Abstract:
A data path for memory addressable using an addressing scheme based on a minimum addressable unit, such as a byte, having a size (e.g. 8) which is a power of 2, is configured for transferring data between the memory array and a data interface using a transfer storage unit having N bits (e.g. 12), where N is an integer that is not a power of 2. A page buffer and cache in the data path can be configured in unit arrays with N rows, and to transfer data in the transfer storage units from selected N cell columns.
Abstract:
A flash memory system and a flash memory thereof are provided. The flash memory device includes a NAND flash memory and a control circuit. The NAND flash memory chip includes a cache memory, a page buffer; and an NAND flash memory array. The NAND flash memory array includes a plurality of pages, wherein each page includes a plurality of sub-pages, each sub-page has a sub-page length. The cache memory is composed of a plurality of sub cache and each sub cache corresponds to different pages of the NAND flash memory array. The page buffer is composed of a plurality of sub-page buffers and each sub-page buffer corresponds to different pages of the NAND flash memory array. The control circuit is coupled to the host and the NAND flash memory, and performs an access operation in units of one sub-page.
Abstract:
A memory device such as a page mode NAND flash is operated, using a first pipeline stage, to clear a page buffer to a second buffer level, and transfer a page to the page buffer; a second pipeline stage to clear the second buffer level to the third buffer level and transfer the page from the page buffer to the second buffer level; a third pipeline stage to move the page to the third buffer level and execute in an interleaved fashion a first ECC function over data in a first part of the page and output the first part of the page while performing an second ECC function, and to execute the first ECC function over data in a second part of the page in the third buffer level, and to output the second part while performing the second ECC function.
Abstract:
A memory device such as a page mode NAND flash, including a page buffer with first and second-level buffer latches is operated using a first pipeline stage, to transfer a page to the first-level buffer latches; a second pipeline stage, to clear the second-level buffer latches to a third buffer level and transfer the page from the first-level buffer latches to the second-level buffer latches; and a third pipeline stage to move the page to the third buffer level and execute in an interleaved fashion a first ECC function over data in a first part of the page and output the first part of the page while performing a second ECC function, and to execute the first ECC function over data in a second part of the page in the third buffer level, and to output the second part while performing the second ECC function.
Abstract:
A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, and an adjustment unit. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate based on a non-constant voltage.
Abstract:
A program method for a multi-level cell (MLC) flash memory is provided. The memory array includes a plurality of pages and a plurality of paired pages, which correspond to the respective pages. The program method includes the following steps. Firstly, a program address command is obtained. Next, whether the program address command corresponding to any one of the paired pages is determined. When the program address command corresponds to a first paired page, which corresponds to a first page among the pages, among the paired pages, data stored in the first page to a non-volatile memory are copied. After that, the first paired page is programmed.
Abstract:
A method is provided for sensing data in a memory device. The memory device includes a block of memory cells coupled to a plurality of bit lines. The method includes precharging the plurality of bit lines to a first level VPRE. The method includes enabling current flow through selected memory cells on the plurality of bit lines to a reference line or to reference lines coupled to a reference voltage. The method includes preventing a voltage change as a result of the current flow on the bit lines from causing a bit line voltage to pass outside a range between the first level and a second level VKEEP, where the second level is lower than the first level and higher than the reference voltage. The method includes sensing data in the selected memory cells.
Abstract:
A memory circuit includes word lines coupled to a memory array, including a first set of one or more word lines deselected in an erase operation, and a second set of one or more word lines selected in the erase operation. Control circuitry couples the first set of one or more word lines deselected in the erase operation to a reference voltage, responsive to receiving an erase command for the erase operation. Some examples further include a first transistor that switchably couples a word line to a global word line, and a second transistor that switchably couples the word line to a ground voltage. The control circuitry is coupled to the first transistor and the second transistor, wherein the control circuitry has a plurality of modes including at least an erase operation. In a first mode, the first transistor couples the word line to the global word line, and the second transistor decouples the word line from the ground voltage. In a second mode, the first transistor decouples the word line from the global word line, and the second transistor couples the word line to the ground voltage.
Abstract:
An integrated circuit includes an array of memory cells that is arranged into rows, main columns, and redundant columns that perform repairs in the array. The main columns and the redundant columns are divided into row blocks. Bit lines couple the main columns to status memory indicating repair statuses of the repairs by the redundant columns. The integrated circuit receives a command, and performs an update on the status memory with the repair statuses specific to particular ones of the row blocks in a portion of the memory accessed by the command. Alternatively or in combination, the status memory has insufficient size to store the repair statuses of multiple ones of the row blocks of the main columns.
Abstract:
Various aspects of a NAND memory include a control circuit that applies a read bias arrangement to a plurality of word lines to read a selected data value stored on a plurality of memory cells by measuring current flowing between the first end and the second end of the series of memory cells. The read bias arrangement is applied to word lines of the plurality of word lines applies only word line voltages less than a second maximum of a second threshold voltage distribution.