公开(公告)号：US08728950B2

公开(公告)日：2014-05-20

申请号：US13260068

申请日：2010-06-15

申请人： Shigetoshi Kawabe ,  Nobuaki Takahashi

发明人： Shigetoshi Kawabe ,  Nobuaki Takahashi

IPC分类号： H01L21/31

CPC分类号： H01L51/0004 ,  B05C5/025 ,  B05C5/0254 ,  B05D1/265 ,  B05D5/06 ,  H01L51/56

摘要： Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.

摘要翻译： 公开了使用狭缝型模涂机和使用涂布法制备的有机电致发光元件，从具有低粘度的涂布溶液形成具有稳定厚度的涂层的涂布方法。 使用狭缝型模涂机的涂布方法包括以下步骤：使狭缝型模涂机的唇尖靠近基板，以在唇尖和基板之间形成涂布溶液珠，并在基板上涂布 在狭缝型模具涂布机和基板相对移动的同时从唇尖处的狭缝出口喷射的涂布溶液，从而形成至少两条条状涂层，其特征在于，唇尖在其中具有至少一个凹槽 在涂布宽度方向上的涂布区域，珠的涂布溶液的狭缝出口处的压力为负或为零。

公开(公告)号：US20130315435A1

公开(公告)日：2013-11-28

申请号：US13990721

申请日：2010-11-30

申请人： Masatoshi Sato ,  Nobuaki Takahashi ,  Masaru Nakagawa ,  Teruaki Kaiya ,  Junichi Sato

发明人： Masatoshi Sato ,  Nobuaki Takahashi ,  Masaru Nakagawa ,  Teruaki Kaiya ,  Junichi Sato

IPC分类号： H04R7/16 ,  H04R7/02

CPC分类号： H04R7/20 ,  B32B5/22 ,  B32B7/02 ,  B32B27/12 ,  H04R7/02 ,  H04R7/16 ,  H04R31/003 ,  H04R2231/001 ,  H04R2231/003 ,  H04R2307/204 ,  H04R2307/207 ,  H04R2499/11 ,  H04R2499/13 ,  H04R2499/15

摘要： A speaker edge includes a resin layer including a resin member and a fiber layer including a tangled fiber body. A melting temperature of the tangled fiber body is higher than a melting temperature of the resin member. The hardness of the tangled fiber body is lower than the hardness of the resin member.

摘要翻译： 扬声器边缘包括包括树脂构件的树脂层和包括缠结纤维体的纤维层。 缠结纤维体的熔融温度高于树脂部件的熔融温度。 缠结纤维体的硬度低于树脂部件的硬度。

公开(公告)号：US08426311B2

公开(公告)日：2013-04-23

申请号：US12801458

申请日：2010-06-09

申请人： Nobuaki Takahashi ,  Masahiro Komuro

发明人： Nobuaki Takahashi ,  Masahiro Komuro

IPC分类号： H01L21/445

CPC分类号： C23C18/1651 ,  C23C18/1632 ,  C23C18/32 ,  C23C18/54 ,  H01L21/288 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment.

摘要翻译： 一种半导体器件的制造方法包括使用无电镀法在半导体衬底上形成多个金属膜的叠层结构。 金属膜的形成包括：使用第一镀槽进行包括还原反应的无电镀处理; 并且仅使用第二镀槽进行取代反应进行化学镀处理。 包括使用第一镀槽进行的还原反应的化学镀处理在遮蔽环境中进行，并且在非遮蔽环境中进行仅使用第二镀槽的取代反应进行的化学镀处理。

公开(公告)号：US08177925B2

公开(公告)日：2012-05-15

申请号：US11886423

申请日：2006-03-08

申请人： Nobuaki Takahashi ,  Masahiko Hamada ,  Shuji Okaguchi ,  Akihiro Yamanaka ,  Ichirou Seta

发明人： Nobuaki Takahashi ,  Masahiko Hamada ,  Shuji Okaguchi ,  Akihiro Yamanaka ,  Ichirou Seta

IPC分类号： C22C38/14 ,  C22C38/12 ,  C22C38/04 ,  C22C38/48 ,  C22C38/50 ,  C21D8/00 ,  C21D8/10 ,  C21D9/08

CPC分类号： C21D8/0226 ,  B21B3/02 ,  B21C37/08 ,  C21D8/10 ,  C21D9/08 ,  C21D9/50 ,  C21D2211/002 ,  C21D2211/005 ,  C22C38/002 ,  C22C38/005 ,  C22C38/02 ,  C22C38/04 ,  C22C38/08 ,  C22C38/12 ,  C22C38/14 ,  C22C38/40 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/50 ,  C22C38/58 ,  Y10S148/908 ,  Y10T428/12292

摘要： In a high-tensile steel plate according to the invention, the carbon equivalent Pcm represented in Expression (1) is from 0.180% to 0.220%, the surface hardness is a Vicker's hardness of 285 or less, the ratio of a Martensite Austenite constituent in the surface layer is not more than 10%, the ratio of a mixed structure of ferrite and bainite inside beyond the surface layer is not less than 90%, the ratio of the bainite in the mixed structure is not less than 10%, the thickness of the lath of bainite is not more than 1 μm, the length of the lath is not more than 20 μm, and the segregation ratio as the ratio of the Mn concentration in the center segregation part relative to the Mn concentration at a part in a depth equal to ¼ of the thickness of the plate from the surface is not more than 1.3. Pcm=C+Si/30+(Mn+Cu+Cr)/20+Ni/60+Mo/15+V/10+5B . . . (1) where the element symbols in Expression (1) represent the % by mass of the respective elements. In this way, the high-tensile steel plate according to the invention has a yield strength of at least 551 MPa and a tensile strength of at least 620 MPa as well as high toughness, high propagating shear fracture and high weldability.

摘要翻译： 在本发明的高强度钢板中，式（1）所示的碳当量Pcm为0.180〜0.220％，表面硬度为维氏硬度为285以下，马氏体奥氏体成分 表面层不超过10％，铁素体和贝氏体在表面层之外的混合结构的比例不小于90％，混合结构中的贝氏体比不小于10％，厚度 贝氏体的板条的长度不超过1μm，板条的长度不大于20μm，偏析中心偏析部分的Mn浓度相对于一部分的Mn浓度的偏析比 与表面厚度相当的1/4的厚度不大于1.3。 Pcm = C + Si / 30 +（Mn + Cu + Cr）/ 20 + Ni / 60 + Mo / 15 + V / 10 + 5B。 。 。 （1）其中，式（1）中的元素符号表示各元素的质量％。 这样，根据本发明的高强度钢板的屈服强度至少为551MPa，拉伸强度为至少620MPa，韧性高，传播剪切断裂高，焊接性高。

公开(公告)号：US20120032157A1

公开(公告)日：2012-02-09

申请号：US13260068

申请日：2010-06-15

申请人： Shigetoshi Kawabe ,  Nobuaki Takahashi

发明人： Shigetoshi Kawabe ,  Nobuaki Takahashi

IPC分类号： H01L51/52 ,  B05D5/12

CPC分类号： H01L51/0004 ,  B05C5/025 ,  B05C5/0254 ,  B05D1/265 ,  B05D5/06 ,  H01L51/56

摘要： Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.

摘要翻译： 公开了使用狭缝型模涂机和使用涂布法制备的有机电致发光元件，从具有低粘度的涂布溶液形成具有稳定厚度的涂层的涂布方法。 使用狭缝型模涂机的涂布方法包括以下步骤：使狭缝型模涂机的唇尖靠近基板，以在唇尖和基板之间形成涂布溶液珠，并在基板上涂布 在狭缝型模具涂布机和基板相对移动的同时从唇尖处的狭缝出口喷射的涂布溶液，从而形成至少两条条状涂层，其特征在于，唇尖在其中具有至少一个凹槽 在涂布宽度方向上的涂布区域，珠的涂布溶液的狭缝出口处的压力为负或为零。

公开(公告)号：US20110199407A1

公开(公告)日：2011-08-18

申请号：US12707827

申请日：2010-02-18

申请人： Satoshi Kaiho ,  Atsushi Kubota ,  Takashi Kado ,  Nobuaki Takahashi

发明人： Satoshi Kaiho ,  Atsushi Kubota ,  Takashi Kado ,  Nobuaki Takahashi

IPC分类号： B41J29/38

CPC分类号： B41J2/175 ,  B41J2/16585 ,  B41J2/17596 ,  B41J2/18 ,  B41J2/2114 ,  B41J3/543 ,  B41J25/003

摘要： The present invention provides, in an image forming apparatus configured to form an image on a recording medium with ejection liquids ejected from plural heads, a technique for enabling easy positioning of the respective plural heads. The image forming apparatus includes: plural heads including a reference head having a positioned section and configured to respectively eject ejection liquids onto a recording medium; a head base having plural head positioning sections on which the plural heads are respectively mounted to be positioned, whereon a reference-head positioning section on which the reference head should be mounted in cooperation with the positioned section of the reference head performs positioning at a degree of freedom of position adjustment lower than that of the other head positioning sections; and a conveying unit configured to convey the recording medium to a position opposed to the head base.

摘要翻译： 本发明提供一种图像形成装置，该图像形成装置被配置为在从多个头部喷出的喷射液体的记录介质上形成图像，能够容易地定位各个头部的技术。 图像形成装置包括：多个头部，包括具有定位部分的参考头部，并且被配置为分别将喷射液体喷射到记录介质上; 具有多个头部定位部分的头部基座，多个头部分别安装在该头部定位部分上，其中与参考头部的定位部分配合地安装参考头部的基准头定位部分以一定程度进行定位 位置调整自由度低于其他头部定位部分的自由度; 以及传送单元，其构造成将记录介质传送到与头部基座相对的位置。

公开(公告)号：US20110076722A1

公开(公告)日：2011-03-31

申请号：US12989600

申请日：2009-04-27

申请人： Nobuaki Takahashi

发明人： Nobuaki Takahashi

IPC分类号： C12P21/00 ,  C07K16/00 ,  C12N15/13 ,  C12N15/63 ,  C12N5/00

CPC分类号： C07K16/468 ,  A61K39/39591 ,  C07K16/2818 ,  C07K16/2878 ,  C07K2317/51 ,  C07K2317/56 ,  C07K2317/622 ,  C07K2317/624 ,  C07K2317/626 ,  C07K2317/64 ,  C07K2319/00

摘要： The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof.

摘要翻译： 本发明涉及包含通过包含编码免疫球蛋白结构域或其片段的氨基酸序列的接头彼此连接的多个抗体重链可变区的多价抗体。

公开(公告)号：US20110027987A1

公开(公告)日：2011-02-03

申请号：US12801458

申请日：2010-06-09

申请人： Nobuaki Takahashi ,  Masahiro Komuro

发明人： Nobuaki Takahashi ,  Masahiro Komuro

IPC分类号： H01L21/445

CPC分类号： C23C18/1651 ,  C23C18/1632 ,  C23C18/32 ,  C23C18/54 ,  H01L21/288 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment.

摘要翻译： 一种半导体器件的制造方法包括使用无电镀法在半导体衬底上形成多个金属膜的叠层结构。 金属膜的形成包括：使用第一镀槽进行包括还原反应的无电镀处理; 并且仅使用第二镀槽进行取代反应进行化学镀处理。 包括使用第一镀槽进行的还原反应的化学镀处理在遮蔽环境中进行，并且在非遮蔽环境中进行仅使用第二镀槽的取代反应进行的化学镀处理。

公开(公告)号：US07881605B2

公开(公告)日：2011-02-01

申请号：US12073004

申请日：2008-02-28

申请人： Takao Goto ,  Nobuaki Takahashi

发明人： Takao Goto ,  Nobuaki Takahashi

IPC分类号： G03B21/00

CPC分类号： G03B17/48 ,  G03B21/008

摘要： A camera with a built-in projector includes: a camera unit equipped with photographing components including an optical system; and a projector module equipped with a projecting optical system, with an optical axis extending along a longer side of the projector module running substantially parallel to an optical axis of the camera unit extending along a longer side of the camera unit.

摘要翻译： 具有内置投影仪的相机包括：配备有包括光学系统的拍摄部件的相机单元; 以及配备有投影光学系统的投影仪模块，沿着投影仪模块的较长边延伸的光轴基本上平行于相机单元的沿着相机单元的较长边延伸的光轴延伸。

公开(公告)号：US20090302430A1

公开(公告)日：2009-12-10

申请号：US12477178

申请日：2009-06-03

申请人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

发明人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L21/3205

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/17181 ,  H01L2924/00014

摘要： In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r3 from the circumference of the opening pattern to the central axis of the through-hole is smaller than the distance r1 in the through-hole. By providing the opening pattern, the conductive pattern is exposed at the bottom surface of the through-hole. The bump is located on the back surface side of the substrate, and is formed integrally with the through-electrode.

摘要翻译： 在该半导体装置中，通孔形成在基板上，位于导电图案的下方。 绝缘层位于通孔的底面。 导电图案位于基板的一个表面侧。 开口图案形成在位于通孔和导电图案之间的绝缘层中，其中从开口图案的周边到通孔的中心轴线的距离r3小于通孔中的距离r1 通孔。 通过设置开口图案，导电图案在通孔的底面露出。 凸块位于基板的背面侧，与贯通电极一体形成。