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公开(公告)号：US20130250582A1
公开(公告)日：2013-09-26
申请号：US13898470
申请日：2013-05-21
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Azmi Kadkly
IPC: F21V5/00
CPC classification number: F21V5/008 , G01N21/8806 , G01N21/9501 , G01N21/9505
Abstract: Illumination subsystems for multi-spot wafer inspection are provided. One illumination subsystem includes a diffractive optical element configured to separate an illumination light beam into multiple light beams and a refractive lens array positioned in the path of the multiple light beams. The refractive lens array is configured to relay the laser beam waist at the diffractive optical element onto a wafer surface and to separately and simultaneously focus each of the multiple light beams to a wafer for inspection.
Abstract translation: 提供了多点晶圆检查的照明子系统。 一个照明子系统包括被配置为将照明光束分离成多个光束的衍射光学元件和位于多个光束的路径中的折射透镜阵列。 折射透镜阵列被配置为将衍射光学元件处的激光束腰部中继到晶片表面上，并且将多个光束中的每一个分别并且同时聚焦到晶片以进行检查。
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公开(公告)号：US20130250385A1
公开(公告)日：2013-09-26
申请号：US13845587
申请日：2013-03-18
Applicant: KLA-TENCOR CORPORATION
Inventor： Christian Wolters , Jijen Vazhaeparambil , Dirk Woll , Anatoly Romanovsky , Bret Whiteside , Stephen Biellak , Guoheng Zhao
CPC classification number: G02B27/1006 , G02B26/10 , G02B26/106 , G02F1/0105 , G02F1/353 , G03F7/7065 , H01S3/0071 , H01S3/0092
Abstract: A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination.
Abstract translation: 公开了一种用于提供照明的方法和系统。 该方法可以包括提供具有预定波长的激光; 在频率转换之前进行光束分割或光束扫描中的至少一个; 转换以下至少一个的每个输出光束的频率：分束或光束扫描; 并提供用于照明的频率转换输出光束。
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公开(公告)号：US11366069B2
公开(公告)日：2022-06-21
申请号：US16946742
申请日：2020-07-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-Ming Benjamin Tsai
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.
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公开(公告)号：US20180209784A1
公开(公告)日：2018-07-26
申请号：US15329778
申请日：2016-11-04
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Maarten van der Burgt , Sheng Liu , Andy Hill , Johan De Greeve , Karel van Gils
CPC classification number: G01B11/2518 , G01B11/0608 , G01B11/24 , G01B11/2513 , G01B11/2522 , G01B2210/56
Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
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公开(公告)号：US20170276613A1
公开(公告)日：2017-09-28
申请号：US15468608
申请日：2017-03-24
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
CPC classification number: G01N21/8806 , G01N21/21 , G01N21/9501 , G01N2021/8848 , G01N2201/0683
Abstract: Disclosed are methods and apparatus for inspecting a semiconductor sample. This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system further includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, followed by a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, followed by a rotatable analyzer. The system also includes a controller that is configured for (i) selecting a polarization of the incident beam, (ii) obtaining a defect scattering map, (iii) obtaining a surface scattering map, and (iv) determining a configuration of the one or more polarization components, aperture mask, and rotatable ¼ waveplate, and analyzer based on analysis of the defect and surface scattering map so as to maximize a defect signal to noise ratio,
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Patent Agency Ranking
公开(公告)号：US09645097B2
公开(公告)日：2017-05-09
申请号：US14741866
申请日：2015-06-17
Applicant: KLA-Tencor Corporation
Inventor： Lena Nicolaides , Ben-ming Benjamin Tsai , Prashant A. Aji , Michael Gasvoda , Stanley E. Stokowski , Guoheng Zhao , Youxian Wen , Mohan Mahadevan , Paul D. Horn , Wolfgang Vollrath , Isabella T. Lewis
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
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公开(公告)号：US09182358B2
公开(公告)日：2015-11-10
申请号：US13834662
申请日：2013-03-15
Applicant: KLA-Tencor Corporation
Inventor： Zhiwei Xu , Christian Wolters , Juergen Reich , Bret Whiteside , Guoheng Zhao , Jijen Vazhaeparambil , Stephen Biellak , Sam Shamouilian , Mehdi Vaez-Iravani
IPC: G01N21/00 , G01N21/95 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/956
Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.
Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。
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公开(公告)号：US20200333262A1
公开(公告)日：2020-10-22
申请号：US16946742
申请日：2020-07-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-Ming Benjamin Tsai
IPC: G01N21/95 , G06T7/00 , G01N21/956 , G01N21/88
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample
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公开(公告)号：US10462391B2
公开(公告)日：2019-10-29
申请号：US15210056
申请日：2016-07-14
Applicant: KLA-Tencor Corporation
Inventor： Yung-Ho Alex Chuang , David L. Brown , Devis Contarato , John Fielden , Daniel I. Kavaldjiev , Guoheng Zhao , Jehn-Huar Chern , Guowu Zheng , Donald W. Pettibone , Stephen Biellak
IPC: H04N5/335 , G01N21/95 , G06T7/00 , H04N5/225 , H04N5/347 , H04N5/378 , H04N5/3745 , H04N5/376 , G01N21/956
Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.
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公开(公告)号：US20190212277A1
公开(公告)日：2019-07-11
申请号：US16357025
申请日：2019-03-18
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , J.K. Leong , Michael Kirk
Abstract: A inspection system includes an illumination source to generate an illumination beam, focusing elements to direct the illumination beam to a sample, a detector, collection elements configured to direct radiation emanating from the sample to the detector, a detection mode control device to image the sample in two or more detection modes such that the detector generates two or more collection signals based on the two or more detection modes, and a controller. Radiation emanating from the sample includes at least radiation specularly reflected by the sample and radiation scattered by the sample. The controller determines defect scattering characteristics associated with radiation scattered by defects on the sample based on the two or more collection signals. The controller also classifies the one or more particles according to a set of predetermined defect classifications based on the one or more defect scattering characteristics.
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