公开(公告)号：US4937006A

公开(公告)日：1990-06-26

申请号：US226161

申请日：1988-07-29

申请人： Harry R. Bickford ,  Raymond R. Horton ,  Ismail C. Novan ,  Michael J. Palmer ,  John C. Zyzo

发明人： Harry R. Bickford ,  Raymond R. Horton ,  Ismail C. Novan ,  Michael J. Palmer ,  John C. Zyzo

IPC分类号： B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34

CPC分类号： H01L21/67144 ,  B23K1/012 ,  H01L2224/16 ,  H05K3/3494

摘要： Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

公开(公告)号：US08342385B2

公开(公告)日：2013-01-01

申请号：US13089074

申请日：2011-04-18

申请人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

发明人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

IPC分类号： B23K31/02 ,  B23K35/38

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K2101/40 ,  H01L2224/81012

摘要： A transfer process for bonding a solderable device to a solderable firsl substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.

摘要翻译： 用于将可焊接装置接合到具有第一氧化表面的可焊接冷杉基板的转移过程包括将可焊接装置靠近第一基板放置在还原室中，其中第一表面不能被目视观察。 我们以在目视上观察第二表面的方式放置在腔室中具有第二氧化表面的第二衬底。 选择第一基板和第二基板，使得第二表面的减小与第一表面的减小相关，提供第一表面的减小程度的指示。 在还原条件下将还原剂引入到室中通过照射和观察第二表面来减少我们跟踪的表面; 评估照射期间第二表面的任何变化，并将变化与第一表面还原相关联。 当充分减少时，我们将第一个衬底焊接到器件。

公开(公告)号：US08187923B2

公开(公告)日：2012-05-29

申请号：US12167745

申请日：2008-07-03

申请人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Raymond R. Horton ,  Edmund J. Sprogis

发明人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Raymond R. Horton ,  Edmund J. Sprogis

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  Y10S414/139 ,  H01L2924/00 ,  H01L2224/0401

摘要： A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.

摘要翻译： 提供了用于避免载波边缘破裂的集成电路模块的激光释放和玻璃切屑去除工艺。

公开(公告)号：US20080176411A1

公开(公告)日：2008-07-24

申请号：US12056773

申请日：2008-03-27

申请人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

发明人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

IPC分类号： H01L21/31

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mole vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

摘要翻译： 提供电子器件制造技术。 一方面，提供一种电子设备。 电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个。

公开(公告)号：US5676301A

公开(公告)日：1997-10-14

申请号：US733835

申请日：1996-10-18

申请人： Bernie Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Frederick G. Weindelmayer

发明人： Bernie Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Frederick G. Weindelmayer

IPC分类号： H01L21/60 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34 ,  B23K3/04

CPC分类号： H01L24/86 ,  H05K3/363 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/0394 ,  H05K2201/09709 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/167 ,  H05K3/4084

摘要： A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row.

摘要翻译： 一种用于将多个微电子引线连接到相关联的多个接触焊盘的雉形喷嘴及其使用方法。 所述雉形喷嘴包括具有从其突出的多个蓖耳体的主体，其中每个所述雉ations都具有接触表面。 形成与多个城堡中的至少一个城堡相邻的通道。 开口延伸穿过主体，用于在其中引入加热的气体。 多个城堡的接触表面与相应的多个引线对准。 典型地，雉形喷嘴包括形成第一排的第一多个雉ell和形成第二排的第二多个雉。。

公开(公告)号：US5229328A

公开(公告)日：1993-07-20

申请号：US908429

申请日：1992-06-30

申请人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

发明人： Mark F. Bregman ,  Raymond R. Horton ,  Alphonso P. Lanzetta ,  Ismail C. Noyan ,  Michael J. Palmer ,  Ho-Ming Tong

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4084 ,  Y10T29/49121

摘要： A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

摘要翻译： 一种用于将导体接合到半导体芯片接触焊盘的方法，其中每个导体安装在电介质带上，并且具有由带支撑到相邻位置的附接部分，距离接合位置具有均匀的距离，并且与平面接触 的磁带下面。 一个导体支撑带具有延伸到中心接触区域中的带的部分，以接触位于远离边缘的行中的接触垫处的位置。 另一个支撑带在接触位置处具有窗口。 导体端部通过弹性体表面辊和固体背衬辊之间的制造滚动操作而进入带的下侧的水平面。

公开(公告)号：US5074969A

公开(公告)日：1991-12-24

申请号：US666007

申请日：1991-03-07

申请人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

发明人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393

摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

摘要翻译： 本发明包括使用含铜/镍的合金组合物或者对铜载流导线施加保护性镍合金涂层，以防止带状自动键合（TAB）封装引线之间的电解迁移。

公开(公告)号：US4875614A

公开(公告)日：1989-10-24

申请号：US264713

申请日：1988-10-31

申请人： Thomas M. Cipolla ,  Raymond R. Horton ,  Philip Murphy ,  Michael J. Palmer

发明人： Thomas M. Cipolla ,  Raymond R. Horton ,  Philip Murphy ,  Michael J. Palmer

IPC分类号： H01L21/60 ,  B23K20/02 ,  F16C19/50 ,  H01L21/00

CPC分类号： F16C19/50 ,  B23K20/02 ,  H01L21/67144 ,  H01L24/78 ,  H01L2224/75745 ,  H01L2224/75823 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  Y10S269/903

摘要： Apparatus for automatically adjusting the orientation of a first surface of a first body to be against a second surface of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

公开(公告)号：US07791168B2

公开(公告)日：2010-09-07

申请号：US11930698

申请日：2007-10-31

申请人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

发明人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

IPC分类号： H01L29/00 ,  H01L23/52 ,  H01L23/04 ,  H01L23/053

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device includes at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device including at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein includes the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

摘要翻译： 提供电子器件制造技术。 一方面，提供一种电子设备。 电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其中包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个。

公开(公告)号：US07691669B2

公开(公告)日：2010-04-06

申请号：US12056852

申请日：2008-03-27

申请人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

发明人： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/8242

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

摘要翻译： 提供电子器件制造技术。 一方面，提供一种电子设备。 电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个。