公开(公告)号：US12215266B2

公开(公告)日：2025-02-04

申请号：US18354182

申请日：2023-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki Kim ,  Shin Ae Jun ,  Eun Joo Jang ,  Yongwook Kim ,  Tae Gon Kim ,  Yuho Won ,  Taekhoon Kim ,  Hyo Sook Jang

IPC: C09K11/88 ,  C09K11/02 ,  C09K11/56 ,  C09K11/61 ,  C09K11/70 ,  C09K11/72 ,  H01L29/06 ,  H01L29/22 ,  H01L33/50 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide.

公开(公告)号：US12159009B2

公开(公告)日：2024-12-03

申请号：US17713733

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changmin Han ,  Hyunki Kim ,  Huijun Shim ,  Jaekwang Lee

IPC: G06F3/042

Abstract: A touch display apparatus is provided. The touch display apparatus includes a display panel including a display surface, a light guide plate disposed over the display surface of the display panel and formed to emit light incident into one side surface of the light guide plate through an upper surface of the light guide plate, a first light source array disposed on one side of the light guide plate and including a plurality of infrared light sources configured to emit infrared rays to an one side surface of the light guide plate, a camera disposed on at least one side of the first light source array and configured to photograph infrared rays emitted through an entire area of the upper surface of the light guide plate, and a processor configured to recognize coordinates of an input object adjacent to the upper surface of the light guide plate using infrared rays images captured by the camera.

公开(公告)号：US11746290B2

公开(公告)日：2023-09-05

申请号：US15830134

申请日：2017-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki Kim ,  Shin Ae Jun ,  Eun Joo Jang ,  Yongwook Kim ,  Tae Gon Kim ,  Yuho Won ,  Taekhoon Kim ,  Hyo Sook Jang

IPC: C09K11/61 ,  C09K11/72 ,  C09K11/70 ,  C09K11/56 ,  C09K11/62 ,  C09K11/88 ,  H01L33/50 ,  H01L29/06 ,  H01L29/22 ,  C09K11/02 ,  B82Y40/00 ,  B82Y20/00 ,  B82Y30/00

CPC classification number: C09K11/883 ,  C09K11/025 ,  C09K11/565 ,  C09K11/61 ,  C09K11/612 ,  C09K11/70 ,  C09K11/705 ,  C09K11/72 ,  C09K11/722 ,  C09K11/88 ,  H01L29/0665 ,  H01L29/22 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L33/502 ,  Y10S977/774 ,  Y10S977/818 ,  Y10S977/824 ,  Y10S977/825 ,  Y10S977/892 ,  Y10S977/896 ,  Y10S977/95

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide.

公开(公告)号：US11527303B2

公开(公告)日：2022-12-13

申请号：US16890559

申请日：2020-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yesin Ryu ,  Yoonna Oh ,  Hyunki Kim

IPC: G11C29/00 ,  G06F11/20 ,  G06F12/10 ,  G11C17/16 ,  G11C17/18

Abstract: A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

公开(公告)号：US11133296B2

公开(公告)日：2021-09-28

申请号：US16698749

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chanhee Jeong ,  Hyunki Kim ,  Junwoo Park ,  Byoung Wook Jang ,  Sunchul Kim ,  Su-Min Park ,  Pyoungwan Kim ,  Inku Kang ,  Heeyeol Kim

IPC: H01L25/10 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498

Abstract: A semiconductor package includes a semiconductor chip disposed on a first substrate, a mold layer covering a sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal disposed between the first substrate and the second substrate and provided in the through-hole, and an underfill resin layer extending from between the semiconductor chip and the second substrate into the through-hole.

公开(公告)号：US20200027818A1

公开(公告)日：2020-01-23

申请号：US16285480

申请日：2019-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunki Kim ,  Sangsoo Kim ,  Seung Hwan Kim ,  Kyung Suk Oh ,  Yongkwan Lee ,  Jongho Lee

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/367 ,  H01L23/00

Abstract: Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.

公开(公告)号：US10361177B2

公开(公告)日：2019-07-23

申请号：US15960698

申请日：2018-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Young Kim ,  Pyoungwan Kim ,  Hyunki Kim ,  Junwoo Park ,  Sangsoo Kim ,  Seung Hwan Kim ,  Sung-Kyu Park ,  Insup Shin

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower substrate, a lower molding layer covering the lower semiconductor chip on the lower substrate and including a molding cavity that extends toward the lower semiconductor chip from a top surface of the lower molding layer, an interposer substrate on the top surface of the lower molding layer and including a substrate opening that penetrates the interposer substrate and overlaps the molding cavity, and an upper package on the interposer substrate. The molding cavity has a floor surface spaced apart from the upper package across a substantially hollow space.

公开(公告)号：US20180094190A1

公开(公告)日：2018-04-05

申请号：US15830134

申请日：2017-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki Kim ,  Shin Ae Jun ,  Eun Joo Jang ,  Yongwook Kim ,  Tae Gon Kim ,  Yuho Won ,  Taekhoon Kim ,  Hyo Sook Jang

IPC: C09K11/88 ,  C09K11/72 ,  H01L29/06 ,  H01L29/22

CPC classification number: C09K11/883 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09K11/025 ,  C09K11/565 ,  C09K11/61 ,  C09K11/612 ,  C09K11/70 ,  C09K11/705 ,  C09K11/72 ,  C09K11/722 ,  C09K11/88 ,  H01L29/0665 ,  H01L29/22 ,  H01L33/502 ,  Y10S977/774 ,  Y10S977/818 ,  Y10S977/824 ,  Y10S977/825 ,  Y10S977/892 ,  Y10S977/896 ,  Y10S977/95

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide

公开(公告)号：US09834724B2

公开(公告)日：2017-12-05

申请号：US14494673

申请日：2014-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki Kim ,  Shin Ae Jun ,  Eun Joo Jang ,  Yongwook Kim ,  Tae Gon Kim ,  Yuho Won ,  Taekhoon Kim ,  Hyo Sook Jang

IPC: C09K11/70 ,  C09K11/61 ,  C09K11/88 ,  C09K11/02 ,  C09K11/56 ,  B82Y40/00 ,  B82Y20/00

CPC classification number: C09K11/883 ,  B82Y20/00 ,  B82Y40/00 ,  C09K11/025 ,  C09K11/565 ,  C09K11/61 ,  C09K11/612 ,  C09K11/70 ,  C09K11/705 ,  C09K11/88 ,  Y10S977/774 ,  Y10S977/892 ,  Y10S977/95

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide.

公开(公告)号：US09112062B2

公开(公告)日：2015-08-18

申请号：US13974254

申请日：2013-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： JiSun Hong ,  Hyunki Kim ,  JongBo Shim ,  SeokWon Lee ,  Kyoungsei Choi

IPC: H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the first and second semiconductor packages. The molding pattern extends to cover at least a portion of a sidewall of only the second semiconductor package.

Abstract translation: 一种半导体器件包括：第一半导体封装，包括第一模具部件，包括第二模具部件的第二半导体封装，被配置为使第一和第二半导体封装彼此电连接的连接图案;以及第一和第二半导体封装之间的模制图案 半导体封装。 模制图案延伸以覆盖仅第二半导体封装的侧壁的至少一部分。