Semiconductor device with vertical trench and lightly doped region
    22.
    发明授权
    Semiconductor device with vertical trench and lightly doped region 失效
    具有垂直沟槽和轻掺杂区域的半导体器件

    公开(公告)号:US07928505B2

    公开(公告)日:2011-04-19

    申请号:US12326392

    申请日:2008-12-02

    摘要: The vertical trench MOSFET comprises: an N type epitaxial region formed on an upper surface of an N+ type substrate having a drain electrode on a lower surface thereof; a gate trench extending from a front surface into the N type epitaxial region; a gate electrode positioned in the gate trench so as to interpose an insulator; a channel region formed on the N type epitaxial region; a source region formed on the channel region; a source electrode formed on the source region; a source trench extending from the front surface into the N type epitaxial region; and a trench-buried source electrode positioned in the source trench so as to interpose an insulator, wherein the source electrode contacts with the trench-buried source electrode.

    摘要翻译: 垂直沟槽MOSFET包括:形成在其下表面上具有漏电极的N +型衬底的上表面上的N型外延区域; 栅极沟槽,其从前表面延伸到N型外延区域; 位于所述栅极沟槽中以便插入绝缘体的栅电极; 形成在N型外延区上的沟道区; 形成在沟道区上的源极区; 形成在源极区上的源电极; 源极沟槽,其从前表面延伸到N型外延区域; 以及位于所述源极沟槽中以便插入绝缘体的沟槽埋入式源电极,其中所述源电极与所述沟槽埋入式源极接触。

    Method of doping impurities into sidewall of trench by use of plasma
source
    25.
    发明授权
    Method of doping impurities into sidewall of trench by use of plasma source 失效
    通过使用等离子体源将杂质掺杂到沟槽的侧壁中的方法

    公开(公告)号:US4861729A

    公开(公告)日:1989-08-29

    申请号:US088216

    申请日:1987-08-24

    IPC分类号: H01L21/223

    CPC分类号: H01L21/2236

    摘要: A method in which in order to dope impurities, with excellent controllability, into a sidewall of a trench formed in a semiconductor substrate, plasma is generated in a gas including the impurities and the semiconductor substrate is disposed in or near the plasma, so that the impurities may be doped into the sidewall of the trench uniformly and at high precision of concentration control; wherein one of a duluted B.sub.2 H.sub.6 gas and diluted AsH.sub.3 gas is chosen as the gas of the plasma, whereby one of B and As as the impurities directly enters the sidewall of the trench without first passing through a film.

    摘要翻译: 为了将具有优异的可控性的杂质掺杂到在半导体衬底中形成的沟槽的侧壁中的方法中,在包括杂质的气体中产生等离子体,并且半导体衬底设置在等离子体中或其附近,使得 杂质可以均匀地并且以高精度的浓度控制被掺杂到沟槽的侧壁中; 其中选择一个掺杂的B2H6气体和稀释的AsH3气体作为等离子体的气体,由此作为杂质的B和As中的一个直接进入沟槽的侧壁,而不首先通过膜。

    Memory system and control method of memory system
    26.
    发明授权
    Memory system and control method of memory system 有权
    内存系统和内存系统的控制方法

    公开(公告)号:US09251055B2

    公开(公告)日:2016-02-02

    申请号:US13599087

    申请日:2012-08-30

    IPC分类号: G06F12/02

    摘要: A memory system in embodiments includes a nonvolatile semiconductor memory that stores user data, a forward lookup address translation table and a reverse lookup address translation table, and a controller. The controller is configured to determine that the user data stored in the nonvolatile semiconductor memory is valid or invalid based on these two tables. The controller may perform data organizing of selecting data determined valid and rewriting the data in a new block. The controller may perform write processing and rewriting processing to the new block alternately at a predetermined ratio. The controller may determine whether a predetermined condition is satisfied on a basis of addresses included in write requests and write data in the MLC mode when the condition is satisfied and write data in the SLC mode when the condition is not satisfied.

    摘要翻译: 实施例中的存储器系统包括存储用户数据的非易失性半导体存储器,正向查找地址转换表和反向查找地址转换表以及控制器。 控制器被配置为基于这两个表来确定存储在非易失性半导体存储器中的用户数据有效或无效。 控制器可以执行数据组织,选择确定有效的数据并在新的块中重写数据。 控制器可以以预定的比例交替地对新的块执行写入处理和重写处理。 当条件满足时,控制器可以基于写入请求中包括的地址和写入数据来确定是否满足预定条件,并且当条件不满足时将控制器写入SLC模式中的数据。

    Semiconductor device and power supply using the same
    28.
    发明授权
    Semiconductor device and power supply using the same 有权
    半导体器件和电源使用相同

    公开(公告)号:US08120345B2

    公开(公告)日:2012-02-21

    申请号:US12388819

    申请日:2009-02-19

    IPC分类号: G05F1/00

    CPC分类号: H02M3/156 H02M2001/0025

    摘要: A semiconductor device for control applied to a constant-voltage power supply device includes a digital-analog converter circuit which outputs a reference voltage corresponding to a value of a first register with taking an output voltage of a reference voltage source as a criterial reference voltage, and generates a control signal for driving a power semiconductor device based on an output voltage of an error amplifier which differentially amplifies a feedback voltage obtained by resistive-dividing on an output voltage of the constant-voltage power supply device and the reference voltage. An analog-digital converter circuit which converts the feedback voltage to a digital value with taking the output voltage of the constant-voltage power supply device as a reference voltage is provided, and based on the output, a value of a first register is corrected so as to offset an effect of an error in voltage dividing ratio of a voltage dividing resistor circuit.

    摘要翻译: 一种应用于恒压电源装置的控制用半导体装置,具备数模转换电路,该数模转换电路以取参考电压源的输出电压作为标准参考电压,输出与第一寄存器的值相对应的基准电压, 并且基于误差放大器的输出电压产生用于驱动功率半导体器件的控制信号,所述误差放大器的差分放大通过对所述恒压电源装置的输出电压进行电阻分压而获得的反馈电压和所述参考电压。 提供了一种模拟数字转换器电路,其将采取恒压电源装置的输出电压的反馈电压转换为数字值作为参考电压,并且基于该输出,第一寄存器的值被校正为 以抵消分压电阻电路的分压比的误差的影响。

    Manufacturing method of thin film transistor including low resistance conductive thin films
    30.
    发明授权
    Manufacturing method of thin film transistor including low resistance conductive thin films 有权
    包括低电阻导电薄膜的薄膜晶体管的制造方法

    公开(公告)号:US07981734B2

    公开(公告)日:2011-07-19

    申请号:US12499559

    申请日:2009-07-08

    IPC分类号: H01L21/302

    摘要: A manufacturing method of a thin film transistor includes forming a pair of source/drain electrodes on a substrate, such that the source/drain electrodes define a gap therebetween; forming low resistance conductive thin films, which define a gap therebetween, on the source/drain electrodes; and forming an oxide semiconductor thin film layer on upper surface of the low resistance conductive thin films and in the gap defined between the low resistance conductive thin films so that the oxide semiconductor thin film layer functions as a channel. The low resistance conductive thin films and the oxide semiconductor thin film layer are etched so that side surfaces of the resistance conductive thin films and corresponding side surfaces of the oxide semiconductor thin film layer coincide with each other in a channel width direction of the channel. A gate electrode is mounted over the oxide semiconductor thin film layer.

    摘要翻译: 薄膜晶体管的制造方法包括在基板上形成一对源极/漏极,使得源极/漏极在其间限定间隙; 在源/漏电极上形成限定它们之间的间隙的低电阻导电薄膜; 以及在低电阻导电薄膜的上表面和限定在低电阻导电薄膜之间的间隙中形成氧化物半导体薄膜层,使得氧化物半导体薄膜层用作沟道。 蚀刻低电阻导电薄膜和氧化物半导体薄膜层,使得电阻导电薄膜的侧表面和氧化物半导体薄膜层的相应侧表面在沟道的沟道宽度方向上彼此重合。 栅电极安装在氧化物半导体薄膜层上。