在第一绝缘层下面的第二屏蔽壁和用于电连接接地互连和第二屏蔽层并穿过第一绝缘层的第二屏蔽壁。