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公开(公告)号：US09947598B1
公开(公告)日：2018-04-17
申请号：US15634237
申请日：2017-06-27
Applicant: International Business Machines Corporation
Inventor： Krishna R. Tunga , Karen P. McLaughlin , Charles L. Arvin , Brian R. Sundlof , Steven P. Ostrander , Christopher D. Muzzy , Thomas A. Wassick
CPC classification number: H01L22/12 , H01L21/78 , H01L23/585
Abstract: A methodology and associated wafer level assembly of testing crackstop structure designs. The wafer level semiconductor assembly includes: a substrate structure shaped to define a set of horizontal directions; a metallization layer located on top of the substrate structure, with the metallization layer including a crackstop structure formed therein in accordance with a crackstop structure design; and a tensioned layer located on top of the metallization layer, with the tensioned layer being made of material having internal tensile forces oriented in the horizontal directions. The tensile forces promote horizontal direction crack propagation in the metallization layer so that the crackstop structure design can be tested more rigorously and reliably before deciding on the crackstop design structure to put into mass production (which mass produced product would typically not include the tensioned layer).
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公开(公告)号：US09837333B1
公开(公告)日：2017-12-05
申请号：US15271980
申请日：2016-09-21
Applicant: International Business Machines Corporation
Inventor： Kamal K. Sikka , Krishna R. Tunga
IPC: H01L21/56 , H01L23/367 , H01L23/48 , H01L23/00 , H01L21/48
CPC classification number: H01L23/3675 , H01L21/563 , H01L23/373 , H01L23/3736 , H01L23/42 , H01L24/16 , H01L2224/16157
Abstract: An electronic package lid which includes one or more underside ribs. The ribs have a major length and a minor width and are generally aligned to be parallel with a diagonal or normal bisector of the processing device. The underside rib generally stiffens the cover such that an upper surface of the cover is more apt to stay flat. As such, cover warpage and, therefore, the peeling of the TIM1 and delamination of underfill due to the physical or dimensional expansion of the processing device and/or a carrier may be reduced. As a result, the surface area dedicated for the seal material upon the carrier surface may be reduced, thereby increasing the available surface area upon the carrier for additional electronic components to be placed in close proximity to the processing device.
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公开(公告)号：US09754905B1
公开(公告)日：2017-09-05
申请号：US15292433
申请日：2016-10-13
Applicant: International Business Machines Corporation
Inventor： Ekta Misra , Krishna R. Tunga
IPC: H01L23/00
CPC classification number: H01L24/05 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/02126 , H01L2224/0215 , H01L2224/02166 , H01L2224/02185 , H01L2224/0219 , H01L2224/03013 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05191 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05657 , H01L2224/05666 , H01L2224/05669 , H01L2224/0567 , H01L2224/05676 , H01L2224/05681 , H01L2224/05684 , H01L2224/05687 , H01L2224/05691 , H01L2224/05693 , H01L2224/131 , H01L2224/13111 , H01L2924/07025 , H01L2924/3511 , H01L2924/35121 , H01L2924/014 , H01L2924/01047 , H01L2924/00014 , H01L2924/04953 , H01L2924/04941 , H01L2924/0455 , H01L2924/01073 , H01L2924/04541 , H01L2924/0469 , H01L2924/0463 , H01L2924/01013 , H01L2924/0476 , H01L2924/01074 , H01L2924/0496 , H01L2924/0538 , H01L2924/01044 , H01L2924/0479 , H01L2924/01027 , H01L2924/048 , H01L2924/01028 , H01L2924/01006
Abstract: Embodiments are directed to a method of forming a semiconductor chip package and resulting structures having an annular PSPI region formed under a BLM pad. An annular region is formed under a barrier layer metallurgy (BLM) pad. The annular region includes a photosensitive polyimide (PSPI). A conductive pedestal is formed on a surface of the BLM pad and a solder bump is formed on a surface of the conductive pedestal. The annular PSPI region reduces wafer warpage and ULK peeling stress.
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公开(公告)号：US20170178982A1
公开(公告)日：2017-06-22
申请号：US14973165
申请日：2015-12-17
Applicant: International Business Machines Corporation
Inventor： Sushumna Iruvanti , Shidong Li , Marek A. Orlowski , David L. Questad , Tuhin Sinha , Krishna R. Tunga , Thomas A. Wassick , Randall J. Werner , Jeffrey A. Zitz
IPC: H01L21/66 , H01L23/498 , H01L21/48 , G06F17/50
CPC classification number: H01L22/32 , G06F17/5068 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L2224/16225 , H01L2924/15311
Abstract: A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.
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公开(公告)号：US09563732B1
公开(公告)日：2017-02-07
申请号：US15006567
申请日：2016-01-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Anson J. Call , Vijayeshwar D. Khanna , David J. Russell , Krishna R. Tunga
CPC classification number: G06F17/5068 , G06F2217/44 , H05K1/0271 , H05K3/0005
Abstract: A method of predicting warpage of a laminate is disclosed in which in-plane copper imbalance is calculated. A method of designing an organic build-up laminate is provided in which in-plane copper imbalance is calculated and imbalances are corrected.
Abstract translation: 公开了一种预测层压板的翘曲的方法，其中计算了平面内的不平衡。 提供一种设计有机积层叠板的方法，其中计算面内铜不平衡并校正不平衡。
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Patent Agency Ranking
公开(公告)号：US11302205B2
公开(公告)日：2022-04-12
申请号：US17131256
申请日：2020-12-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Mahmoud Amin , Zhenxing Bi , Lawrence A. Clevenger , Leigh Anne H. Clevenger , Christopher J. Penny , Krishna R. Tunga , Loma Vaishnav
Abstract: A computer-implemented method, a computer program product, and an incremental learning system are provided for language learning and speech enhancement. The method includes transforming acoustic utterances uttered by an individual into textual representations thereof, by a voice-to-language processor configured to perform speech recognition. The method further includes accelerating speech development in the individual, by an incremental learning system that includes the voice-to-language processor and that processes the acoustic utterances using natural language processing and analytics to determine and incrementally provide new material to the individual for learning. Responsive to the individual being a baby, the voice-to-language processor discretizes baby babbling to consonants, letters, and words.
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公开(公告)号：US20220032000A1
公开(公告)日：2022-02-03
申请号：US17503829
申请日：2021-10-18
Applicant: International Business Machines Corporation
Inventor： Mahmoud Amin , Krishna R. Tunga , Lawrence A. Clevenger , Zhenxing Bi , Leigh Anne H. Clevenger
Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.
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公开(公告)号：US11210968B2
公开(公告)日：2021-12-28
申请号：US16134164
申请日：2018-09-18
Applicant: International Business Machines Corporation
Inventor： Lawrence A. Clevenger , Stefania Axo , Leigh Anne H. Clevenger , Krishna R. Tunga , Mahmoud Amin , Bryan Gury , Christopher J. Penny , Mark C. Wallen , Zhenxing Bi , Yang Liu
IPC: G09B19/00 , G06F3/0481 , G09B5/06 , G06F9/451 , G06N20/00
Abstract: A computer system interacts with a user with a behavioral state. An activity performed by an entity with a behavioral state is determined. A virtual character corresponding to the entity and performing the determined activity of the entity is generated and displayed. A mental state of the entity responsive to the virtual character is detected. In response to detection of a positive mental state of the entity, one or more natural language terms are provided to the entity corresponding to the activity performed by the virtual character. Embodiments of the present invention further include a method and program product for interacting with a user with a behavioral state in substantially the same manner described above.
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公开(公告)号：US11185658B2
公开(公告)日：2021-11-30
申请号：US16217926
申请日：2018-12-12
Applicant: International Business Machines Corporation
Inventor： Mahmoud Amin , Krishna R. Tunga , Lawrence A. Clevenger , Zhenxing Bi , Leigh Anne H. Clevenger
Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.
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公开(公告)号：US20210320056A1
公开(公告)日：2021-10-14
申请号：US16845404
申请日：2020-04-10
Applicant: International Business Machines Corporation
Inventor： Krishna R. Tunga , Thomas Weiss , Charles Leon Arvin , Bhupender Singh , Brian W. Quinlan
IPC: H01L23/498 , H01L23/00 , H01L23/538 , H01L21/50
Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.
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