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公开(公告)号：US09972427B2
公开(公告)日：2018-05-15
申请号：US15271882
申请日：2016-09-21
Applicant: ROHM CO., LTD.
Inventor： Yasuhiro Kondo , Hiroshi Tamagawa , Hiroki Yamamoto
IPC: H01C10/00 , H01C13/02 , H01C1/14 , H01C17/06 , H01G4/40 , H01G2/16 , H01C10/50 , H01C17/00 , H01F27/40 , H01G5/38 , H01L27/02 , H01L27/08 , H01F29/00 , H01G5/019 , H01L23/525 , H01L49/02
CPC classification number: H01C13/02 , H01C1/14 , H01C10/50 , H01C17/006 , H01C17/06 , H01F27/402 , H01F29/00 , H01G2/16 , H01G4/40 , H01G5/019 , H01G5/38 , H01L23/5256 , H01L27/0207 , H01L27/0814 , H01L28/20 , H01L2224/16225 , Y10T29/49099
Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
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公开(公告)号：US20140354396A1
公开(公告)日：2014-12-04
申请号：US14368757
申请日：2012-12-18
Applicant: ROHM CO., LTD.
Inventor： Eiji Nukaga , Hiroshi Tamagawa , Yasuhiro Kondo , Katsuya Matsuura
CPC classification number: H01C17/006 , H01C7/00 , H01C7/006 , H01C13/02 , H01C17/06 , H01C17/08 , H01C17/242 , H01F27/402 , H01G2/065 , H01G4/38 , H01G4/40 , H01L21/3065 , H01L21/78 , H01L23/5256 , H01L23/528 , H01L29/6609 , H01L29/861 , Y10T29/49082
Abstract: [Subject] To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor.[Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.
Abstract translation: 提供一种片状电阻器，其没有其拐角部分的碎裂以及制造芯片电阻器的方法。 芯片电阻器（1）包括：具有器件形成表面（2A）的板（2），与器件形成表面（2A）相对的后表面（2B）和连接器件形成表面的侧表面（2C-2F） 装置形成面（2A）到背面（2B），设置在器件形成面（2A）上的电阻部（56），设置在器件形成上的第一连接电极（3）和第二连接电极（4） 表面（2A）并与电阻部分（56）电连接;以及第一连接电极（3）和第二连接电极（4）暴露于其上的覆盖器件形成表面（2A）的树脂膜（24）。 背面（2B）与侧面（2C-2F）相交的板（2）的交叉部分（11）各自具有圆形。
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23.发明申请公开(公告)号：US20140225220A1
公开(公告)日：2014-08-14
申请号：US14348581
申请日：2012-09-28
Applicant: ROHM CO., LTD.
Inventor： Hiroshi Tamagawa , Yasuhiro Kondo , Yasuhiro Fuwa , Hiroyuki Okada , Eiji Nukaga , Katsuya Matsuura
IPC: H01L27/06
CPC classification number: H01L28/20 , H01C1/14 , H01C13/02 , H01C17/006 , H01C17/242 , H01L21/3065 , H01L21/3083 , H01L27/0676 , H01L27/0802 , H05K3/3431 , H05K2201/10674
Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired.[Solution Means] A chip resistor 10 is arranged to have a resistor network 14 on a substrate. The resistor network 14 includes a plurality of resistor bodies R arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies R being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films C and fuse films F. By selectively fusing a fuse film F, a resistance unit can be electrically incorporated into the resistor network 14 or electrically separated from the resistor network to make the resistance value of the resistor network 14 the required resistance value.
Abstract translation: [主题]希望具有相同设计结构容易地容纳多种类型的所需电阻值的紧凑且精细的芯片电阻器。 [解决方案]芯片电阻器10布置成在基板上具有电阻网络14。 电阻网络14包括排列成矩阵并具有相等电阻值的多个电阻体R。 多个电阻单元分别由电连接的一个或多个电阻体R布置。 多种类型的电阻单元使用连接导体膜C和熔丝膜F以预定模式连接。通过选择性地熔化熔丝F，电阻单元可以电连接到电阻器网络14中或与电阻器网络电分离 使电阻网络14的电阻值成为所需电阻值。
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公开(公告)号：US10763016B2
公开(公告)日：2020-09-01
申请号：US16231937
申请日：2018-12-24
Applicant: ROHM CO., LTD.
Inventor： Hiroshi Tamagawa , Hiroki Yamamoto , Katsuya Matsuura , Yasuhiro Kondo
IPC: H01C1/14 , H01G5/38 , H01G2/16 , H01F27/40 , H01F27/28 , H01C10/50 , H01C10/16 , H01G5/011 , H01L27/08 , H01C17/00 , H01C17/23 , H05K3/34 , H01L33/62 , H01G4/38 , H01G4/40 , H01L25/10 , H01L25/13 , H01L27/15 , H01G4/33 , H01G5/40 , H05K1/18 , H01F29/08 , H01F41/04 , H01L23/00 , H01F29/00 , H01F17/00
Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
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公开(公告)号：US10200007B2
公开(公告)日：2019-02-05
申请号：US15212221
申请日：2016-07-16
Applicant: ROHM CO., LTD.
Inventor： Keisuke Fukae , Yasuhiro Kondo , Katsuya Matsuura , Hiroyuki Okada , Junya Yamagami
Abstract: A filter chip includes a substrate, a plurality of external terminals formed on the substrate for external connection, and a plurality of passive element forming regions provided in the regions between the plurality of external terminals in plan view when viewed along a direction normal to the surface of the substrate, the plurality of passive element forming regions including at least a resistor forming region where a resistor is formed. The resistor forming region includes a resistive conductive film formed on the substrate with one end and the other end thereof electrically connected to different ones of the external terminals, and a fuse portion integrally formed with the resistive conductive film. The fuse portion is cuttably provided to electrically connect a part of the resistive conductive film to the external terminals, or to electrically separate a part of the resistive conductive film from the external terminals.
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Patent Agency Ranking
公开(公告)号：US09773588B2
公开(公告)日：2017-09-26
申请号：US14713684
申请日：2015-05-15
Applicant: ROHM CO., LTD.
Inventor： Takuma Shimoichi , Yasuhiro Kondo , Keishi Watanabe , Takamichi Torii , Katsuya Matsuura
CPC classification number: H01C1/01 , H01C1/02 , H01C1/14 , H01C1/142 , H01C7/006 , H01C13/02 , H01C17/267 , H01F17/0006 , H01F27/2804 , H01F27/292 , H01F2017/0026 , H01G4/228 , H01G4/30 , H01G4/33 , H01L23/5228 , H01L23/647 , H01L28/20 , H05K1/0293 , H05K1/162 , H05K1/165 , H05K1/167
Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.
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公开(公告)号：US09735225B2
公开(公告)日：2017-08-15
申请号：US14956939
申请日：2015-12-02
Applicant: ROHM CO., LTD.
Inventor： Hiroshi Tamagawa , Yasuhiro Kondo , Yasuhiro Fuwa , Hiroyuki Okada , Eiji Nukaga , Katsuya Matsuura
IPC: H01C10/00 , H01L49/02 , H01L27/08 , H01L27/06 , H01L21/308 , H01C1/14 , H01C13/02 , H01L21/3065 , H01C17/242 , H01C17/00 , H05K3/34
CPC classification number: H01L28/20 , H01C1/14 , H01C13/02 , H01C17/006 , H01C17/242 , H01L21/3065 , H01L21/3083 , H01L27/0676 , H01L27/0802 , H05K3/3431 , H05K2201/10674
Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
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公开(公告)号：US09583238B2
公开(公告)日：2017-02-28
申请号：US14431771
申请日：2013-08-07
Applicant: ROHM CO., LTD.
Inventor： Yasuhiro Kondo , Katsuya Matsuura
IPC: H01C10/00 , H01C1/012 , H01C1/14 , H01G2/06 , H01G4/228 , H01G5/01 , H01G4/30 , H01C7/00 , H01C17/06 , H01G4/008
CPC classification number: H01C1/012 , H01C1/14 , H01C1/16 , H01C7/003 , H01C17/06 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/228 , H01G4/30 , H01G4/40 , H01G5/01 , H05K1/181
Abstract: A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
Abstract translation: 根据本发明的芯片部件包括具有前表面和侧表面的基板，一体地形成在前表面和侧表面上以覆盖基板的前表面的边缘部分的电极和绝缘体 介于电极和基板之间的膜。 根据本发明的电路组件包括根据本发明的芯片部件和安装基板，该安装基板具有在与基板的前表面相对的安装表面上的焊料与电极接合的焊盘。
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公开(公告)号：US20150243412A1
公开(公告)日：2015-08-27
申请号：US14431771
申请日：2013-08-07
Applicant: ROHM CO., LTD.
Inventor： Yasuhiro Kondo , Katsuya Matsuura
CPC classification number: H01C1/012 , H01C1/14 , H01C1/16 , H01C7/003 , H01C17/06 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/228 , H01G4/30 , H01G4/40 , H01G5/01 , H05K1/181
Abstract: A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
Abstract translation: 根据本发明的芯片部件包括具有前表面和侧表面的基板，一体地形成在前表面和侧表面上以覆盖基板的前表面的边缘部分的电极和绝缘体 介于电极和基板之间的膜。 根据本发明的电路组件包括根据本发明的芯片部件和安装基板，该安装基板具有在与基板的前表面相对的安装表面上的焊料与电极接合的焊盘。
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公开(公告)号：US20150034981A1
公开(公告)日：2015-02-05
申请号：US14373900
申请日：2012-12-26
Applicant: ROHM CO., LTD.
Inventor： Hiroshi Tamagawa , Hiroki Yamamoto , Katsuya Matsuura , Yasuhiro Kondo
IPC: H01C10/50 , H01G5/38 , H01G5/40 , H01F29/00 , H01F27/40 , H01L25/10 , H01G5/011 , H01C1/14 , H01L27/15 , H01L33/62 , H01L25/13 , H01C10/16 , H01F27/28
CPC classification number: H01C1/14 , H01C10/16 , H01C10/50 , H01C17/006 , H01C17/23 , H01F17/0006 , H01F27/2804 , H01F27/40 , H01F29/00 , H01F29/08 , H01F41/041 , H01G2/16 , H01G4/33 , H01G4/38 , H01G4/40 , H01G5/011 , H01G5/38 , H01G5/40 , H01L24/32 , H01L25/105 , H01L25/13 , H01L27/0802 , H01L27/15 , H01L33/62 , H01L2221/68304 , H01L2224/16225 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H05K1/181 , H05K3/3442 , H05K3/3478 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10212 , H05K2203/0415 , Y02P70/613 , H01L2924/00
Abstract: [Problem] There is a need for a chip component which has excellent mountability, which can accommodate multiple types of requested values with a common basic design, and which has improved geometric accuracy and micromachining accuracy.[Solution] A chip resistor (10) (chip component) which includes: a substrate (11); an element circuit network (20, 21) which includes multiple element parts formed on the substrate (11); an external connection electrode (12) provided on the substrate (11) for external connection to the element circuit network (20, 21); multiple fuses provided on the substrate (11) for detachably connecting the element parts and the external connection electrode (12); and a solder layer (124) formed on the external connection terminal of the external connection electrode (12).[Effect] Because the external connection electrode (12) provided on the chip resistor (10) includes a solder layer (124) on the outside connection terminal, during mounting of the chip resistor (10), the chip resistor (10) can be easily mounted without solder printing. Further, the amount of solder used for mounting is decreased, and chip resistors (10) can be achieved in which solder extrusions do not occur and which can be mounted with high density.
Abstract translation: [问题]需要具有优异的安装性的芯片部件，其可以容纳具有通用基本设计的多种类型的请求值，并且具有改进的几何精度和微加工精度。 [解决方案]芯片电阻器（10）（芯片部件），其包括：基板（11）; 元件电路网络（20,21），其包括形成在所述基板（11）上的多个元件部分; 设置在所述基板（11）上用于与所述元件电路网络（20,21）外部连接的外部连接电极（12）。 设置在基板（11）上的用于可拆卸地连接元件部分和外部连接电极（12）的多个熔丝; 以及形成在外部连接电极（12）的外部连接端子上的焊料层（124）。 [效果]由于设置在片式电阻器（10）上的外部连接电极（12）在外部连接端子上包括焊料层（124），所以在安装芯片电阻器（10）期间，芯片电阻器（10）可以 容易安装，无需焊锡印刷。 此外，用于安装的焊料的量减少，并且可以实现不会发生焊料挤出并且可以以高密度安装的芯片电阻器（10）。
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