Method of making semiconductor optical integrated device by alternately arranging spacers with integrated device arrays
    21.
    发明授权
    Method of making semiconductor optical integrated device by alternately arranging spacers with integrated device arrays 有权
    通过用集成器件阵列交替布置间隔物来制造半导体光学集成器件的方法

    公开(公告)号:US08563342B2

    公开(公告)日:2013-10-22

    申请号:US13479567

    申请日:2012-05-24

    IPC分类号: H01L21/00

    摘要: A method of making a semiconductor optical integrated device includes the steps of forming, on a substrate, a plurality of semiconductor integrated devices including a first optical semiconductor element having a first bonding pad and a second optical semiconductor element; forming a plurality of bar-shaped semiconductor optical integrated device arrays by cutting the substrate, each of the semiconductor optical integrated device arrays including two or more semiconductor optical integrated devices; alternately arranging the plurality of semiconductor optical integrated device arrays and a plurality of spacers in a thickness direction of the substrate so as to be fixed in place; and forming a coating film on a facet of the semiconductor optical integrated device array. Furthermore, the spacer has a movable portion facing the first bonding pad, the movable portion protruding toward the first bonding pad and being displaceable in a protruding direction.

    摘要翻译: 制造半导体光学集成器件的方法包括以下步骤:在衬底上形成包括具有第一焊盘和第二光学半导体元件的第一光学半导体元件的多个半导体集成器件; 通过切割衬底形成多个条形半导体光学集成器件阵列,每个半导体光学集成器件阵列包括两个或更多个半导体光学集成器件; 在基板的厚度方向交替布置多个半导体光学集成器件阵列和多个间隔物,以便固定就位; 以及在所述半导体光学集成器件阵列的刻面上形成涂膜。 此外,间隔件具有面向第一接合焊盘的可动部,可动部朝向第一接合焊盘突出,并且能够沿突出方向移位。

    Multilayer printed circuit board
    22.
    发明授权
    Multilayer printed circuit board 有权
    多层印刷电路板

    公开(公告)号:US08530750B2

    公开(公告)日:2013-09-10

    申请号:US13140094

    申请日:2010-01-28

    申请人: Kenji Koyama

    发明人: Kenji Koyama

    IPC分类号: H05K1/00

    摘要: A multilayer printed circuit board includes a first conductive layer including (i) a first signal ground, (ii) a first frame ground mounted on an external interface component, (iii) a first slit portion that separates the first signal ground and the first frame ground from each other, and (iv) a signal wiring arranged to extend over the first slit portion. A second conductive layer is laminated on the first conductive layer through a dielectric layer. The second conductive layer includes (i) a second signal ground, (ii) a second frame ground, and (iii) a second slit portion that separates the second signal ground and the second frame ground from each other. A first connecting member and a second connecting member connect the second signal ground and the second frame ground to each other. The first connecting member and the second connecting member are arranged along the signal wiring on a different side, such that the first connecting member and the second connecting member sandwich the signal wiring and extend over the second slit portion.

    摘要翻译: 多层印刷电路板包括第一导电层,其包括(i)第一信号地,(ii)安装在外部接口部件上的第一框架接地,(iii)第一狭缝部分,其将第一信号地和第一框架 彼此接地,以及(iv)布置成在第一狭缝部分上延伸的信号布线。 第二导电层通过介电层层压在第一导电层上。 第二导电层包括(i)第二信号接地,(ii)第二框架接地,以及(iii)将第二信号地和第二框架接地彼此分开的第二狭缝部分。 第一连接构件和第二连接构件将第二信号地和第二框架接地连接。 第一连接构件和第二连接构件沿着不同侧的信号布线布置,使得第一连接构件和第二连接构件夹住信号布线并且在第二狭缝部分上延伸。

    SEMICONDUCTOR OPTICAL MODULATOR AND METHOD FOR MANUFACTURING THE SAME
    23.
    发明申请
    SEMICONDUCTOR OPTICAL MODULATOR AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体光学调制器及其制造方法

    公开(公告)号:US20120148184A1

    公开(公告)日:2012-06-14

    申请号:US13311837

    申请日:2011-12-06

    IPC分类号: G02F1/025 H01L21/302

    摘要: A process to manufacture a semiconductor optical modulator is disclosed, in which the process easily forms a metal film including AuZn for the p-ohmic metal even a contact hole has an enhanced aspect ration. The process forms a mesa including semiconductor layers first, then, buries the mesa by a resin layer sandwiched by insulating films. The resin layer provides an opening reaching the top of the mesa, into which the p-ohmic metal is formed. Another metal film including Ti is formed on the upper insulating film along the opening.

    摘要翻译: 公开了一种制造半导体光调制器的方法,其中该方法容易地形成包括用于p-欧姆金属的AuZn的金属膜,即使接触孔具有增强的纵横比。 该方法首先形成包括半导体层的台面,然后通过被绝缘膜夹在中间的树脂层掩埋台面。 树脂层提供达到台面顶部的开口,形成p欧姆金属。 包括Ti的另一金属膜沿着开口形成在上绝缘膜上。

    Image recording apparatus, image recording method, and computer-readable recording medium
    24.
    发明授权
    Image recording apparatus, image recording method, and computer-readable recording medium 失效
    图像记录装置,图像记录方法和计算机可读记录介质

    公开(公告)号:US07835638B2

    公开(公告)日:2010-11-16

    申请号:US11684121

    申请日:2007-03-09

    申请人: Kenji Koyama

    发明人: Kenji Koyama

    IPC分类号: G03B15/03 G06K9/00

    摘要: An image recording apparatus includes an image sensing part for converting an optical image imaged by a photograph lens to an electric signal, a distance measuring part for measuring a distance between a target object and the image recording apparatus, an illumination part for generating an illumination light and a pre-illumination light, a first illumination controlling part for controlling the amount of the illumination light of the illumination part based on the measured distance of the distance measuring part and a F number of the photograph lens, a second illumination controlling part for controlling the amount of the illumination light of the illumination part based on the electric signal output from the image sensing part in correspondence with the pre-illumination light, and a selecting part for selecting one of the first illumination controlling part and the second illumination controlling part.

    摘要翻译: 图像记录装置包括用于将由照相镜成像的光学图像转换为电信号的图像感测部分,用于测量目标对象与图像记录装置之间的距离的距离测量部分,用于产生照明光的照明部分 以及预照明光,第一照明控制部,其基于距离测量部的测量距离和照相镜的F数来控制照明部的照明光的量;第二照明控制部,其用于控制 基于从摄像部输出的与预照明光对应的电信号的照明部的照明光的量,以及选择部,用于选择第一照明控制部和第二照明控制部之一。

    Process for the treatment of waste gases from a chlorination furnace
    29.
    发明授权
    Process for the treatment of waste gases from a chlorination furnace 失效
    用于处理来自氯化炉的废气的方法

    公开(公告)号:US4474587A

    公开(公告)日:1984-10-02

    申请号:US456049

    申请日:1982-12-29

    摘要: A waste gas exhausted from a chlorination furnace during the manufacture of titanium tetrachloride or zirconium tetrachloride which contains larger quantities of CO.sub.2 and harmful substances such as chlorides and the like is subjected to treatment which comprises the sequential steps of scrubbing the waste gas in a water scrubbing column, removing moisture from the waste gas to allow the waste gas to have a dew point of no more that 5.degree. C., and adsorbing the waste gas in an activated carbon packed column. The process is capable of reducing the content of chlorides in the waste gas to a level of no more than 5 ppm in HCl equivalent.

    摘要翻译: PCT No.PCT / JP82 / 00203 Sec。 1982年12月29日第 102(e)1982年12月29日日期PCT提交1982年5月28日PCT公布。 出版物WO82 / 04199 日期为1982年12月9日。在制造含有较大量二氧化碳的四氯化钛或四氯化锆的四氯化钛或氯化物等有害物质的制造中,从氯化炉中排出的废气进行处理,其包括洗涤的顺序步骤 水洗涤塔中的废气,从废气中除去水分,使废气的露点不超过5℃,并将废气吸附在活性炭填充塔中。 该方法能够将废气中的氯化物含量降低至不超过5ppm的HCl当量。

    MULTILAYER PRINTED CIRCUIT BOARD
    30.
    发明申请
    MULTILAYER PRINTED CIRCUIT BOARD 有权
    多层印刷电路板

    公开(公告)号:US20110247869A1

    公开(公告)日:2011-10-13

    申请号:US13140094

    申请日:2010-01-28

    申请人: Kenji Koyama

    发明人: Kenji Koyama

    IPC分类号: H05K1/11

    摘要: Provided is a multilayer printed circuit board including: a signal ground pattern; a frame ground pattern formed through a slit portion; an external interface component connected to a semiconductor device by a signal wiring extending over the slit portion; and two connecting members having an electrical conductivity arranged symmetrically such that the connecting members sandwich the signal wiring and extend over the slit portion. With this configuration, a return current path is formed between the frame ground pattern and the signal ground pattern, to thereby improve a resistance to exogenous noise such as electrostatic discharge noise, and suppress radiation noise.

    摘要翻译: 提供了一种多层印刷电路板,包括:信号接地图案; 通过狭缝部形成的框架接地图案; 通过在所述狭缝部分上延伸的信号线连接到半导体器件的外部接口部件; 以及具有对称布置的导电性的两个连接构件,使得连接构件夹着信号布线并在狭缝部分上延伸。 利用这种结构,在帧接地图案和信号接地图案之间形成返回电流路径,从而提高对诸如静电放电噪声的外来噪声的抵抗,并抑制辐射噪声。