公开(公告)号：US10020292B2

公开(公告)日：2018-07-10

申请号：US15508511

申请日：2015-08-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ion Stoll ,  David Racz ,  Markus Schneider

IPC: H01L29/20 ,  H01L25/075 ,  H01L33/50 ,  H04M1/21 ,  H05B33/08 ,  H05B37/02

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H04M1/21 ,  H05B33/0872 ,  H05B37/0218 ,  H01L2924/00

Abstract: Optoelectronic semiconductor component includes at least four different light sources each including at least one optoelectronic semiconductor chip, which during operation emit radiation having mutually different color loci in the CIE standard chromaticity diagram, wherein the semiconductor component is designed to emit white or colored light having a variable correlated color temperature during operation.

公开(公告)号：US20180114887A1

公开(公告)日：2018-04-26

申请号：US15573466

申请日：2016-05-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  David O'Brien ,  David Racz

IPC: H01L33/60 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L21/568 ,  H01L33/005 ,  H01L33/46 ,  H01L33/50 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2924/18162 ,  H01L2933/0025 ,  H01L2933/0058

Abstract: A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.

公开(公告)号：US11967668B2

公开(公告)日：2024-04-23

申请号：US17283493

申请日：2019-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Zeljko Pajkic ,  David Racz ,  Luca Haiberger

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/502 ,  H01L33/0093 ,  H01L33/52 ,  H01L33/62

Abstract: The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.

公开(公告)号：US20210399180A1

公开(公告)日：2021-12-23

申请号：US17283493

申请日：2019-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Zeljko Pajkic ,  David Racz ,  Luca Haiberger

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/62

Abstract: The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.

公开(公告)号：US10944033B2

公开(公告)日：2021-03-09

申请号：US16066552

申请日：2017-01-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  David Racz ,  Matthias Sperl

IPC: H01L33/00 ,  H01L33/62 ,  H01L31/024 ,  H01L33/64 ,  H01L31/0224 ,  H01L31/02 ,  H01L33/38 ,  H01L33/54 ,  H01L31/0304 ,  H01L31/0352 ,  H01L33/06 ,  H01L33/30

Abstract: An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.

公开(公告)号：US20190148606A1

公开(公告)日：2019-05-16

申请号：US16098172

申请日：2017-05-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David Racz ,  Matthias Sperl

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/46 ,  H01L33/36 ,  H01L33/54

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes providing at least one light-emitting semiconductor chip comprising a sapphire substrate and an epitaxially grown layer sequence, arranging the light-emitting semiconductor chip with a side facing away from the sapphire substrate on a carrier, detaching the sapphire substrate from the semiconductor chip, applying a converter element on a region of the semiconductor chip in which the sapphire substrate was detached, arranging the semiconductor chip on an auxiliary carrier so that the converter element faces the auxiliary carrier and detaching the carrier from the semiconductor chip.

公开(公告)号：US20170288108A1

公开(公告)日：2017-10-05

申请号：US15507767

申请日：2015-08-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Schumann ,  Tobias Gebuhr ,  David Racz ,  Matthias Sperl

IPC: H01L33/62 ,  H01L33/50 ,  H05K3/32 ,  H01L33/58 ,  H05K1/18 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/05555 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/18 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein the light-emitting diode is at least partly enclosed by molding by a potting compound.

公开(公告)号：US20170278829A1

公开(公告)日：2017-09-28

申请号：US15508511

申请日：2015-08-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ion Stoll ,  David Racz ,  Markus Schneider

IPC: H01L25/075 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H04M1/21 ,  H05B33/0872 ,  H05B37/0218 ,  H01L2924/00

Abstract: Optoelectronic semiconductor component includes at least four different light sources each including at least one optoelectronic semiconductor chip, which during operation emit radiation having mutually different colour loci in the CIE standard chromaticity diagram, wherein the semiconductor component is designed to emit white or coloured light having a variable correlated colour temperature during operation.

公开(公告)号：US20170263829A1

公开(公告)日：2017-09-14

申请号：US15509505

申请日：2015-09-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Georg Bogner

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.