公开(公告)号：US20120066902A1

公开(公告)日：2012-03-22

申请号：US13301063

申请日：2011-11-21

申请人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

发明人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

IPC分类号： H05K3/10

CPC分类号： H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land.

摘要翻译： 一种制造印刷电路板的方法，包括：制备双面基板，其包括绝缘层，形成在所述绝缘层的一侧上的第一铜层和形成在所述绝缘层的另一侧上的第二铜层; 通过所述第二铜层和所述绝缘层形成通孔; 在所述通孔的内壁上形成镀层; 并且在双面基板上形成通孔，包括形成在具有最小直径并且具有小于通孔的最小直径的线宽度的通孔的表面上的电路图案的第一电路层，以及 第二电路层包括较低的焊盘。

公开(公告)号：US20100175915A1

公开(公告)日：2010-07-15

申请号：US12385003

申请日：2009-03-27

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/00 ,  H05K3/34

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom.

摘要翻译： 本发明涉及一种印刷电路板及印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并具有嵌入绝缘层中的连接焊盘，例如 连接焊盘的一侧与绝缘层的表面齐平，以及被配置为保护电路层免受外部环境的绝缘材料，并具有连接焊盘暴露的开口。 本发明使得印刷电路板变薄，提高了可靠性和设计自由度。

公开(公告)号：US20110061907A1

公开(公告)日：2011-03-17

申请号：US12654538

申请日：2009-12-22

申请人： Myung Sam Kang ,  Chang Sup Ryu

发明人： Myung Sam Kang ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K1/11 ,  C25D5/02 ,  B32B38/00

CPC分类号： C25D5/022 ,  C25D7/12 ,  H05K3/0035 ,  H05K3/242 ,  H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  H05K2203/0577 ,  H05K2203/1581

摘要： A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

摘要翻译： 根据本发明的一个方面的印刷电路板可以包括：具有设置在其表面上的电极部分的板部分; 阻焊层，设置在基板部分的表面上，并且在其中具有开口以将电极部分暴露于外部; 以及具有与开口相同直径并且提供与外部芯片部件的电连接的凸块层。

公开(公告)号：US07583512B2

公开(公告)日：2009-09-01

申请号：US12023616

申请日：2008-01-31

申请人： Chang Sup Ryu ,  Myung Sam Kang

发明人： Chang Sup Ryu ,  Myung Sam Kang

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

摘要翻译： 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US07277005B2

公开(公告)日：2007-10-02

申请号：US11022074

申请日：2004-12-22

申请人： Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

发明人： Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C17/065 ,  H01C17/0652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/42 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09645 ,  H05K2203/1476

摘要： Disclosed is a PCB including an embedded resistor and a method of fabricating the same. The PCB includes a plurality of circuit layers in which circuit patterns are formed. A plurality of insulating layers is each interposed between the circuit layers. The embedded resistor is made of a resistive material and received in a receiving hole formed in the plurality of circuit layers and the plurality of insulating layers such that walls defining the receiving hole extends from one of the circuit layers to another circuit layer. The receiving hole has a closed section, and a conductive material is plated on the opposite walls of the walls defining the receiving hole.

摘要翻译： 公开了一种包括嵌入式电阻器的PCB及其制造方法。 PCB包括形成电路图案的多个电路层。 在电路层之间分别插入多个绝缘层。 嵌入式电阻器由电阻材料制成并且被容纳在形成在多个电路层和多个绝缘层中的接收孔中，使得限定接收孔的壁从电路层之一延伸到另一个电路层。 接收孔具有闭合部分，并且导电材料被电镀在限定接收孔的壁的相对壁上。

公开(公告)号：US20080123308A1

公开(公告)日：2008-05-29

申请号：US12023616

申请日：2008-01-31

申请人： Chang Sup Ryu ,  Myung Sam Kang

发明人： Chang Sup Ryu ,  Myung Sam Kang

IPC分类号： H05K7/06

CPC分类号： H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

摘要翻译： 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US07350296B2

公开(公告)日：2008-04-01

申请号：US11020466

申请日：2004-12-22

申请人： Chang Sup Ryu ,  Myung Sam Kang

发明人： Chang Sup Ryu ,  Myung Sam Kang

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

摘要翻译： 公开了一种制造包括嵌入式无源元件的PCB的方法及其制造方法及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US20090147488A1

公开(公告)日：2009-06-11

申请号：US12367768

申请日：2009-02-09

申请人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

发明人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

IPC分类号： H05K7/00

CPC分类号： H05K1/183 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/10734 ,  H05K2203/1394 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

公开(公告)号：US07506437B2

公开(公告)日：2009-03-24

申请号：US11128852

申请日：2005-05-13

申请人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

发明人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/183 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/10734 ,  H05K2203/1394 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

摘要翻译： 公开了一种印刷电路板（PCB）及其制造方法。 接触部分形成在多层PCB的内层上。 形成凹槽以暴露内层的接触部分。 芯片封装安装在PCB上，同时倒装芯片结合到内层的暴露的接触部分。

公开(公告)号：US20080314621A1

公开(公告)日：2008-12-25

申请号：US12213114

申请日：2008-06-13

申请人： Jin-Yong Ahn ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Joon Sung Kim ,  Han Seo Cho

发明人： Jin-Yong Ahn ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Joon Sung Kim ,  Han Seo Cho

IPC分类号： H05K3/20 ,  H01L21/00

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3512 ,  H05K1/185 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/063 ,  H05K2203/1189 ,  Y02P70/611 ,  Y10T29/49128

摘要： A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.

摘要翻译： 公开了一种并行芯片嵌入式印刷电路板及其制造方法。 利用制造并联芯片嵌入式印刷电路板的方法，其特征在于包括：（a）通过使用至少一个电容器形成平行芯片来并联连接多个单元芯片，所述多个单元芯片具有形成在其上表面和下表面上的电极或电连接构件 导电构件; （b）将平行芯片一侧的电极连接到第一板上; 和（c）将平行芯片的另一侧的电极连接到第二板，由于可以一次嵌入多个单元芯片，因此可以以低成本将芯片嵌入印刷电路板中，并且机械钻 或者可以使用路由器代替激光钻孔来对空腔或通孔进行穿孔。