摘要:
A method of making a semiconductor optical integrated device includes the steps of forming, on a substrate, a plurality of semiconductor integrated devices including a first optical semiconductor element having a first bonding pad and a second optical semiconductor element; forming a plurality of bar-shaped semiconductor optical integrated device arrays by cutting the substrate, each of the semiconductor optical integrated device arrays including two or more semiconductor optical integrated devices; alternately arranging the plurality of semiconductor optical integrated device arrays and a plurality of spacers in a thickness direction of the substrate so as to be fixed in place; and forming a coating film on a facet of the semiconductor optical integrated device array. Furthermore, the spacer has a movable portion facing the first bonding pad, the movable portion protruding toward the first bonding pad and being displaceable in a protruding direction.
摘要:
A multilayer printed circuit board includes a first conductive layer including (i) a first signal ground, (ii) a first frame ground mounted on an external interface component, (iii) a first slit portion that separates the first signal ground and the first frame ground from each other, and (iv) a signal wiring arranged to extend over the first slit portion. A second conductive layer is laminated on the first conductive layer through a dielectric layer. The second conductive layer includes (i) a second signal ground, (ii) a second frame ground, and (iii) a second slit portion that separates the second signal ground and the second frame ground from each other. A first connecting member and a second connecting member connect the second signal ground and the second frame ground to each other. The first connecting member and the second connecting member are arranged along the signal wiring on a different side, such that the first connecting member and the second connecting member sandwich the signal wiring and extend over the second slit portion.
摘要:
A process to manufacture a semiconductor optical modulator is disclosed, in which the process easily forms a metal film including AuZn for the p-ohmic metal even a contact hole has an enhanced aspect ration. The process forms a mesa including semiconductor layers first, then, buries the mesa by a resin layer sandwiched by insulating films. The resin layer provides an opening reaching the top of the mesa, into which the p-ohmic metal is formed. Another metal film including Ti is formed on the upper insulating film along the opening.
摘要:
An image recording apparatus includes an image sensing part for converting an optical image imaged by a photograph lens to an electric signal, a distance measuring part for measuring a distance between a target object and the image recording apparatus, an illumination part for generating an illumination light and a pre-illumination light, a first illumination controlling part for controlling the amount of the illumination light of the illumination part based on the measured distance of the distance measuring part and a F number of the photograph lens, a second illumination controlling part for controlling the amount of the illumination light of the illumination part based on the electric signal output from the image sensing part in correspondence with the pre-illumination light, and a selecting part for selecting one of the first illumination controlling part and the second illumination controlling part.
摘要:
An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power supply voltage to amplifier circuit parts of a power module of a digital cellular phone, is electrically connected to a wiring in an internal layer of the module board through a plurality of via holes. Further, the wiring is electrically connected to an electrode for the supply of the power supply voltage, which is provided on a back surface of the module board. Accordingly, an output characteristic of the semiconductor device is improved.
摘要:
The subject of the invention is to provide a new high-performance flame retardant having excellent flame resistant effect and smoke-suppressing effect and generating no hazardous gas, and a new flame retardant resin-composition used it. As a means for solution, a flame retardant comprising ethylenediamine-containing zinc phosphate and other phosphorus-containing compound is formulated in amounts of 10 to 200 parts by weight to 100 parts by weight of resin.
摘要:
A silicon nitride film containing from 20 to 70% oxygen, for use as a surface passivation film, has enhanced ultraviolet ray transmissivity while exhibiting the desirable moisture proofness quality of a silicon nitride film.
摘要:
Plasma albumin is separated by a crude albumin fraction from blood plasma by a rough fractional separation and then separating plasma albumin through an ultrafiltration membrane. The ultrafiltration membrane is a membrane made of a polysulfone resin having the formula ##STR1## (n=50 to 250).
摘要:
A waste gas exhausted from a chlorination furnace during the manufacture of titanium tetrachloride or zirconium tetrachloride which contains larger quantities of CO.sub.2 and harmful substances such as chlorides and the like is subjected to treatment which comprises the sequential steps of scrubbing the waste gas in a water scrubbing column, removing moisture from the waste gas to allow the waste gas to have a dew point of no more that 5.degree. C., and adsorbing the waste gas in an activated carbon packed column. The process is capable of reducing the content of chlorides in the waste gas to a level of no more than 5 ppm in HCl equivalent.
摘要:
Provided is a multilayer printed circuit board including: a signal ground pattern; a frame ground pattern formed through a slit portion; an external interface component connected to a semiconductor device by a signal wiring extending over the slit portion; and two connecting members having an electrical conductivity arranged symmetrically such that the connecting members sandwich the signal wiring and extend over the slit portion. With this configuration, a return current path is formed between the frame ground pattern and the signal ground pattern, to thereby improve a resistance to exogenous noise such as electrostatic discharge noise, and suppress radiation noise.