公开(公告)号：US06372547B1

公开(公告)日：2002-04-16

申请号：US09038069

申请日：1998-03-11

申请人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

发明人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

IPC分类号： H01L2148

摘要： In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the external connecting electrode can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode and the circuit wiring board. Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring which is conducted to an electrode of a semiconductor device is provided on a surface of an electrical insulating board, and the external connecting electrode for connection to a connecting electrode of the circuit wiring board is provided on a back face of the electrical insulating board. The external connecting electrode has a solder ball made of a conductor, and the resin layer formed on the side portion thereof.

公开(公告)号：US06365499B1

公开(公告)日：2002-04-02

申请号：US09686153

申请日：2000-10-11

申请人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

发明人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012

摘要： In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the external connecting electrode can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode and the circuit wiring board. Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring which is conducted to an electrode of a semiconductor device is provided on a surface of an electrical insulating board, and the external connecting electrode for connection to a connecting electrode of the circuit wiring board is provided on a back face of the electrical insulating board. The external connecting electrode has a solder ball made of a conductor, and the resin layer formed on the side portion thereof.

摘要翻译： 在BGA（球栅阵列），LGA（Land Grid Array）等中，在芯片载体的外部连接电极和电路布线基板之间形成树脂层。 因此，可以防止外部连接电极由于外部连接电极和电路布线板的热膨胀系数之间的差而破裂。 因此，可以提高热冲击试验的可靠性。 导电到半导体器件的电极的连接布线设置在电绝缘板的表面上，并且用于连接到电路布线板的连接电极的外部连接电极设置在电绝缘层的背面 板。 外部连接电极具有由导体制成的焊球，树脂层形成在其侧部。

公开(公告)号：US06229209B1

公开(公告)日：2001-05-08

申请号：US08601293

申请日：1996-02-16

申请人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

发明人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012

摘要： In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the external connecting electrode can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode and the circuit wiring board. Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring which is conducted to an electrode of a semiconductor device is provided on a surface of an electrical insulating board, and the external connecting electrode for connection to a connecting electrode of the circuit wiring board is provided on a back face of the electrical insulating board. The external connecting electrode has a solder ball made of a conductor, and the resin layer formed on the side portion thereof.

摘要翻译： 在BGA（球栅阵列），LGA（Land Grid Array）等中，在芯片载体的外部连接电极和电路布线基板之间形成树脂层。 因此，可以防止外部连接电极由于外部连接电极和电路布线板的热膨胀系数之间的差而破裂。 因此，可以提高热冲击试验的可靠性。 导电到半导体器件的电极的连接布线设置在电绝缘板的表面上，并且用于连接到电路布线板的连接电极的外部连接电极设置在电绝缘层的背面 板。 外部连接电极具有由导体制成的焊球，树脂层形成在其侧部。

公开(公告)号：US20050042795A1

公开(公告)日：2005-02-24

申请号：US10959172

申请日：2004-10-07

申请人： Masahiro Ono ,  Minehiro Itagaki

发明人： Masahiro Ono ,  Minehiro Itagaki

IPC分类号： G02B6/42 ,  H01L21/00 ,  H01L21/48 ,  H01L31/0203 ,  H01L31/062 ,  H01L31/113 ,  H01L33/58 ,  H01L33/62

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4232 ,  H01L24/81 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83874 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.

摘要翻译： 在本发明的光半导体模块中，将光接收光电半导体装置倒装在电路板上，然后将光纤固定在受光光半导体的安装面上，或 该安装面的背面，从而提高了高频特性。

公开(公告)号：US06890789B2

公开(公告)日：2005-05-10

申请号：US10959172

申请日：2004-10-07

申请人： Masahiro Ono ,  Minehiro Itagaki

发明人： Masahiro Ono ,  Minehiro Itagaki

IPC分类号： G02B6/42 ,  H01L21/00 ,  H01L21/48 ,  H01L31/0203 ,  H01L31/062 ,  H01L31/113 ,  H01L33/58 ,  H01L33/62

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4232 ,  H01L24/81 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83874 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.

摘要翻译： 在本发明的光半导体模块中，将光接收光电半导体装置倒装在电路板上，然后将光纤固定在受光光半导体的安装面上，或 该安装面的背面，从而提高了高频特性。

公开(公告)号：US06803639B2

公开(公告)日：2004-10-12

申请号：US10046265

申请日：2002-01-16

申请人： Masahiro Ono ,  Minehiro Itagaki

发明人： Masahiro Ono ,  Minehiro Itagaki

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4232 ,  H01L24/81 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83874 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.

摘要翻译： 在本发明的光半导体模块中，将光接收光电半导体装置倒装在电路板上，然后将光纤固定在受光光半导体的安装面上 该安装面的背面，从而提高了高频特性。

公开(公告)号：US06468448B1

公开(公告)日：2002-10-22

申请号：US09691183

申请日：2000-10-19

申请人： Kazuyoshi Amami ,  Emiko Igaki ,  Minehiro Itagaki

发明人： Kazuyoshi Amami ,  Emiko Igaki ,  Minehiro Itagaki

IPC分类号： H01B106

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/16 ,  H01L24/28 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0769 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A pH adjusting agent is added to a conductive adhesive to prevent the dissolution of a conductive particle to improve the reliability of a mounting structure, wherein when a pH environment is produced in which the conductive particle is easy to dissolve in the surrounding of the conductive adhesive, the pH adjusting agent can change the pH environment to a pH environment in which the conductive particle is resistant to dissolving.

摘要翻译： 向导电性粘合剂中添加pH调节剂以防止导电性粒子的溶解，提高安装结构的可靠性，其中，当产生导电性粒子容易溶解于导电性粘合剂的周围的pH环境时 ，pH调节剂可以将pH环境改变为其中导电颗粒耐溶解的pH环境。